10 Operational Specifications
10.9
Processing Instructions
Generally, ESD protective measures must be maintained for all electronic
components. The VPC3+C is a cracking-endangered component that must
be properly handled.
A drying process must be carried out before the VPC3+C is processed. The
component must be dried for 24 hours at 125°C and then processed within
48 hours. Due to the solderability of the component this drying process may
be carried out once only.
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Revision 1.03
VPC3+C User Manual
Copyright © profichip GmbH 2004-2006
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