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HPE ProLiant DL60 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
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• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
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NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
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Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
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deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución.
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Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise.
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Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair). Serviço de garantia apenas para peças A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças.
Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part Customer self number repair (on page Access panel 790493-001 Mandatory Processor blank...
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No—Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog. Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations.
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Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. Não—Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente.
System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part Customer self number repair (on page System boards (includes alcohol pad and thermal compound) — —...
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Item Description Spare part Customer self number repair (on page a) 1.6-GHz Intel Xeon E5-2603 v3, 6C, 85 W** 762441-001 Optional b) 1.8-GHz Intel Xeon E5-2650L v3, 12C, 65 W* ** 762461-001 Optional c) 1.8-GHx Intel Xeon E5-2630L v3, 8C, 55W* ** 762459-001 Optional d) 1.9-GHz Intel Xeon E5-2609 v3, 6C, 85 W* **...
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remplacement de ces pièces par Hewlett Packard Enterprise dépendent du type de service de garantie désigné pour votre produit. Non—Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour être remplacées par le client. Afin de se conformer aux exigences de la garantie la garantie du client, Hewlett Packard Enterprise demande à un fournisseur de services agréé...
Removal and replacement procedures Required tools You need the following items for some procedures: • T-25 Torx screwdriver (for screws located inside the front panel quick-release levers) • T-10/T-15 Torx screwdriver • Flathead screwdriver (for replacing the system battery) • HPE Insight Diagnostics (on page 84) Safety considerations Before performing service procedures, review all the safety information.
This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.
For more information about Telco rack solutions, see the RackSolutions website (http://www.racksolutions.com/hp). • Access the product rear panel (on page 30).
To access the front panel components, unlock and then remove the security bezel. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server.
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WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is adequately stabilized before extending a component from the rack. WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release latches and sliding the server into the rack.
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Slide the server out of the enclosure. iii. After performing the installation or maintenance procedure, slide the server back into the enclosure, and then press the server firmly into the enclosure to secure it in place. Do one of the following: In a server that uses thumbscrew rack ears, tighten the captive thumbscrews.
Access the product rear panel Opening the cable management arm To access the server rear panel: Release the cable management arm. Open the cable management arm. The cable management arm can be right-mounted or left-mounted. Remove the server from the rack Removal and replacement procedures 30...
WARNING: This server is very heavy. To reduce the risk of personal injury or damage to the equipment: • Observe local occupational health and safety requirements and guidelines for manual material handling. • Get help to lift and stabilize the product during installation or removal, especially when the product is not fastened to the rails.
Remove the PCI riser cage WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to the server or expansion boards, power down the server, and disconnect all power cords before removing or installing the PCI riser cage.
Remove any expansion boards installed in the primary riser cage. Remove the primary PCI riser cage. Non-hot-plug drive carrier CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Power down the server (on page 27).
Remove the drive carrier. To replace the component, slide the component into the bay until it clicks. Non-hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Back up all server data on the drive.
Remove the drive from the carrier. To replace the component, reverse the removal procedure. Hot-plug drive blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: If installed, remove the security bezel ("Remove the security bezel...
Remove the hot-plug drive. To replace the component, reverse the removal procedure. Access panel To remove the component: WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Do not operate the server for long periods with the access panel open or removed.
If the access panel latch is locked, use a T-15 Torx screwdriver to unlock the latch. To replace the component, reverse the removal procedure. Four-bay LFF non-hot-plug drive backplane To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source.
Remove the non-hot-plug drive backplane. To replace the component, reverse the removal procedure. Four-bay LFF hot-plug drive backplane To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
To replace the component, reverse the removal procedure. Smart Storage Battery For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). CAUTION: In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up.
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CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source.
Remove the cache module. To replace the component, reverse the removal procedure. M.2 SSD enablement kit M.2 SSD enablement board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
Slot 2 Slot 3 To replace the component, reverse the removal procedure. M.2 SSD module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel"...
Remove the optical drive blank To replace the component, reverse the removal procedure. Optical drive WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
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Disconnect the optical drive cable from the drive. Remove the optical drive: To replace the component, reverse the removal procedure. Removal and replacement procedures 46...
Fan and fan blank Fan population guidelines Configuration Fan bay Fan bay Fan bay Fan bay Fan bay Fan bay Blank Blank Blank One processor, non-redundant Blank One processor, redundant Blank Blank Two processors, non-redundant Two processors, redundant • In the redundant fan mode: If one fan rotor fails, the system continues to operate without redundancy.
Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Disconnect all peripheral cables and power cords from the rear panel. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).
Remove the access panel ("Access panel" on page 37). Remove the air baffle (on page 31). Disconnect the fan cable from the system board and remove the fan. CAUTION: The fan does not have a fan guard. Special attention is needed when removing or installing the fan to prevent finger injury.
Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 37). Remove any expansion board installed in slot 1 and 2. ("Expansion board" on page 58) Open the DIMM slot latches. Remove the DIMM. To replace the component, reverse the removal procedure.
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Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. Install the heatsink: Position the heatsink on the processor backplate.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel"...
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Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel"...
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Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts.
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To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Do one of the following: Slide the server into the rack. Install the server into the rack. Connect each power cord to the server. Connect each power cord to the power source.
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Remove the server from the rack (on page 30). Remove the access panel ("Access panel" on page 37). Disconnect all cables connected to existing expansion boards. Remove the PCI riser cage (on page 32). Remove the expansion board. Slot 1 Slot 2 Slot 3 Removal and replacement procedures 59...
To replace the component, reverse the removal procedure. PCI blank WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
To remove the component: Power down the server (on page 27). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30).
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WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation. Improper grounding can cause electrostatic discharge.
To replace the component, reverse the removal procedure. FlexibleLOM riser assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
Remove the FlexibleLOM adapter from the riser cage. To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, use BIOS/Platform Configuration (RBSU) in the UEFI System Utilities ("HPE UEFI System Utilities" on page 83) to reconfigure the system. To replace the component: Insert the battery with the "+"...
Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Do one of the following: Extend the server from the rack (on page 27). Remove the server from the rack (on page 30). Remove the access panel ("Access panel"...
Remove the thumbscrew rack ear assembly. To replace the component, reverse the removal procedure. Quick-release latch rack ear assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the quick-release latch rack ear assembly. To replace the component, reverse the removal procedure. System board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
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If installed, remove the processor blank. Remove the heatsink: Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
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Remove the processor from the processor retaining bracket. CAUTION: When returning a damaged system board to Hewlett Packard Enterprise, always install all processor socket covers to prevent damage to the processor sockets and system board. Remove the system board: Remove the system board screws. Lift the system board out of the chassis.
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To replace the system board assembly: Install the system board assembly. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 71...
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Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
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Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. Install the processor socket cover on the failed system board. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.
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Finish the installation by completely tightening the screws in the same sequence. Install the fans. Install all components removed from the failed system board. Connect all cables disconnected from the failed system board. Install the PCI riser cages. Install the air baffle ("Remove the air baffle"...
Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis. Enter the product ID and press the Enter key. Press the F10 key to confirm exiting System Utilities. The server automatically reboots. HPE 550-W Power Supply WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Remove the non-hot-plug power supply. To replace the component, reverse the removal procedure. Redundant power supply components Power input module and RPS backplane characteristics • HPE 800 W/900 W Gold AC Power Input Module (744689-B21) This module is compatible with the AC RPS backplane (745813-B21). The module wattage rating changes depending on whether one or two power input modules are installed in the server: —...
Remove the power input module. To replace the component, reverse the removal procedure. Redundant power supply backplane WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Disconnect the RPS backplane cables. Release the RPS backplane cables from the cable clips. Remove the RPS backplane. To replace the component, reverse the removal procedure. HP Trusted Platform Module The TPM is not a customer-removable part. Removal and replacement procedures 78...
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CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data.
Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...
Diagnostic tools Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). HPE iLO The iLO 4 subsystem is a standard component of ProLiant servers that simplifies initial server setup, server health monitoring, power and thermal optimization, and remote server administration.
• Rich configuration history • Health and service alerts • Easy export and upload to Service and Support The Active Health System monitors and records changes in the server hardware and system configuration. The Active Health System assists in diagnosing problems and delivering rapid resolution if server failures occur.
Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity. You can view recorded events in the IML in several ways, including the following: • From within HPE SIM •...
• Upon the first system power-up • After defaults have been restored Default configuration settings are sufficient for typical server operations; however, you can modify configuration settings as needed. The system prompts you for access to the UEFI System Utilities each time the system is powered up.
