HP ProLiant ML150 Gen9 Maintenance And Service Manual
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HP ProLiant ML150 Gen9 Maintenance And Service Manual

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HPE ProLiant ML150 Gen9 Server
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware
components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified
in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 781742-004R
November 2015
Edition: 5

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Summary of Contents for HP ProLiant ML150 Gen9

  • Page 1 HPE ProLiant ML150 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
  • Page 2 © Copyright 2015 Hewlett Packard Enterprise Development LP The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty.

  • Page 3: Table Of Contents

    HPE 550 W power supply ............................56 HPE 800 W/900 W Gold AC Power Input Module ....................57 HPE Redundant Power Supply Backplane ......................58 HP Trusted Platform Module ..........................59 Troubleshooting ........................... 60 Troubleshooting resources ............................. 60 Diagnostic tools ........................... 61 HPE UEFI System Utilities .............................
  • Page 4 Re-entering the server serial number and product ID ................. 63 HPE ProLiant Pre-boot Health Summary ....................... 63 HPE Insight Diagnostics ............................64 HPE Insight Diagnostics survey functionality ....................64 Active Health System ............................. 64 Integrated Management Log ..........................65 USB support ................................65 External USB functionality ...........................

  • Page 5: Customer Self Repair

    Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
  • Page 6 • Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
  • Page 7 NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
  • Page 8 Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
  • Page 9 deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución.
  • Page 10 Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise.
  • Page 11 Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair). Serviço de garantia apenas para peças A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças.
  • Page 12 Customer self repair 12...
  • Page 13 Customer self repair 13...
  • Page 14 Customer self repair 14...

  • Page 15: Illustrated Parts Catalog

    Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part number Customer self repair (on page 5) LFF drive carrier 732593-001 Optional...
  • Page 16 Obbligatorio—Parti per le quali il cliente è tenuto a effettuare autonomamente la riparazione. Se si richiede l'intervento di Hewlett Packard Enterprise per la sostituzione di queste parti, al cliente verranno addebitate le spese di viaggio e manodopera dell'operazione. Facoltativo—Parti per le quali la riparazione in autonomia da parte del cliente è facoltativa. Queste parti sono progettate per consentire anche la riparazione da parte del cliente.

  • Page 17: System Components

    System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part Customer self number repair (on page HPE 550 W power supply 766879-001 Optional Illustrated parts catalog 17...
  • Page 18 HPE 800 W / 900 W Gold AC Power Input Module 754376-001 Mandatory HPE RPS backplane 784636-001 Optional Optional Front cable kit 792355-001 a) Front panel USB — — — b) Front panel LED — 4 LFF hot-plug drive cage 792351-001 Optional Optional...
  • Page 19 No—Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations.
  • Page 20 Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. Não—Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente.

  • Page 21: Removal And Replacement Procedures

    Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver (included with the server) • HPE Insight Diagnostics software ("HPE Insight Diagnostics" on page 64) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.

  • Page 22: Server Warnings And Cautions

    This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

  • Page 23: Remove The Tower Bezel

    • Remove the system air baffle (on page 24). • If installed, remove the PCI air baffle (on page 25). • Remove the fans (on page 25). Remove the tower bezel Using the key provided with the server, unlock the bezel with a clockwise turn. Remove the tower bezel.

  • Page 24: Remove The Access Panel

    Remove the access panel WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: For proper cooling do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed.

  • Page 25: Remove The Pci Air Baffle

    Remove the system air baffle. Remove the PCI air baffle Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
  • Page 26 CAUTION: To prevent damage to the server, ensure that all DIMM latches are in closed and locked position before installing the fans. To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source.

  • Page 27: Storage Drive

    Two-processor configuration To replace the component, reverse the removal procedure. Storage drive Hot-plug drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Unlock and remove the tower bezel ("Remove the tower...

  • Page 28: Non-Hot-Plug Drive

    CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive. Unlock and remove the tower bezel ("Remove the tower bezel"...
  • Page 29 Box 2 Box 1 Removal and replacement procedures 29...

