Table of Contents
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CLM920 TD3 LTE Module Hardware Usage Guide
Figure 3-22 I2C interface reference circuit diagram............................................................ - 46 -
Figure 3-23 SD card interface reference circuit diagram..................................................... - 50 -
Figure 3-24 I2S to analog voice map................................................................................... - 52 -
Figure 3-25 Wireless connection interface and YG30 reference design.............................. - 54 -
Figure 3-26 Schematic diagram of the Ethernet application solution.................................. - 56 -
Figure 3-27 SGMII interface and Ethernet PHY core AR8033 reference design................ - 56 -
Figure 3-28 Main antenna matching circuit......................................................................... - 57 -
Figure 3-29 Diversity Antenna Matching Circuit.................................................................- 58 -
Figure 3-30 GNSS passive antenna reference circuit...........................................................- 58 -
Figure 3-31 GNSS active antenna reference circuit............................................................. - 59 -
Figure 3-32 The complete structure of the two-layer PCB microstrip line.......................... - 60 -
Figure 3-33 The complete structure of the multilayer PCB strip line.................................. - 60 -
Figure 3-34 Reference ground is the third layer PCB microstrip transmission line structure- 61 -
Figure 3-35 RF connector size chart.................................................................................... - 61 -
Figure 3-36 Antenna connector matching plug diagram...................................................... - 62 -
Figure 3-37 Matching coaxial RF line size.......................................................................... - 62 -
Figure 6-1 Appearance of the CLM920 TD3....................................................................... - 75 -
Figure 6-2 Front view and side view of the module (unit: mm).......................................... - 75 -
Figure 6-3 Bottom view of the module (unit: mm).............................................................. - 76 -
Figure 6-4 Recommended module package (unit: mm)....................................................... - 77 -
Figure 7-1 Reflow soldering temperature graph.................................................................. - 79 -
Table index
Table 2-1 List of module bands............................................................................................ - 10 -
Table 2-2 Key Features.........................................................................................................- 12 -
Table 3-1 Pin definitions...................................................................................................... - 17 -
Table 3-2 IO parameter definition........................................................................................ - 20 -
Table 3-3 Pin description......................................................................................................- 20 -
Table 3-4 Power pin definitions........................................................................................... - 28 -
Table 3-5 Switching machine pin definition........................................................................ - 31 -
Table 3-6 Boot timing parameters........................................................................................ - 32 -
Table 3-7 Reset foot definition............................................................................................. - 33 -
Table 3-8 RESET pin parameters......................................................................................... - 34 -
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