HPE Insight Diagnostics survey functionality HPE Insight Diagnostics (on page 84) provides survey functionality that gathers critical hardware and software information on ProLiant servers. This functionality supports operating systems that are supported by the server. For operating systems supported by the server, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/supportos).
• Enabled—If Enabled, USB 3.0 capable devices operate at USB 3.0 speeds at all times (including the pre-boot environment) when in UEFI Boot Mode. This mode should not be used with operating systems that do not support USB 3.0. If operating in Legacy Boot BIOS Mode, the USB 3.0 ports cannot function in the pre-boot environment and are not bootable.
Component identification Front panel components Item Description Optical drive (optional) Serial label pull tab The serial number/iLO information pull tab is double-sided. The top side shows the server serial number and the customer asset tag label. The reverse side shows the default iLO account information and QR code label.
Front panel LEDs and buttons Item Description Status UID button/LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated •...
Front panel LED power fault codes The following table provides a list of power fault codes, and the subsystems that are affected. Not all power faults are used by all servers. Subsystem Front panel LED behavior 1 flash System board 2 flashes Processor 3 flashes...
Rear panel LEDs Item Description Status UID LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated • 8 flashes per second = iLO manual reboot sequence in progress Off = Deactivated NIC link LED...
DIMM slot locations DIMM slots are numbered sequentially (1 through 4) for each processor. The supported AMP modes use the letter assignments for population guidelines. The arrow points to the front of the server. System maintenance switch Position Default Function Off = iLO 4 security is enabled.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. Before using the S7 switch to change the boot mode to Legacy BIOS Mode, you must first disable the Dynamic Smart Array B140i Controller. To disable the Dynamic Smart Array B140i Controller: Reboot the server.
Hot-plug drive LED definitions Item Status Definition Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Activity ring Rotating green Drive activity No drive activity Do not remove Solid white Do not remove the drive.
Cabling Cabling overview This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, refer to the white paper on high-density deployment at the Hewlett Packard Enterprise website (http://www.hpe.com/info/servers). CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• Four-bay LFF drive backplane connected to a P440 controller in the low-profile expansion slot 1 Item Description Drive power cable Mini-SAS cable • Four-bay LFF drive backplane connected to a H240 adapter in the low-profile expansion slot 1 Item Description Drive power cable Mini-SAS cable...
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Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section. • FBWC module slot 1 cabling • FBWC module slot 2 cabling Cabling 99...
Power supply cabling • HPE 550 W non-hot-plug power supply cabling Item Description 16-pin power supply sideband signal cable 24-pin power supply cable • HPE Redundant Power Supply cabling Item Description 16-pin power supply sideband signal cable 24-pin power supply cable Reserved Cabling 104...
Specifications Environmental specifications Specification Value — Temperature range* 10°C to 35°C (50°F to 95°F) Operating -30°C to 60°C (-22°F to 140°F) Nonoperating — Relative humidity (noncondensing) Minimum to be the higher (more moisture) of Operating -12°C (10.4°F) dew point or 8% relative humidity Maximum to be 24°C (75.2°F) dew point or 90% relative humidity...
• HPE 800 W/900 W Gold AC Power Input Module (PN 744689-B21) • HPE 900 W AC/240 V DC Gold Power Input Module (PN 775595-B21) For more information about the compatibility between the power input module and RPS backplane types, see "Power input module and RPS backplane characteristics (on page 76)."...
Acronyms and abbreviations ABEND abnormal end alternating current Advanced Memory Protection application program interface ASHRAE American Society of Heating, Refrigerating and Air-Conditioning Engineers Customer Self Repair FBWC flash-backed write cache graphics processing unit host bus adapter HPE SIM HPE Systems Insight Manager hertz Integrated Lights-Out Integrated Management Log...
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large form factor nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express POST Power-On Self Test power supply unit RBSU ROM-Based Setup Utility redundant power supply serial attached SCSI SATA serial ATA Secure Digital Systems Insight Manager Service Pack for ProLiant Trusted Platform Module UEFI Unified Extensible Firmware Interface...
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unit identification universal serial bus Acronyms and abbreviations 110...
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rear panel components 88 rear panel LEDs 89 LEDs, drive 93 rear panel, accessing 29 LEDs, front panel 93 redundant power supply 75, 76, 105 LEDs, power fault 88 re-entering the server serial number 83 legacy USB support 84 remote support and analysis tools 84 removal and replacement procedures 23 remove server from rack 29 required tools 23...