Memory - IBM @server xSeries 343 Product Manual

14. Press down on the left end of the clip (B) until firmly engaged over the stud on the mounting
bracket. Refer to Figure 29.
15. With the left (B) end of the clip firmly attached to the stud on the mounting bracket, press down
on the other end of the clip (C) until it is firmly engaged. Refer to Figure 29.
16. Repeat the process for the clip on the opposite side of the heat sink.

Memory

Only DDR266 compliant SDRAM is supported by the server board. Install from 256 MB to 12 GB
of registered, ECC memory, using up to six DIMMs.
NOTE
Only DDR266 is supported with a 533 MHz Front Side Bus.
DIMMs must be installed in pairs and in the following order: 1B and 1A, 2B and 2A, 3B and 3A.
Installed DIMMs must be the same speed and must all be registered. For a list of supported
memory, call your service representative or visit the IBM Support website.
Memory DIMM Support
®
The IBM xSeries 343 server board supports DDR266 compliant registered ECC DIMMs
operating at 266MHz.
Only DIMMs tested and qualified by IBM or a designated memory test vendor are supported on the
®
IBM xSeries 343 server board. A list of tested DIMMs will be made available. Note that
all DIMMs are supported by design, but only fully tested DIMMs will be supported.
The minimum supported DIMM size is 128 MB. Therefore, the minimum main memory
configuration is 2 x 128 MB or 256 MB. The largest size DIMM supported is a 2 GB stacked
registered DDR266 ECC DIMM based on 512 megabit technology.
Only registered DDR266 compliant, ECC, DDR memory DIMMs will be supported.
•
ECC single-bit errors will be corrected and multiple-bit errors will be detected. The server board
also supports the Intel® Single Device Data Correction (SDCC) feature.
•
The maximum memory capacity is 12 GB.
•
The minimum memory capacity is 256 MB.
Memory Configuration
The memory interface between the MCH and DIMMs is 144 bits wide. This requires that two
DIMMs be populated per bank in order for the system to operate. At least one bank has to be
populated in order for the system to boot. If additional banks have less than two DIMMs, the
memory for that bank(s) will not be available to the system.
There are three banks of DIMMs, labeled 1, 2, and 3. Bank 1 contains DIMM locations 1A and 1B,
Bank 2 contains 2A and 2B, and Bank 3 contains 3A and 3B. DIMM socket identifiers are marked
with silkscreen next to each DIMM socket on the baseboard. Note that the sockets associated with
any given bank are located next to each other.
xSeries 343 Product Guide
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