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Philips Semiconductors
UHF amplifier module
PACKAGE OUTLINE
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
y
E
L
DIMENSIONS (mm are the original dimensions)
UNIT
A
b p
c
9.5
0.56
0.3
mm
9.0
0.46
0.2
OUTLINE
VERSION
SOT365A
2000 Oct 17
D
U
q
1
2
e 1
e
D
E
e
e 1
F
30.1
18.6
3.25
2.54
17.78
29.9
18.4
3.15
REFERENCES
IEC
JEDEC
3 4
b p
w
M
e
Z
0
10
20 mm
scale
L
p
Q
q
6.5
4.1
4.0
40.74
48.0
3.8
6.1
3.9
40.54
48.4
EIAJ
7
A
F
A
U 2
p
U 1
v A
U
U 1
U 2
v
w
15.4
7.75
0.3
0.25
15.2
7.55
EUROPEAN
PROJECTION
Product specification
BGY2016
SOT365A
c
Q
y
Z
12.8
0.1
12.6
ISSUE DATE
99-02-06
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