  • Page 30: Front Panel Led

    Remove the non-hot-plug drive. To replace the component, reverse the removal procedure. Front panel LED To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source.

  • Page 31: Front Panel Usb

    Disconnect the front LED cable from the system board. Remove the front panel LED module: Remove the front panel LED module screw. Pull the LED module out of the server. To replace the component, reverse the removal procedure. Front panel USB To remove the component: Unlock and remove the tower bezel ("Remove the tower...
  • Page 32 Place the server on its side. Remove the access panel (on page 24). If installed, remove the PCI air baffle (on page 25). Remove the system air baffle (on page 24). Remove the fans (on page 25). If installed, remove the optical disk drive cage. Disconnect the optical drive cables.
  • Page 33 Remove the media bay blank. Disconnect the front USB cable from the system board. Remove the front USB module: Remove the front USB module screws. Removal and replacement procedures 33...

  • Page 34: Dimms

    Pull the front USB module out of the server. To replace the component, reverse the removal procedure. DIMMs To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source.

  • Page 35: Heatsink

    Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
  • Page 36 Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.

  • Page 37: Processor

    Finish the installation by completely tightening the screws in the same sequence. Install the system air baffle. If removed, install the PCI air baffle. Install the access panel. Return the server to an upright position. Connect each power cord to the server. Connect each power cord to the power source.
  • Page 38 Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on its side. Remove the access panel (on page 24). If installed, remove the PCI air baffle (on page 25). Remove the system air baffle (on page 24). Remove the heatsink: Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws.
  • Page 39 processor socket contacts. Remove the processor from the processor retaining bracket. To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 40 CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board.

  • Page 41: Eight-Bay Sff Hot-Plug Drive Cage

    Position the heatsink on the processor backplate. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence. Install the system air baffle. If removed, install the PCI air baffle.

  • Page 42: Four-Bay Lff Hot-Plug Drive Cage

    Remove the SFF drive cage. To replace the component, reverse the removal procedure. Four-bay LFF hot-plug drive cage To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source.

  • Page 43: Four-Bay Lff Non-Hot-Plug Drive Cage

    Remove the LFF hot-plug drive cage. To replace the component, reverse the removal procedure. Four-bay LFF non-hot-plug drive cage To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source.

  • Page 44: Hpe H240 Smart Host Bus Adapter

    Remove the drive cage. Remove the non-hot-plug drives. To replace the component, reverse the removal procedure. HPE H240 Smart Host Bus Adapter To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source.

  • Page 45: System Battery

    If installed, remove the PCI air baffle (on page 25). Remove the system air baffle (on page 24). Disconnect the Mini-SAS cables from the HPE H240 Smart Host Bus Adapter. Open the slot latch and remove the H240 Smart Host Bus Adapter. To replace the component, reverse the removal procedure.

  • Page 46: Dedicated Ilo Port Management Module

    Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

  • Page 47: Enabling The Dedicated Ilo Management Module

    Open the slot latch and remove the Dedicated iLO port management module. To replace the component, reverse the removal procedure. After installing the new dedicated iLO management module, enable the dedicated iLO connector ("Enabling the dedicated iLO management module" on page 47). Enabling the dedicated iLO management module The onboard NIC 1/shared iLO connector is set as the default system iLO connector.

  • Page 48: Lff Drive Carrier

    LFF drive carrier To install the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Place the server on its side.

  • Page 49: System Board

    Remove the drive from the carrier. To replace the component, reverse the removal procedure. System board To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Remove all power: Disconnect each power cord from the power source.
  • Page 50 Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
  • Page 51 Remove the processor from the processor retaining bracket. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket. CAUTION: Removal of the processor or heatsink renders the thermal layer between the processor and heatsink useless.
  • Page 52 To replace the system board: Install the system board. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 52...
  • Page 53 Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 54 CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can damage the processor and socket, requiring system board replacement. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
  • Page 55 Finish the installation by completely tightening the screws in the same sequence. IMPORTANT: Install all components with the same configuration that was used on the failed system board. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board. Install the fans.

