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PROCESS INFORMATION
This device is manufactured on PX29 5 or PX29 9 a
CHMOS III process Additional process and reliabili-
ty information is available in Intel's Components
Quality and Reliability Handbook Order Number
210997
EXAMPLE N87C196KC is 68-Lead PLCC OTPROM
16 MHz
For complete package dimensional data refer to the
Intel Packaging Handbook (Order Number 240800)
NOTE
1 EPROMs are available as One Time Programmable
(OTPROM) only
Figure 3 The 8XC196KC Family Nomenclature
Table 1 Thermal Characteristics
Package
i
ja
Type
PLCC
35 C W
QFP
55 C W
SQFP
TBD
All thermal impedance data is approximate for static air
conditions at 1W of power dissipation Values will change
depending on operation conditions and application See
the Intel Packaging Handbook (order number 240800) for a
description of Intel's thermal impedance test methodology
Table 2 8XC196KC Memory Map
External Memory or I O
Internal ROM OTPROM or External
Memory (Determined by EA)
Reserved Must contain FFH
(Note 5)
PTS Vectors
Upper Interrupt Vectors
ROM OTPROM Security Key
Reserved Must contain FFH
(Note 5)
Reserved Must Contain 20H
270942– 43
(Note 5)
CCB
Reserved Must contain FFH
(Note 5)
Lower Interrupt Vectors
Port 3 and Port 4
External Memory
488 Bytes Register RAM (Note 1)
i
jc
CPU SFR's (Notes 1 3 4)
13 C W
16 C W
NOTES
TBD
1 Code executed in locations 0000H to 01FFH will be
forced external
2 Reserved memory locations must contain 0FFH unless
noted
3 Reserved SFR bit locations must contain 0
4 Refer to 8XC196KC User's manual for SFR descriptions
5 WARNING Reserved memory locations must not be
written or read The contents and or function of these lo-
cations may change with future revisions of the device
Therefore a program that relies on one or more of these
locations may not function properly
8XC196KC 8XC196KC20
Description
Address
0FFFFH
06000H
5FFFH
2080H
207FH
205EH
205DH
2040H
203FH
2030H
202FH
2020H
201FH
201AH
2019H
2018H
2017H
2014H
2013H
2000H
1FFFH
1FFEH
1FFDH
0200H
01FFH
0018H
0017H
0000H
3
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