Definition Of Terms - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

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Definition of Terms

Term
ACPI
BTX
Bypass
DTS
FSC
Health Monitor
Component
IHS
LGA775 Socket
P
MAX
PWM
T
T
TCC
T
C-MAX
T
CONTROL
T
CONTROL_BASE
T
CONTROL_OFFSET
T
DIODE
TDP
T
14
Advanced Configuration and Power Interface.
Balanced Technology Extended
Bypass is the area between a passive heatsink and any object that can act
to form a duct. For this example, it can be expressed as a dimension away
from the outside dimension of the fins to the nearest surface.
Digital Thermal Sensor: Processor die sensor temperature defined as an
offset from the onset of PROCHOT#.
Fan Speed Control: Thermal solution that includes a variable fan speed
which is driven by a PWM signal and uses the digital thermal sensor as a
reference to change the duty cycle of the PWM signal.
Any standalone or integrated component that is capable of reading the
processor temperature and providing the PWM signal to the 4 pin fan
header.
Integrated Heat Spreader: a thermally conductive lid integrated into a
processor package to improve heat transfer to a thermal solution through
heat spreading.
The surface mount socket designed to accept the processors in the 775–
Land LGA package.
The maximum power dissipated by a semiconductor component.
Pulse width modulation is a method of controlling a variable speed fan. The
enabled 4 wire fans use the PWM duty cycle % from the fan speed
controller to modulate the fan speed.
The measured ambient temperature locally surrounding the processor. The
ambient temperature should be measured just upstream of a passive
A
heatsink or at the fan inlet for an active heatsink.
The case temperature of the processor, measured at the geometric center
of the topside of the IHS.
C
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die
temperature by lowering effective processor frequency when the die
temperature has exceeded its operating limits.
The maximum case temperature as specified in a component specification.
T is the specification limit for use with the digital thermal sensor.
CONTROL
Constant from the processor datasheet that is added to the T
that results in the value for
Value read by the BIOS from a processor MSR and added to the
T
that results in the value for
CONTROL_BASE
Temperature reported from the on-die thermal diode.
Thermal Design Power: A power dissipation target based on worst-case
applications. Thermal solutions should be designed to dissipate the thermal
design power.
The ambient air temperature external to a system chassis. This
temperature is usually measured at the chassis air inlets.
E
Description
T
CONTROL
T
CONTROL
Thermal and Mechanical Design Guidelines
Introduction
CONTROL_OFFSET