  • Page 56: Hpe 550 W Power Supply

    Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. Enter the product ID and press the Enter key. Press the Esc key to close the menu. Press the Esc key to exit RBSU.

  • Page 57: Hpe 800 W/900 W Gold Ac Power Input Module

    Remove the power supply assembly from the server. Remove the power supply from its tray. To replace the component, reverse the removal procedure. HPE 800 W/900 W Gold AC Power Input Module To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel"...

  • Page 58: Hpe Redundant Power Supply Backplane

    Remove the power input module. To replace the component, reverse the removal procedure. HPE Redundant Power Supply Backplane To remove the component: Unlock and remove the tower bezel ("Remove the tower bezel" on page 23). Power down the server (on page 23). Access the product rear panel.

  • Page 59: Hp Trusted Platform Module

    Remove the power supply assembly from the server. Remove the power supply backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.

  • Page 60: Troubleshooting

    Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...

  • Page 61: Diagnostic Tools

    Diagnostic tools HPE UEFI System Utilities The HPE UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including: • Configuring system devices and installed options • Enabling and disabling system features •...

  • Page 62: Restoring And Customizing Configuration Settings

    Browse all FAT16 and FAT32 file systems. Select an X64 UEFI application with an .EFI extension to add as a new UEFI boot option, such as an OS boot loader or other UEFI application. The new boot option is appended to the boot order list. When you select a file, you are prompted to enter the boot option description (which is then displayed in the Boot menu), as well as any optional data to be passed to an .EFI application.

  • Page 63: Embedded Diagnostics Option

    manipulation, and system information. These features enhance the capabilities of the UEFI System Utilities. For more information, see the following documents: • UEFI Shell User Guide for ProLiant Gen9 Servers on the Hewlett Packard Enterprise website (http://www.hpe.com/info/ProLiantUEFI/docs) • UEFI Shell Specification on the UEFI website (http://www.uefi.org/specifications) Embedded Diagnostics option The system BIOS in all ProLiant Gen9 servers includes an Embedded Diagnostics option in the ROM.

  • Page 64: Hpe Insight Diagnostics

    power and can take control of the server video adapter to display the HPE ProLiant Pre-boot Health Summary. For additional information, see the following documents: • iLO 4 User Guide — See the Hewlett Packard Enterprise website (http://www.hpe.com/info/ilo/docs). • ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting — See "Troubleshooting Resources (on page 60)."...

  • Page 65: Integrated Management Log

    • Processor model and speed • Storage capacity and speed • Memory capacity and speed • Firmware/BIOS Active Health System does not collect information about Active Health System users' operations, finances, customers, employees, partners, or data center, such as IP addresses, host names, user names, and passwords.

  • Page 66: External Usb Functionality

    • When the server is configured for UEFI Boot Mode, Hewlett Packard Enterprise provides legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0, USB 2.0 , and USB 3.0 speeds. • When the server is configured for Legacy BIOS Boot Mode, Hewlett Packard Enterprise provides legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0 and USB 2.0 speeds.

  • Page 67: Component Identification

    Component identification Front panel components Item Description Media bays (2) Slim optical disk drive (optional) USB 3.0 connectors Box 2 Box 1 Component identification 67...

  • Page 68: Front Panel Leds And Buttons

    Front panel LEDs and buttons Item Description Status Health LED *Solid green = Normal Flashing green (1 Hz/cycle per sec) = iLO is rebooting. Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical NIC status LED Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity...

  • Page 69: Rear Panel Components

    Rear panel components Item Description Video connector USB 3.0 connectors USB 2.0 connectors Slot 1 PCIe3 x8 (8, 4, 1), for Processor 2 Slot 2 PCIe3 x8 (8, 4, 1), for Processor 1 Slot 3 PCIe3 x16 (16, 8, 4, 1), for Processor 2 Slot 4 PCIe3 x8 (8, 4, 1), for Processor 1 Slot 5 PCIe3 x16 (16, 8, 4, 1), for Processor 1 Slot 6 PCIe3 x8 (8, 4, 1), for Processor 1...

