Contents
1
Introduction ...................................................................................................11
1.1
1.1.1
1.1.2
1.1.3
1.2
References ..........................................................................................13
1.3
Definition of Terms ...............................................................................14
2
2.1
2.1.1
2.1.2
2.2
2.2.1
2.2.2
2.2.3
2.3
2.3.1
2.3.2
2.3.3
2.3.4
2.4
2.4.1
2.4.2
2.4.3
2.5
3
Thermal Metrology ..........................................................................................29
3.1
3.1.1
3.2
3.3
3.4
4
4.1
4.2
4.2.1
4.2.2
4.2.3
4.2.4
Thermal and Mechanical Design Guidelines
Document Goals......................................................................11
Document Scope .....................................................................12
Processor Package...................................................................17
Heatsink Attach ......................................................................19
2.1.2.1
2.1.2.2
2.1.2.3
Thermal Profile .......................................................................21
T
..................................................................................23
Heatsink Size..........................................................................25
Heatsink Mass.........................................................................25
Summary ...............................................................................28
Example ................................................................................31
PROCHOT# Signal ...................................................................36
4.2.2.1
4.2.2.2
On-Demand Mode ...................................................................39
3