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This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Hot-plug drive ............................32 Access panel ............................33 Four-bay LFF non-hot-plug drive backplane ....................34 Four-bay LFF hot-plug drive backplane ....................... 35 HP Smart Storage Battery ......................... 36 FBWC module ............................37 Optical drive blank ..........................38 Optical drive ............................39 Fan and fan blank ...........................
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Secure Boot configuration ....................... 74 Embedded UEFI shell ........................75 Embedded Diagnostics option ......................75 HP RESTful API support for UEFI ....................... 75 Re-entering the server serial number and product ID ................75 HP ProLiant Pre-boot Health Summary ......................76 HP Insight Diagnostics ..........................
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Specifications ..........................96 Environmental specifications ........................96 Mechanical specifications ........................96 Power supply specifications ........................97 Hot-plug power supply calculations ......................97 Acronyms and abbreviations ......................98 Documentation feedback ......................101 Index ............................102 Contents 5...
HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
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HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
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La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
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Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
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HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
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Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
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No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 12...
FlexibleLOM riser cage 792118-001 Mandatory PCI blank 790515-001 Mandatory Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. Illustrated parts catalog 16...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
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• HP PartSurfer mobile site (http://partsurfermobile.hp.com) Item Description Spare part Customer self number repair (on page 6) System board assembly (includes alcohol pad and thermal 790485-001 Optional compound) Primary PCIe riser board 790488-001 Optional System battery 234556-001 Mandatory FlexibleLOM riser board...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
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Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
T-25 Torx screwdriver (for screws located inside the front panel quick-release levers) • T-10/T-15 Torx screwdriver • HP Insight Diagnostics (on page 76) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts.
Get help to lift and stabilize the product during installation or removal, especially when the • product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.
Extend the server from the rack (on page 27). If you are performing service procedures in an HP, Compaq branded, Telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.
Remove the security bezel (optional) The security bezel is only supported in servers using the quick-release latch rack ears. To access the front panel components, unlock and then remove the security bezel. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.
Get help to lift and stabilize the product during installation or removal, especially when the • product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the server if the server is installed higher than chest level.
Place the server on a sturdy, level surface. Remove the air baffle CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open. To remove the component: Power down the server (on page 26).
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Extend the server from the rack (on page 27). Remove the server from the rack (on page 27). Remove the access panel ("Access panel" on page 33). Disconnect all cables connected to existing expansion boards. Remove the secondary PCI riser cage or PCI blank. Secondary PCI riser cage PCI blank Removal and replacement procedures 29...
Remove any expansion boards installed in the primary riser cage. Remove the primary PCI riser cage. Non-hot-plug drive carrier CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Power down the server (on page 26).
Remove the drive carrier. To replace the component, slide the component into the bay until it clicks. Non-hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive.
Remove the drive from the carrier. To replace the component, reverse the removal procedure. Hot-plug drive blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: If installed, remove the security bezel ("Remove the security bezel...
Remove the hot-plug drive. To replace the component, reverse the removal procedure. Access panel To remove the component: WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed.
If the access panel latch is locked, use a T-15 Torx screwdriver to unlock the latch. To replace the component, reverse the removal procedure. Four-bay LFF non-hot-plug drive backplane To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source.
Remove the non-hot-plug drive backplane. To replace the component, reverse the removal procedure. Four-bay LFF hot-plug drive backplane To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
HP Smart Storage Battery For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP website (http://www.hp.com/go/qs). CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.
Remove the HP Smart Storage Battery. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
If removing a FBWC module from an expansion board in slot 2, remove the PCI riser assembly first before disconnecting the cache module cable. For information on FBWC cabling, see "FBWC cabling (on page 91)". Disconnect the cache module backup power cable from the cache module. Remove the cache module.
Extend the server from the rack (on page 27). Remove the server from the rack (on page 27). If installed, remove the security bezel ("Remove the security bezel (optional)" on page 26). Remove the access panel ("Access panel" on page 33). Remove the optical drive blank To replace the component, reverse the removal procedure.
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Disconnect the optical drive cable from the drive. Remove the optical drive: To replace the component, reverse the removal procedure. Removal and replacement procedures 40...
Fan and fan blank Fan population guidelines Configuration Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay 5 Fan bay 6 Blank Blank Blank One processor, non-redundant Blank One processor, redundant Blank Blank Two processors, non-redundant Two processors, redundant...
Disconnect each power cord from the server. Disconnect all peripheral cables and power cords from the rear panel. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 27). Remove the access panel ("Access panel"...
