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Core 2 Duo E6400
Intel Core 2 Duo E6400 Manuals
Manuals and User Guides for Intel Core 2 Duo E6400. We have
2
Intel Core 2 Duo E6400 manuals available for free PDF download: Datasheet, Design Manual
Intel Core 2 Duo E6400 Datasheet (122 pages)
Intel Core 2 Extreme Processor X6800Δ and Intel Core 2 Duo Desktop Processor E6000Δ and E4000Δ Sequences
Brand:
Intel
| Category:
Computer Hardware
| Size: 1.96 MB
Table of Contents
Table of Contents
3
Revision History
7
Introduction
11
Core™2 Duo Desktop Processors
11
Terminology
12
Processor Terminology
12
Core™2 Duo Desktop Processor
12
References
14
Reference Documents
14
Electrical Specifications
15
Power and Ground Lands
15
Decoupling Guidelines
15
VCC Decoupling
15
Vtt Decoupling
15
Voltage Identification
16
FSB Decoupling
16
Voltage Identification Definition
17
Market Segment Identification (MSID)
18
Reserved, Unused, and TESTHI Signals
18
Market Segment Selection Truth Table for MSID[1:0]
18
Voltage and Current Specification
19
Absolute Maximum and Minimum Ratings
19
Absolute Maximum and Minimum Ratings
20
DC Voltage and Current Specification
20
Voltage and Current Specifications
20
VCC Static and Transient Tolerance for Processors with 4 MB L2 Cache
23
CC Static and Transient Tolerance for Processors with 4 MB L2 Cache
23
V Static and Transient Tolerance for Processors with 2 MB L2 Cache
24
VCC Static and Transient Tolerance for Processors with 2 MB L2 Cache
25
VCC
25
CC Static and Transient Tolerance for Processors with 2 MB L2 Cache
25
Signaling Specifications
26
Die Voltage Validation
26
VCC
26
FSB Signal Groups
27
CMOS and Open Drain Signals
28
Signal Characteristics
28
Signal Reference Voltages
28
Processor DC Specifications
29
GTL+ Signal Group DC Specifications
29
Open Drain and TAP Output Signal Group DC Specifications
29
GTL+ Front Side Bus Specifications
30
CMOS Signal Group DC Specifications
30
GTL+ Bus Voltage Definitions
30
Clock Specifications
31
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking
31
FSB Frequency Select Signals (BSEL[2:0])
31
Core Frequency to FSB Multiplier Configuration
31
Phase Lock Loop (PLL) and Filter
32
BCLK[1:0] Specifications (CK505 Based Platforms)
32
BSEL[2:0] Frequency Table for BCLK[1:0]
32
Front Side Bus Differential BCLK Specifications
32
Differential Clock Waveform
33
Differential Clock Crosspoint Specification
33
Differential Measurements
33
BCLK[1:0] Specifications (CK410 Based Platforms)
34
Differential Clock Crosspoint Specification
34
Front Side Bus Differential BCLK Specifications
34
PECI DC Specifications
35
PECI DC Electrical Limits
35
Package Mechanical Specifications
37
Package Mechanical Drawing
37
Processor Package Assembly Sketch
37
Processor Package Drawing Sheet 3 of 3
40
Processor Component Keep-Out Zones
41
Package Loading Specifications
41
Package Handling Guidelines
41
Processor Loading Specifications
41
Package Insertion Specifications
42
Processor Mass Specification
42
Processor Materials
42
Processor Markings
42
Processor Top-Side Markings Example for the Intel
42
Processor Top-Side Markings Example for the Intel
43
Processor Land Coordinates
45
Processor Land Coordinates and Quadrants (Top View)
45
Land Listing and Signal Descriptions
47
Processor Land Assignments
47
Land-Out Diagram (Top View - Left Side)
48
Land-Out Diagram (Top View - Right Side)
49
Alphabetical Land Assignments
50
Numerical Land Assignment
60
Alphabetical Signals Reference
70
Signal Description (Sheet 1 of 9)
70
Thermal Specifications and Design Considerations
79
Processor Thermal Specifications
79
Thermal Specifications
79
Processor Thermal Specifications
80
Thermal Profile
81
MB L2 Cache)
82
Thermal Profile
82
Thermal Profile
83
MB L2 Cache)
83
