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Philips Semiconductors
UHF amplifier module
APPLICATION INFORMATION
handbook, full pagewidth
List of components (See Figs 2 and 3)
COMPONENT
C1, C2
electrolytic capacitor
C3, C4
multilayer ceramic chip capacitor
C5, C6
multilayer ceramic chip capacitor
C7, C8
multilayer ceramic chip capacitor
L1, L2
Grade 4S2 Ferroxcube bead
R1, R2
metal film resistor
Z
, Z
stripline; note 1
1
2
Note
1. The striplines are on a double copper-clad printed-circuit board (RO5880) with
2000 Oct 17
C7
C5
Z 1
R1
L1
C3
C1
50
V S1
input
Fig.2 Test circuit.
DESCRIPTION
C8
C6
R2
L2
C4
C2
V S2
50
output
MGM861
VALUE
10 F; 35 V
10 nF; 50 V
100 pF; 50 V
10 pF; 50 V
10 ; 0.4 W
50
4
Product specification
BGY2016
Z 2
CATALOGUE NO.
4330 030 36300
2322 195 13109
= 2.2 and thickness = 0.79 mm.
r
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