Remove the server from the rack (on page 27). Remove the access panel ("Access panel" on page 33). Remove the air baffle (on page 28). Disconnect the fan cable from the system board and remove the fan. To replace the component, reverse the removal procedure. DIMMs To remove the component: Power down the server (on page 26).
Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. To remove the component: Power down the server (on page 26).
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Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
IMPORTANT: Processor socket 1 must be populated at all times or the server does not function. In a multiprocessor configuration, to optimize system performance, HP recommends balancing the total capacity of the DIMMs across the processors. To remove the component: Power down the server (on page 26).
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Remove the server from the rack (on page 27). Remove the access panel ("Access panel" on page 33). Remove the air baffle (on page 28). Remove the heatsink: Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence.
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CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. Remove the processor from the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
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To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
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Slot 1 Slot 2 Slot 3 To replace the component, reverse the removal procedure. Removal and replacement procedures 53...
PCI blank To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 27).
Remove the access panel ("Access panel" on page 33). Disconnect all cables connected to existing expansion boards. Remove all expansion boards ("Expansion board" on page 52). Hold the ends of the riser cage and lift up. Remove the screws, then remove the riser board from the cage. To replace the component, reverse the removal procedure.
Remove the server from the rack (on page 27). Remove the access panel ("Access panel" on page 33). Disconnect all cables connected to existing expansion boards. Remove the PCI riser cage (on page 28). Remove any existing expansion board from the riser board. Remove the riser board from the cage.
Remove the server from the rack (on page 27). Remove the access panel ("Access panel" on page 33). Disconnect all cables connected to existing expansion boards. Remove the FlexibleLOM riser cage. Remove the FlexibleLOM adapter from the riser cage. To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock.
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Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HP UEFI System Utilities" on page 73) to reconfigure the system. Removal and replacement procedures 58...
To replace the component: Insert the battery with the "+" side facing up underneath the outer lip of the socket, and then press the battery down to secure it in place. Install any expansion boards that have been removed. Install the access panel. Do one of the following: Slide the server into the rack.
Disconnect the cables for the front I/O module and then remove the front I/O module from the system board. To replace the component, reverse the removal procedure. Thumbscrew rack ear assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Remove the thumbscrew rack ear assembly. To replace the component, reverse the removal procedure. Quick-release latch rack ear assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the PCI riser cages ("Remove the PCI riser cage" on page 28). Disconnect all cables connected to the system board. Remove the HP Smart Storage Battery ("HP Smart Storage Battery" on page 36). Remove all DIMMs ("DIMMs" on page 43).
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Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
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Remove the processor from the processor retaining bracket. CAUTION: When returning a damaged system board to HP, always install all processor socket covers to prevent damage to the processor sockets and system board. Remove the system board: Remove the system board screws.
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To replace the system board assembly: Install the system board assembly. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 65...
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Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can damage the processor and socket, requiring system board replacement. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.
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Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence. Install the fans. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board.
Press the Enter key to clear the warning. Enter the serial number and press the Enter key. Select Product ID. The following warning appears: Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.
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33). Disconnect all power supply cables from the system board and any associated component (drive backplane, GPU, etc.). Remove the power supply. HP 550 W non-hot-plug power supply HP 900 W hot-plug power supply Removal and replacement procedures 70...
If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.
• Simplified Chinese (http://www.hp.com/support/Gen9_TSG_zh_cn) The HP ProLiant Gen9 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: •...
Diagnostic tools HP UEFI System Utilities The HP UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including: • Configuring system devices and installed options •...
OS installation if the defaults are restored. To avoid this issue, use the User Defined Defaults feature in UEFI System Utilities to override the factory default settings. For more information, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs).
Embedded UEFI shell The system BIOS in all HP ProLiant Gen9 servers includes an Embedded UEFI Shell in the ROM. The UEFI Shell environment provides an API, a command line prompt, and a set of CLIs that allow scripting, file manipulation, and system information.
HP ProLiant Pre-boot Health Summary. For additional information, see the HP iLO 4 User Guide on the HP website (http://www.hp.com/go/ilo) or the HP ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting.
HP Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system. The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy).
USB support HP servers support both USB 2.0 ports and USB 3.0 ports. Both types of ports support installing all types of USB devices (USB 1.0, USB 2.0, and USB 3.0), but may run at lower speeds in specific situations: •...
The pre-OS behavior of the USB ports is configurable in System Utilities, so that the user can change the default operation of the USB ports. For more information, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs).