Thermal Profile
84
Thermal Profile
85
Thermal Metrology
86
Processor Thermal Features
86
Thermal Monitor
86
Thermal Monitor 2
87
On-Demand Mode
88
Thermal Monitor 2 Frequency and Voltage Ordering
88
PROCHOT# Signal
89
THERMTRIP# Signal
89
Thermal Diode
90
Thermal "Diode" Parameters Using Diode Model
90
Thermal "Diode" Parameters Using Transistor Model
91
Thermal Diode Interface
91
Platform Environment Control Interface (PECI)
92
Introduction
92
Key Difference with Legacy Diode-Based Thermal Management
92
Conceptual Fan Control on PECI-Based Platforms
93
Conceptual Fan Control on Thermal Diode-Based Platforms
93
PECI Specifications
94
PECI Command Support
94
PECI Device Address
94
PECI Fault Handling Requirements
94
PECI Gettemp0() Error Code Support
94
Gettemp0() Error Codes
94
Features
95
Power-On Configuration Options
95
Clock Control and Low Power States
95
Power-On Configuration Option Signals
95
Normal State
96
HALT and Extended HALT Powerdown States
96
HALT Powerdown State
96
Processor Low Power State Machine
96
Extended HALT Powerdown State
97
Stop Grant and Extended Stop Grant States
97
Stop Grant State
97
Extended HALT Snoop State, Extended Stop Grant Snoop State
98
Extended HALT State, HALT Snoop State, Extended Stop Grant Snoop State, and Stop Grant Snoop State
98
Extended Stop Grant State
98
HALT Snoop State, Stop Grant Snoop State
98
Enhanced Intel Speedstep Technology
98
Boxed Processor Specifications
101
Mechanical Representation of the Boxed Processor
101
Mechanical Specifications
102
Boxed Processor Cooling Solution Dimensions
102
Space Requirements for the Boxed Processor (Side View)
102
Space Requirements for the Boxed Processor (Top View)
102
Boxed Processor Fan Heatsink Weight
103
Electrical Requirements
103
Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly
103
Fan Heatsink Power Supply
103
Space Requirements for the Boxed Processor (Overall View)
103
Boxed Processor Fan Heatsink Power Cable Connector Description
104
Fan Heatsink Power and Signal Specifications
104
Thermal Specifications
105
Boxed Processor Cooling Requirements
105
Baseboard Power Header Placement Relative to Processor Socket
105
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)
106
Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)
106
Fan Speed Control Operation (Intel Core2 Extreme Processor X6800 Only)
107
Fan Speed Control Operation (Intel Core2 Duo Desktop Processor E6000 and E4000 Sequences Only)
107
Boxed Processor Fan Heatsink Set Points
108
Fan Heatsink Power and Signal Specifications
108
Balanced Technology Extended (BTX) Boxed Processor Specifications
111
Mechanical Representation of the Boxed Processor with a Type I TMA
111
Mechanical Specifications
112
Cooling Solution Dimensions
112
Mechanical Representation of the Boxed Processor with a Type II TMA
112
Requirements for the Balanced Technology Extended (BTX) Type I Keep-Out Volumes
113
Boxed Processor Thermal Module Assembly Weight
114
Requirements for the Balanced Technology Extended (BTX) Type II Keep-Out Volume
114
Boxed Processor Support and Retention Module (SRM)
115
Assembly Stack Including the Support and Retention Module
115
Electrical Requirements
116
Thermal Module Assembly Power Supply
116
Boxed Processor TMA Power Cable Connector Description
116
Balanced Technology Extended (BTX) Mainboard Power Header Placement (Hatched Area)
117
TMA Power and Signal Specifications
117
Thermal Specifications
118
Boxed Processor Cooling Requirements
118
Variable Speed Fan
118
Boxed Processor TMA Set Points
119
TMA Set Points for 3-Wire Operation of BTX Type I and Type II Boxed Processors
119
Debug Tools Specifications
121
Logic Analyzer Interface (LAI)
121
Mechanical Considerations
121
Electrical Considerations
121
