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TMS320F2809, TMS320F2808, TMS320F2806
TMS320F2802, TMS320F2801, TMS320C2802
TMS320C2801, TMS320F28016, TMS320F28015
SPRS230N – OCTOBER 2003 – REVISED MAY 2012
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production
system because their expected end-use failure rate still is undefined. Only qualified production devices are
to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, PZ) and temperature range (for example, S).
reading the complete device name for any family member.
PREFIX
TMX = Experimental Device
TMP = Prototype Device
TMS = Qualified Device
DEVICE FAMILY
TM
320 = TMS320
DSP Family
TECHNOLOGY
F = Flash EEPROM
(1.8-V Core/3.3-V I/O)
C = ROM
(1.8-V Core/3.3-V I/O)
Figure 5-1. Example of TMS320x280x/2801x Device Nomenclature
86
Device Support
Product Folder Link(s):
TMS
320
F
28015
PZ
Submit Documentation Feedback
TMS320F2809 TMS320F2808 TMS320F2806 TMS320F2802 TMS320F2801 TMS320C2802
TMS320C2801 TMS320F28016 TMS320F28015
A
-60
Indicates 60-MHz device.
Absence of "-60" indicates
100-MHz device.
TEMPERTURE RANGE
A = −40
°C to 85 C
S =
−40°C to 125°C
Q = −40°C to 125°C (Q100 qualification)
PACKAGE TYPE
PZ = 100-Pin Low-Profile Quad Flatpack (LQFP)
GGM = 100-Ball Ball Grid Array (BGA)
ZGM = 100-Ball Lead-Free BGA
DEVICE
2809
2808
2806
2802
2801
28015
28016
Copyright © 2003–2012, Texas Instruments Incorporated
www.ti.com
Figure 5-1
provides a legend for
°
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