Component identification Front panel components Item Description Optical drive (optional) Serial label pull tab* USB 2.0 connector LFF drives * The serial number/iLO information pull tab is double-sided. The top side shows the server serial number and the customer asset tag label. The reverse side shows the default iLO account information and QR code linking to product documentation resources.
Item Description Status UID LED Solid blue = Activated Flashing blue: • 1 Hz/cycle per sec = Remote management or firmware upgrade in progress • 4 Hz/cycle per sec = iLO manual reboot sequence initiated • 8 Hz/cycle per sec = iLO manual reboot sequence in progress Off = Deactivated NIC link LED...
Fan 6 connector Fan 5 connector Fan 4 connector Fan 3 connector Fan 2 connector Fan 1 connector HP Smart Storage Battery connector 6-pin drive backplane power connector Internal USB 3.0 connector 24-pin power connector 16-pin PS connector Mini-SAS connector 1...
* For more information on the riser board slots supported by the onboard PCI riser connectors, see "PCIe riser board slot definitions (on page 83)." DIMM slot locations DIMM slots are numbered sequentially (1 through 4) for each processor. The supported AMP modes use the letter assignments for population guidelines.
IMPORTANT: Before using the S7 switch to change to Legacy BIOS Boot Mode, be sure the HP Dynamic Smart Array B140i Controller is disabled. Do not use the B140i controller when the server is in Legacy BIOS Boot Mode.
Drive numbering HP SmartDrive LED definitions HP SmartDrives are the latest HP drive technology, and they are supported beginning with ProLiant Gen8 servers and server blades. The HP SmartDrive is not supported on earlier generation servers and server blades. Identify an HP SmartDrive by its carrier, shown in the following illustration.
The blue Locate LED is behind the release lever and is visible when illuminated. IMPORTANT: The HP Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode.
For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
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• Four-bay LFF drive backplane connected to a P440 controller in the low-profile expansion slot 1 Item Description Drive power cable Mini-SAS cable • Four-bay LFF drive backplane connected to a H240 adapter in the low-profile expansion slot 1 Item Description Drive power cable Mini-SAS cable...
FBWC cabling The FBWC solution is a separately purchased option. This server only supports FBWC module installation when an HP Smart Array P-Series controller is installed. Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section.
HP Power supply cabling • HP 550 W non-hot-plug power supply cabling Item Description 16-pin power supply sideband signal cable 24-pin power supply cable • HP 900 W hot-plug power supply cabling Item Description 16-pin power supply sideband signal cable...
40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft). The approved hardware configurations for this system are listed on the HP website (http://www.hp.com/servers/ASHRAE).
HP 550 W Power Supply (PN 730941-B21) • HP 900 W AC Power Input Module (PN 744689-B21) This module is supported when the two-bay HP RPS backplane option (PN 745813-B21) is installed. For more information about the power supply features, specifications, and compatibility, see the HP website (http://www.hp.com/go/proliant/powersupply).
Advanced Memory Protection application program interface ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers Customer Self Repair FBWC flash-backed write cache graphics processing unit host bus adapter HP SIM HP Systems Insight Manager hertz Integrated Lights-Out Acronyms and abbreviations 98...
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PCIe Peripheral Component Interconnect Express POST Power-On Self Test power supply unit RBSU ROM-Based Setup Utility redundant power supply serial attached SCSI SATA serial ATA Secure Digital Systems Insight Manager HP Service Pack for ProLiant Acronyms and abbreviations 99...
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Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification universal serial bus Acronyms and abbreviations 100...
Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.
32 hot-swap fan 42 drive cabling 89 HP Insight Diagnostics 76 drive carrier 30 HP Insight Diagnostics survey functionality 76 drive numbering 87 HP ProLiant Pre-boot Health Summary 76 drives, determining status of 87 HP RESTful API 75...
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HP Smart Storage Battery cabling 93 optical drive 80 HP SmartDrive LED definitions 87 optical drive cabling 95 HP Systems Insight Manager (SIM) 76, 78 HP technical support 6 HP Trusted Platform Module option 71 PCI riser board slot definitions 83...
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static electricity 23 storage controller 86, 89 symbols on equipment 23 system battery 57 system board 62 system board components 84 system components 80 system configuration settings 86 system maintenance switch 86 technical support 6 temperature requirements 96 TPM connector 84 troubleshooting resources 72 Trusted Platform Module (TPM) 71 UEFI System Utilities 73...