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Thermal Shutdown
SHLIC
Thermal limiting circuitry on chip of the
SHLIC will shut down the circuit at a
junction temperature of about 165 °C.
The device should never see this tem-
perature and operation above 145 °C
junction temperature might degrade
device reliability.
Table 18: SHLIC Dissipation
Parameter
Maximum operating power dissipation, Tamb. = 70 °C
Thermal resistance = 55°C/w typ.
The specifications for power dissipation
imply that in ring mode the active ring
phase must at least be 4 times shorter
than the non active ring phase. The
maximum duration of the active ring
phase must be below 2 s.
Transient Energy Capability
During testing, each device termination
withstands being shorted to the supply
voltages or ground as specified below.
The shorting must be limited to one sec-
ond.
Shorted to GNDA, VDDA or GNDB:
VAG, PU, RNG, BR, TST, TA, DCC, DCO, DCI, TX to RX
Shorted to GNDA, GNDB or BATS:
AW, BW, SA to SB
MTK-40131
Symbol
Pmax_op
28
Value
Unit
1.2
W
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