Pad Layout - Epson S1D10605 Series Manual

S1D10605 Series

4. PAD LAYOUT

99
100
134
135
Chip Size
Chip Thickness
Bump Pitch
Bump Size
Bump Height
Alignment Mark
Left Upper
Alignment Mark
Left Lower
Alignment Mark
Right Upper
Alignment Mark
Right Lower
4
S1D10605 Series
(0, 0)
Die No.
D1065D
0B
Item
PAD No. 1 to 24
PAD No. 25 to 82
PAD No. 83 to 99
PAD No. 100 to 134
PAD No. 135 to 274
PAD No. 275 to 309
Alignment Coordinates
Outside Diameter •
Inside Diameter
Alignment Coordinates
Outside Diameter •
Inside Diameter
Alignment Coordinates
Outside Diameter
Alignment Coordinates
Outside Diameter
EPSON
1
274
Size Unit
X Y
7.93 × 2.25
mm
0.625
50 (Min.)
55 × 76
45 × 76
55 × 76
136 × 33
33 × 126
136 × 33
µm
17 (Typ.)
–3590 × 980
78 • 33
–3690 × –940
78 • 33
3635 × 980
78
3585 × –940
78
309
275
Rev.2.1