Table Of Contents - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

Design guidelines
Table of Contents

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Contents
1
Introduction ...................................................................................................11
1.1
Document Goals and Scope ...................................................................11
1.1.1
1.1.2
1.1.3
1.2
References ..........................................................................................13
1.3
Definition of Terms ...............................................................................14
2
Processor Thermal/Mechanical Information .........................................................17
2.1
Mechanical Requirements ......................................................................17
2.1.1
2.1.2
2.2
Thermal Requirements ..........................................................................20
2.2.1
2.2.2
2.2.3
2.3
Heatsink Design Considerations ..............................................................24
2.3.1
2.3.2
2.3.3
2.3.4
2.4
System Thermal Solution Considerations .................................................27
2.4.1
2.4.2
2.4.3
2.5
System Integration Considerations..........................................................28
3
Thermal Metrology ..........................................................................................29
3.1
Characterizing Cooling Performance Requirements ....................................29
3.1.1
3.2
Processor Thermal Solution Performance Assessment ................................31
3.3
Local Ambient Temperature Measurement Guidelines.................................32
3.4
Processor Case Temperature Measurement Guidelines ...............................34
4
Thermal Management Logic and Thermal Monitor Feature .....................................35
4.1
Processor Power Dissipation ...................................................................35
4.2
Thermal Monitor Implementation ............................................................35
4.2.1
4.2.2
4.2.3
4.2.4
Thermal and Mechanical Design Guidelines
Importance of Thermal Management ..........................................11
Document Goals......................................................................11
Document Scope .....................................................................12
Processor Package...................................................................17
Heatsink Attach ......................................................................19
2.1.2.1
General Guidelines ....................................................19
2.1.2.2
Heatsink Clip Load Requirement..................................19
2.1.2.3
Additional Guidelines .................................................20
Processor Case Temperature .....................................................20
Thermal Profile .......................................................................21
T
..................................................................................23
Heatsink Size..........................................................................25
Heatsink Mass.........................................................................25
Package IHS Flatness...............................................................26
Thermal Interface Material........................................................26
Chassis Thermal Design Capabilities...........................................27
Improving Chassis Thermal Performance ....................................27
Summary ...............................................................................28
Example ................................................................................31
PROCHOT# Signal ...................................................................36
Thermal Control Circuit ............................................................36
4.2.2.1
Thermal Monitor .......................................................36
4.2.2.2
Thermal Monitor 2 (TM2) ...........................................37
Operation and Configuration .....................................................38
On-Demand Mode ...................................................................39
3

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