Figure 49. Thermocouple Placed Into Groove; Figure 50. Removing Excess Solder - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

Figure 49. Thermocouple Placed into Groove

29. Using a blade carefully shave the excess solder above the IHS surface. Only shave
in one direction until solder is flush with the groove surface (see Figure 50).

Figure 50. Removing Excess Solder

Note: Take usual precautions when using open blades.
30. Clean the surface of the IHS with Alcohol and use compressed air to remove any
remaining contaminants.
31. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope
that the thermocouple wire is below the surface along the entire length of the IHS
groove (see Figure 51).
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Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines