Sas Disk Backplane; I/O Subsystem; Partner Blade Support; Memory Subsystem - HP Integrity BL860c i2 Installation Manual

For the location of the SAS disk LEDs, see

SAS disk backplane

The SAS disk backplane supports two small form factor hard disk drives. The backplane supports
hot-plugging a single SAS drive at a time. The activity LEDs and drive present LEDs are controlled
by a preprogrammed system-on-chip. The system board hosts the SAS controller and supplies
12 V, 5 V, and 3.3 V standby power to the backplane.
The SAS backplane is connected to the system board with a right angle connector. This connector
is specifically designed for high-speed differential applications, and supports server speeds
exceeding 5 Gigabits per second. Power, sense, and I
as well as the SAS differential pairs and SGPIO signals.

I/O subsystem

The I/O subsystem is composed of embedded core I/O and up to three mezzanine cards. The
server blade supports the following configurations:
• Up to three type I mezzanine cards
• One type I and up to two type II mezzanine cards using up to x8-PCIe Gen-2 links
The server blade does not support PCI Hot Plug.

Partner blade support

The partner blades currently supported are the SB40c storage blade (411243-B21) and the HP
BLc PCI Expansion Blade (448018-B21).
Partner blade slotting rules are dependent on the conjoined blade configuration. For more
information on partner bay blade locations, see

Memory subsystem

The BL860c i2 physical memory subsystem connects two Itanium® processors to two groups of
12 DDR3 DIMMs. Each processor has two memory controllers.

DIMMs

The memory subsystem supports only DDR3 SDRAM technology using industry-standard 1.2"
high DIMMs.
Single DIMM
sizes
2 GB
4 GB
8 GB
For more DIMM information, see

Power subsystem

The power subsystem is located on the system board. Each server blade receives bulk DC voltage
from the enclosure. The server blade power block converts the DC voltage from the enclosure
to the voltage required by the server blade. The BL860c i2 Server Blade receives 12 V directly
from the enclosure. The voltage passes through E-Fuse circuitry that resides in the blade. The 12
V supply is on as long as a power supply is installed in the enclosure. A control line from the
enclosure OA can turn the E-Fuse on or off to supply or cut power to the blade. The 12 V gets
distributed to various POL converters. The switched POL voltage rails are: 0.9 V, 1.2 V, 1.5 V,
1.8 V, 2.5 V, 3.3 V, 5.0 V, 3.3 V standby, and 5.0 V standby.
BL860c i2 Min / Max BL870c i2 Min / Max
Memory size Memory size
8 GB / 48 GB Not supported
8 GB / 96 GB 16 GB / 192 GB
16 GB / 192 GB 32 GB / 384 GB
"Installing DIMMs" (page
"SAS disk drive LEDs" (page
2
C signals are routed through this connector
"Installing the Scaleable BladeLink" (page
BL890c i2 Min / Max
Memory size
Not supported
32 GB / 384 GB
32 GB / 768 GB
26).
13).
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Overview 9