  • Page 70: Rear Panel Leds

    Rear panel LEDs Item Description Status Power supply LED Green = System on Off = No power present NIC link LED Green = Linked to network Off = No network connection NIC activity LED Green or flashing green = Network activity Off = No network activity iLO link LED Green = Linked to network...

  • Page 71: System Board Components

    System board components Item Description 4-pin power supply connector DIMM slots for processor 2 Processor 2 10-pin RPS connector 24-pin power supply connector Processor 1 DIMM slots for processor 1 Power supply sideband signal connector 10-pin power supply connector 8-pin power supply connector Fan connector 3 Front I/O connector Front USB connector...

  • Page 72: System Maintenance Switch

    Item Description Fan connector 2 System battery NMI header microSD slot Dedicated iLO port connector Slot 6 PCIe3 x8 (8, 4, 1) for Processor 1 Slot 5 PCIe3 x16 (16, 8, 4, 1) for Processor 1 Slot 4 PCIe3 x8 (8, 4, 1) for Processor 1 Slot 3 PCIe3 x16 (16, 8, 4, 1) for Processor 2 Slot 2 PCIe3 x8 (8, 4, 1) for Processor 1 Slot 1 PCIe3 x8 (8, 4, 1) for Processor 2...

  • Page 73: Dimm Slot Locations

    available action for administrators is to restart the system. Resetting the system erases any information which could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a system reset. To force the system to invoke the NMI handler and generate a crash dump log, do one of the following: •...

  • Page 74: Fan Locations

    Fan locations • Single-processor configuration Item Description Fan 1 Fan 2 • Two-processor configuration Item Description Fan 1 Fan 2 Fan 3 Component identification 74...

  • Page 75: Drive Numbering

    Drive numbering If only one drive cage is installed, it must be installed in box 2. With optional drive cages installed, the server supports up to 16 SFF hot-plug drives, up to 10 non-hot-plug LFF drives, or up to 8 LFF hot-plug drives.

  • Page 76: Hot-Plug Drive Led Definitions

    • LFF hot-plug drive model Hot-plug drive LED definitions When a drive is configured as a part of an array and connected to a powered-up controller, the drive LEDs indicate the condition of the drive. Item Status Definition Locate Solid blue The drive is being identified by a host application.
  • Page 77 Item Status Definition Solid amber The drive has failed. The drive is not configured by a RAID controller. Component identification 77...

  • Page 78: Cabling

    Cabling Front panel cabling Item Description Front I/O cable USB 3.0 connector cable Cabling 78...

  • Page 79: Storage Cabling

    Storage cabling Hot-plug SFF drive cabling • Eight-bay SFF hot-plug drive cage (box 2) Item Description Box 2 power cable Mini-SAS cable to system board SAS port 1 Mini-SAS cable to system board SAS port 2 • Two eight-bay SFF drive cages connected to a HPE P840 Smart Array controller Item Description Box 2 power cable...
  • Page 80 Item Description Box 2 Mini-SAS Y-cable Box 1 Mini-SAS Y-cable • Eight-bay SFF hot-plug drive cage connected to H240 host bus adapter (box 2) Item Description Box 2 power cable Mini-SAS cable to H240 port 2 Mini-SAS cable to H240 port 1 •...

  • Page 81: Hot-Plug Lff Drive Cabling

    Hot-plug LFF drive cabling • Four-bay LFF hot-plug drive cabling (box 2) Item Description Box 2 power cable Mini-SAS cable to system board SAS port 2 • Four-bay LFF hot-plug drive cabling (box 1) Item Description Box 1 power cable Mini-SAS cable to system board SAS port 1 Cabling 81...
  • Page 82 • Two four-bay LFF hot-plug drive cages connected to H240 host bus adapter Item Description Box 2 power cable Box 2 Mini-SAS cable to H240 host bus adapter Box 1 power cable Box 1 Mini-SAS cable to H240 host bus adapter •...

