Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual page 6

Figures
Figure 1. Package IHS Load Areas .....................................................................17
Figure 2. Processor Case Temperature Measurement Location ............................... 21
Figure 3. Example Thermal Profile .....................................................................23
Figure 4. Processor Thermal Characterization Parameter Relationships.................... 30
Figure 5. Locations for Measuring Local Ambient Temperature, Active Heatsink ........33
Figure 6. Locations for Measuring Local Ambient Temperature, Passive Heatsink ......33
Figure 7. Thermal Monitor Control .....................................................................37
Figure 8. Thermal Monitor 2 Frequency and Voltage Ordering ................................ 38
Figure 9. T
Figure 10. Intel
Figure 11. Intel D60188-001 Reference Design ─ Exploded View............................44
Figure 12. Bottom View of Copper Core Applied by TC-1996 Grease .......................45
Figure 13. Random Vibration PSD......................................................................49
Figure 14. Shock Acceleration Curve ..................................................................50
Figure 15. Upward Board Deflection During Shock ...............................................53
Figure 16. Reference Clip/Heatsink Assembly ......................................................54
Figure 17. Critical Parameters for Interfacing to Reference Clip..............................55
Figure 18. Critical Core Dimension.....................................................................55
Figure 19. Intel
Figure 20. PID Controller Fundamentals .............................................................59
Figure 21. Intel
Figure 22. Example Acoustic Fan Speed Control Implementation ............................61
Figure 23. Digital Thermal Sensor and Thermistor................................................62
Figure 24. Board Deflection Definition ................................................................65
Figure 25. Example: Defining Heatsink Preload Meeting Board Deflection Limit ........67
Figure 26. Load Cell Installation in Machined Heatsink Base Pocket (Bottom View) ...70
Figure 27. Load Cell Installation in Machined Heatsink Base Pocket (Side View)........71
Figure 28. Preload Test Configuration.................................................................71
Figure 29. Omega Thermocouple .......................................................................78
Figure 30. 775-LAND LGA Package Reference Groove Drawing at 6 o'clock Exit ........ 80
Figure 31. 775-LAND LGA Package Reference Groove Drawing at 3 o'clock Exit
Figure 32. IHS Groove at 6 o'clock Exit on the 775-LAND LGA Package ...................83
Figure 33. IHS Groove Orientation at 6 o'clock Exit Relative to the LGA775 Socket ...83
Figure 34. Inspection of Insulation on Thermocouple............................................84
Figure 35. Bending the Tip of the Thermocouple ..................................................85
Figure 36. Securing Thermocouple Wires with Kapton* Tape Prior to Attach ............85
Figure 37. Thermocouple Bead Placement...........................................................86
Figure 38. Position Bead on the Groove Step.......................................................87
Figure 39. Detailed Thermocouple Bead Placement ..............................................87
Figure 40. Third Tape Installation ......................................................................88
Figure 41. Measuring Resistance between Thermocouple and IHS ..........................88
Figure 42. Applying Flux to the Thermocouple Bead .............................................89
Figure 43. Cutting Solder .................................................................................89
Figure 44. Positioning Solder on IHS ..................................................................90
Figure 45. Solder Station Setup ........................................................................91
Figure 46. View Through Lens at Solder Station...................................................92
Figure 47. Moving Solder back onto Thermocouple Bead .......................................92
Figure 48. Removing Excess Solder ...................................................................93
Figure 49. Thermocouple Placed into Groove .......................................................94
Figure 50. Removing Excess Solder ...................................................................94
Figure 51. Filling Groove with Adhesive ..............................................................95
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for Digital Thermometer ..........................................................41
CONTROL
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RCFH-4 Reference Design - Exploded View ................................. 43
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Quiet System Technology Overview ...........................................58
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Quiet System Technology Platform Requirements ........................ 60
(Old Drawing)..................................................................................81
Thermal and Mechanical Design Guidelines