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Intel Core 2 Duo E6400 Design Manual (55 pages)
Thermal Design Guide
Brand:
Intel
| Category:
Computer Hardware
| Size: 1.23 MB
Table of Contents
Table of Contents
3
Revision History
6
Introduction
7
Document Goals and Scope
7
Importance of Thermal Management
7
Document Goals
7
Document Scope
7
References
9
Definition of Terms
9
Referenced Documents
9
Terms Used
9
Processor Thermal/Mechanical Information
11
Mechanical Requirements
11
Processor Package
11
Package IHS Load Areas
11
Heatsink Attach
12
Heatsink Clip Load Requirement
13
Additional Guidelines
13
Thermal Requirements
14
Processor Case Temperature
14
Thermal Profile
15
Processor Case Temperature Measurement Location
15
Control
16
Example Thermal Profile
16
Heatsink Design Considerations
17
Heatsink Size
17
Heatsink Mass
18
Package IHS Flatness
18
Thermal Interface Material
18
System Thermal Solution Considerations
19
Chassis Thermal Design Capabilities
19
Improving Chassis Thermal Performance
19
Summary
19
System Integration Considerations
20
Thermal Metrology
21
Characterizing Cooling Performance Requirements
21
Example
22
Processor Thermal Characterization Parameter Relationships
22
Processor Thermal Solution Performance Assessment
23
Local Ambient Temperature Measurement Guidelines
23
Locations for Measuring Local Ambient Temperature, Active Heatsink
24
Processor Case Temperature Measurement Guidelines
25
Locations for Measuring Local Ambient Temperature, Passive Heatsink
25
Thermal Management Logic and Thermal Monitor Feature
26
Processor Power Dissipation
26
Thermal Monitor Implementation
26
PROCHOT# Signal
27
Thermal Control Circuit
27
Thermal Monitor 2
28
Concept for Clocks under Thermal Monitor Control
28
Operation and Configuration
29
Thermal Monitor 2 Frequency and Voltage Ordering
29
On-Demand Mode
30
System Considerations
30
Operating System and Application Software Considerations
31
THERMTRIP# Signal
31
Cooling System Failure Warning
31
Digital Thermal Sensor
31
Platform Environmental Control Interface (PECI)
32
For Digital Thermal Sensor
32
Intel® Reference Thermal Solution
33
Thermal Solution Requirements
33
Thermal Characterization Parameter at Various T
33
PICMG 1.3 Form Factor
34
Thermal Characterization Parameters for Various Operating Conditions
34
PICMG 1.3 Copper Heatsink
35
ATX/BTX Form Factors
36
Altitude
36
PICMG 1.3 Heatsink Performance
36
Geometric Envelope for Intel Reference PICMG 1.3 Thermal Mechanical Design
37
Intel® Quiet System Technology (Intel® QST)
38
Intel ® QST Algorithm
38
Output Weighting Matrix
39
Proportional-Integral-Derivative (PID)
39
Intel® QST Overview
39
PID Controller Fundamentals
40
Board and System Implementation of Intel® QST
41
Intel® QST Platform Requirements
41
Example Acoustic Fan Speed Control Implementation
42
Fan Hub Thermistor and Intel
43
QST Configuration and Tuning
43
Qst
43
Digital Thermal Sensor and Thermistor
43
LGA775 Socket Heatsink Loading
44
LGA775 Socket Heatsink Considerations
44
Metric for Heatsink Preload for Designs Non-Compliant with Intel Reference Design
44
Board Deflection Configuration Definitions
45
Board Deflection Definition
46
Example: Defining Heatsink Preload Meeting Board Deflection Limit
48
Heatsink Selection Guidelines
49
Thermal Interface Management
50
Bond Line Management
50
Interface Material Area
50
Interface Material Performance
50
Case Temperature Reference Metrology
51
Objective and Scope
51
Mechanical Drawings
53
PICMG 1.3 Motherboard Keep-Out Footprint Definition and Height Restrictions for Enabling
53
PICMG 1.3 Motherboard Keep-Out, Secondary Side
54
Intel® Enabled Reference Solution Information
55
Intel Reference Component PICMG 1.3 Thermal Solution Providers
55
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