HP ZBook 17 G2 Maintenance And Service Manual page 109

4. Remove the graphics subsystem heat sink (3).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the graphics subsystem heat
sink and the graphics board each time the graphics subsystem heat sink is removed. Thermal material is used
on the system board component closest to the fan (1) and the heat sink component that services it (2), as
well as on the graphics board (3) and various locations on the graphics subsystem heat sink section (4) that
services it.
Use the image below that matches the computer's thermal pad configuration.
Component replacement procedures 97