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is strongly dependent on the thermal conductivity and thickness of the TIM
CS
between the heatsink and IHS.
is a measure of the thermal characterization parameter from the bottom of the
SA
heatsink to the local ambient air.
conductivity, and geometry. It is also strongly dependent on the air velocity through
the fins of the heatsink.
Figure 3-1 illustrates the combination of the different thermal characterization
parameters.
Figure 3-1. Processor Thermal Characterization Parameter Relationships
Heatsink
Heatsink
Processor
Processor
3.1.1
Example
The cooling performance,
parameter described above:
The case temperature T
datasheet.
Define a target local ambient temperature at the processor, T
Since the processor thermal profile applies to all processor frequencies, it is important
to identify the worst case (lowest
establish a design strategy.
The following provides an illustration of how one might determine the appropriate
performance targets. The example power and temperature numbers used here are not
related to any specific Intel processor thermal specifications, and are for illustrative
purposes only.
28
TIM
TIM
IHS
IHS
is defined using the principle of thermal characterization
CA,
and thermal design power TDP given in the processor
C-MAX
is dependent on the heatsink material, thermal
SA
T
T
A
A
T
T
S
S
T
T
C
C
) for a targeted chassis characterized by T
CA
Thermal and Mechanical Design Guidelines
Thermal Metrology
CA
CA
LGA775 Socket
LGA775 Socket
System Board
System Board
.
A
to
A
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