  • Page 83: Non-Hot Plug Lff Drive Cabling

    Non-hot plug LFF drive cabling • Four-bay LFF non-hot-plug drive cabling (box 2) Item Description Box 2 power cable SATA to Mini-SAS cable assembly • Four-bay LFF non-hot-plug drive cabling (box 1) Item Description Box 1 power cable SATA to Mini-SAS cable assembly Cabling 83...

  • Page 84: Power Cabling

    • LFF drive enablement cabling Item Description System board power cable Media bay 1 SATA cable to system board Media bay 2 SATA cable to system board Power cabling HPE 550-W Power Supply cabling (non-hot-plug) Item Description 16-pin power supply sideband signal cable 24-pin power supply cable Cabling 84...

  • Page 85: Redundant Power Supply Cabling (Hot-Plug)

    Redundant Power Supply cabling (hot-plug) Item Description 16-pin power supply sideband signal cable 24-pin power supply cable 10-pin RPS cable System board power cabling Cabling 85...

  • Page 86: Cache Module Backup Power Cabling

    Cache module backup power cabling HPE Smart Storage Battery cabling Cabling 86...

  • Page 87: Graphic Card Power Cabling

    Graphic card power cabling Item Description Power cable for graphic card installed in PCIe slot Power cable for graphic card installed in PCIe slot Optical drive cabling Item Description System board power cable Optical drive power cable SATA cable Cabling 87...

  • Page 88: Fan Cabling

    Fan cabling • Single-processor configuration Item Description Fan 2 cable Fan 1 cable • Two-processor configuration Item Description Fan 3 cable Fan 2 cable Fan 1 cable Cabling 88...

  • Page 89: Specifications

    Specifications Environmental specifications Specification Value — Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Nonoperating — Relative humidity (noncondensing) Minimum to be the higher (more moisture) of Operating -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity...

  • Page 90: Power Supply Specifications

    Power supply specifications Depending on the installed options and/or the regional location where the server was purchased, the server is configured with one of the following power supplies: • 550 W Power Supply • 800 W / 900 W Gold AC Power Input Module (PN 744689-B21) This is supported when the two-bay HPE RPS Backplane option (PN 745813-B21) is installed.

  • Page 91: Acronyms And Abbreviations

    Acronyms and abbreviations Advanced Memory Protection application program interface ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers backplane Customer Self Repair file allocation table FBWC flash-backed write cache graphics processing unit host bus adapter HPE SIM HPE Systems Insight Manager Integrated Lights-Out Integrated Management Log large form factor...
  • Page 92 Lights-Out Management nonmaskable interrupt NVRAM nonvolatile memory Optical Disk Drive PCIe Peripheral Component Interconnect Express POST Power-On Self Test RBSU ROM-Based Setup Utility REST representational state transfer redundant power supply serial attached SCSI SATA serial ATA Secure Digital small form factor Systems Insight Manager Service Pack for ProLiant Acronyms and abbreviations 92...
  • Page 93 Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification universal serial bus xHCI Extensible Host Controller Interface Acronyms and abbreviations 93...

  • Page 94: Documentation Feedback

    Documentation feedback Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hpe.com). When submitting your feedback, include the document title, part number, edition, and publication date located on the front cover of the document. For online help content, include the product name, product version, help edition, and publication date located on the legal notices page.

  • Page 95: Index

    Index fans, removing 25 features 67 front panel cabling 78 access panel 23, 24 front panel components 67 Active Health System 64 front panel LEDs 30, 31, 68 front USB 3.0 31 bezel 23 boot configurations 62 heatsink 34, 35 boot options 61, 63 Hewlett Packard Enterprise contact information 5 buttons 67, 68...
  • Page 96 problem diagnosis 60, 61 processors 37 Product ID 63 rear panel LEDs 70 removal and replacement procedures 21 required tools 21 RESTful API 63 ROM legacy USB support 65 safety considerations 21 safety information 21 serial number 63 server specifications 89 server warnings and cautions 22 Service Pack for ProLiant 64 software 63...

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