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CLM920 TD3 LTE Module Hardware Usage Guide
Chapter 7 Packaging and production
7.1 Chapter overview
Module packaging and storage
Production welding
7.2 Module packaging and storage
The CLM920 TD3 module is packaged in a tray and packaged in a vacuum sealed bag,
with a 10PCS package and a 100PCS package, shipped as a vacuum sealed bag.
The storage of the CLM920 TD3 module module is subject to the following conditions:
The module has a moisture sensitivity rating of 3.
When the ambient temperature is greater than 40 degrees Celsius and the air
humidity is less than 90%, the module can be stored in a vacuum sealed bag for 12 months.
When the vacuum sealed bag is opened, if the ambient temperature of the module is
lower than 30 degrees Celsius and the air humidity is less than 60%, the factory can complete
the patch within 72 hours, and the module can directly perform reflow soldering or other high
temperature process.
If the module is in other conditions, it needs to be baked before the patch.
If the module needs to be baked, please remove the module and bake it for 8 hours at
125 degrees Celsius (allowing fluctuations of up to 5 degrees Celsius).
7.3 Production welding
The CLM920 TD3 module is packaged in an anti-static tray. The SMT line body needs to
be equipped with a Tray module. It is recommended to use a reflow oven above 7 temperature
zones.
To ensure the quality of the module paste, the thickness of the stencil corresponding
to the pad portion of the CLM920 TD3 module is recommended to be 0.18 mm.
The recommended reflow temperature is 235~245oC, which cannot exceed 260oC.
When the PCB is laid out on both sides, the LGA module layout must be machined
on the second side. Avoid module falling parts, welding and welding, and poor internal
welding of the module caused by the gravity of the module.
Shanghai Yuge Information Technology co., LTD
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