Table 1. Processor Support Matrix - Intel S5000XAL Technical Product Specification

Intel server board technical product specification
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Functional Architecture
®
®
Dual-Core Intel
Xeon
processors 5000 sequence will encompass the following:
Processor Family
®
®
Intel
Xeon
processor
®
®
Intel
Xeon
processor
®
®
Dual-Core Intel
Xeon
processor 5030
®
®
Dual-Core Intel
Xeon
processor 5050
®
®
Dual-Core Intel
Xeon
processor 5060
®
®
Dual-Core Intel
Xeon
processor 5063
®
®
Dual-Core Intel
Xeon
processor 5080
®
®
Dual-Core Intel
Xeon
processor 5110
®
®
Dual-Core Intel
Xeon
processor 5120
®
®
Dual-Core Intel
Xeon
processor 5130
®
®
Dual-Core Intel
Xeon
processor 5140
®
®
Dual-Core Intel
Xeon
processor 5150
®
®
Dual-Core Intel
Xeon
processor 5160
3.1.2.1
Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and bus/core speed.
Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than
one stepping back of the other. When only one processor is installed, it must be in the socket labeled
CPU1. The other socket must be empty.
The board is designed to provide up to 130A of current per processor. Processors with higher current
requirements are not supported.
No terminator is required in the second processor socket when using a single processor configuration.
3.1.2.2
Common Enabling Kit (CEK) Design Support
The server board complies with Intel's Common Enabling Kit (CEK) processor mounting and heat sink
retention solution. The server board ships with a CEK spring snapped onto the underside of the server
board, beneath each processor socket. The heat sink attaches to the CEK, over the top of the processor
and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK
spring, server board, TIM, and heat sink.
The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.
Note: The processor heat sink and CEK spring shown in the following diagram are for reference
purposes only. The actual processor heat sink and CEK solutions compatible with this generation server
board may be of a different design.
26
Intel

Table 1. Processor Support Matrix

System Bus
Speed
Frequency
533 MHz
800 MHz
667 MHz
2.67 GHz
667 MHz
3.0 GHz
1066 MHz
3.2 GHz
1066 MHz
3.2 GHz
1066 MHz
3.73 GHz
1066 MHz
1.60 GHz
1066 MHz
1.87 GHz
1333 MHz
1333 MHz
2.33 GHz
1333 MHz
2.67 GHz
1333 MHz
Revision 1.4
Intel order number: D31979-007
®
Server Board S5000PAL / S5000XAL TPS
Core
Cache
All
All
2x 2 MB
2x 2 MB
2x 2 MB
2x 2 MB
2x 2 MB
4MB shared
4MB shared
2 GHz
4MB shared
4MB shared
4MB shared
3 GHz
4MB shared
Watts
Support
No
No
95
Yes
95
Yes
130
Yes
95
Yes
130
Yes
65
Yes
65
Yes
65
Yes
65
Yes
65
Yes
80
Yes

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