Sony BVM-L230 Service Manual page 168
Lcd video monitor
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Also See for BVM-L230:
- Operation manual (133 pages) ,
- Brochure & specs (17 pages) ,
- Product manual (18 pages)
Table of Contents
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LMD2 BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1364-354-A s MOUNTED CIRCUIT BOARD, LMD2
(SERVICE)
C6400
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6401
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6402
1-100-766-21 s CAP, ELECT 47MF (6.3X5.4)
C6403
1-100-766-21 s CAP, ELECT 47MF (6.3X5.4)
C6405
1-115-670-21 s CAP, CHIP TYPE ELECT 220MF
C6406
1-135-366-21 s CAP, ELECT 100MF (6.3X5.4)
C6407
1-135-366-21 s CAP, ELECT 100MF (6.3X5.4)
C6408
1-114-324-11 s CAP, CERAMIC 0.022MF X7R 1608
C6409
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6410
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6412
1-115-670-21 s CAP, CHIP TYPE ELECT 220MF
C6413
1-114-324-11 s CAP, CERAMIC 0.022MF X7R 1608
C6414
1-164-315-91 s CAP, CERAMIC 470PF CH (1608)
C6415
1-162-966-91 s CAP, CERAMIC 2200PF B 1608
C6416
1-114-322-11 s CAP, CERAMIC 4700PF X7R 1608
C6417
1-162-925-91 s CAP, CERAMIC 68PF CH 1608
C6419
1-114-323-11 s CAP, CERAMIC 0.01MF X7R 1608
C6420
1-162-970-91 s CAP, CERAMIC 0.01MF B 1608
C6421
1-162-923-91 s CAP, CERAMIC 47PF CH 1608
C6422
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6423
1-114-323-11 s CAP, CERAMIC 0.01MF X7R 1608
C6424
1-114-325-11 s CAP, CERAMIC 0.1MF X7R 1608
C6425
1-125-889-91 s CAP, CHIP CERAMIC 2.2MF B 2012
C6426
1-114-323-11 s CAP, CERAMIC 0.01MF X7R 1608
C6427
1-162-925-91 s CAP, CERAMIC 68PF CH 1608
C6428
1-114-322-11 s CAP, CERAMIC 4700PF X7R 1608
C6429
1-164-315-91 s CAP, CERAMIC 470PF CH (1608)
C6430
1-162-966-91 s CAP, CERAMIC 2200PF B 1608
C6431
1-114-325-11 s CAP, CERAMIC 0.1MF X7R 1608
C6432
1-114-325-11 s CAP, CERAMIC 0.1MF X7R 1608
C6433
1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)
C6434
1-114-329-11 s CAP, CERAMIC 0.47MF X7R 2012
C6435
1-114-331-11 s CAP, CERAMIC 4.7MF X7R 2012
C6436
1-114-329-11 s CAP, CERAMIC 0.47MF X7R 2012
C6437
1-114-329-11 s CAP, CERAMIC 0.47MF X7R 2012
C6438
1-100-912-11 s CAP, CERAMIC 1.0MF X7R (2012)
C6439
1-100-912-11 s CAP, CERAMIC 1.0MF X7R (2012)
C6440
1-112-554-21 s CAP, ELECT 82MF (10X12.6)
C6441
1-100-165-21 s CAP, ELECT 47MF (8X7)
C6442
1-115-670-21 s CAP, CHIP TYPE ELECT 220MF
C6443
1-114-324-11 s CAP, CERAMIC 0.022MF X7R 1608
C6444
1-115-339-91 s CAP, CERAMIC 0.1MF B (2012)
C6445
1-112-664-21 s CAP, ELECT 22MF (8X11.9)
C6449
1-114-325-11 s CAP, CERAMIC 0.1MF X7R 1608
C6500
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6501
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6502
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6503
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6504
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6505
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6506
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6507
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6508
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6509
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6510
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6511
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6512
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
B-82
(LMD2 BOARD)
Ref. No.
or Q'ty Part No.
SP Description
C6513
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6514
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6515
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6516
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6517
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6518
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6519
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6520
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6521
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6522
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6523
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6524
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6525
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6526
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6527
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6700
1-100-766-21 s CAP, ELECT 47MF (6.3X5.4)
C6701
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6702
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6703
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6704
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6705
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6706
1-162-970-91 s CAP, CERAMIC 0.01MF B 1608
C6707
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6708
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6709
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6710
1-162-915-91 s CAP, CERAMIC 10PF CH 1608
C6711
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6712
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6713
1-162-915-91 s CAP, CERAMIC 10PF CH 1608
C6714
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6715
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6716
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6717
1-100-909-11 s CAP, CERAMIC 10MF X6S 2012
C6718
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6719
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6720
1-100-591-91 s CAP, CHIP CERAMIC 1MF B 2012
C6721
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6722
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6723
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6724
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6725
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6726
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6900
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6901
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6902
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C6903
1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
CN6401
1-820-080-11 s HEADER ASSEMBLY FOR PWB 3P
CN6601
1-819-784-21 o PIN, CONNECTOR 50P
CN6602
1-819-784-21 o PIN, CONNECTOR 50P
CN6604
1-819-784-21 o PIN, CONNECTOR 50P
CN6605
1-819-784-21 o PIN, CONNECTOR 50P
CN6700
1-819-335-11 o HEADER ASSEMBLY FOR PWB, 9P
CN6701
1-819-444-11 o HEADER ASSEMBLY FOR PWB 11P
CN6702
1-819-337-11 s HEADER ASSEMBLY FOR PWB 10P
CN6900
1-818-656-21 o HEADER ASSEMBLY 30P
CN6901
1-816-569-21 s PIN, CONNECTOR (WITH PWB) 10P
CN6902
1-818-714-21 o HEADER ASSEMBLY 20P
BVM-L230
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