Hp proliant dl/ml370 g6 server user guide (153 pages)
Summary of Contents for HP ProLiant ML30 Gen9
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HPE ProLiant ML30 Gen9 Server Maintenance and Service Guide Abstract This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
System battery ............................... 51 350W E1.0/E2.0 power supply ..........................52 Redundant power supply assembly ........................53 System board ................................. 55 HP Trusted Platform Module ..........................61 Troubleshooting ............................62 Troubleshooting resources ............................. 62 Diagnostic tools ............................63 Product QuickSpecs ............................... 63 HPE iLO .................................
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Embedded Diagnostics option ........................64 Re-entering the server serial number and product ID ................. 65 Insight Diagnostics ..............................65 Insight Diagnostics survey functionality ....................... 65 HPE Insight Remote Support ..........................66 HPE Insight Remote Support central connect ..................... 66 HPE Insight Online direct connect ....................... 66 Insight Online...............................
Customer self repair Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement.
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• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés. • Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation.
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NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.
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Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen.
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deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución.
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Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt gebruikt. Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise.
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Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair). Serviço de garantia apenas para peças A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças.
Illustrated parts catalog Mechanical components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part number Customer self repair (on page 5) Air baffle 825097-001 Mandatory...
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Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. No—Some Hewlett Packard Enterprise parts are not designed for customer self repair.
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Obrigatório—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente.
System components Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the Hewlett Packard Enterprise PartSurfer website (http://www.hpe.com/info/partssurfer). Item Description Spare part Customer self repair number (on page 5) HPE 460 W CS Gold Hot Plug Power Supply 511777-001 Mandatory HPE Redundant power supply cage 686665-001...
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Spare part Customer self repair Item Description number (on page 5) c) 3TB 6G SATA 7.2k 3.5in NHP ETY HDD* 815660-001 Mandatory d) 1TB 6G SATA 3.5in NHP MDL HDD* 659569-001 Mandatory e) 2TB 6G SATA 3.5in NHP MDL HDD* 659570-001 Mandatory f) 3TB 6G SATA 3.5in NHP MDL HDD*...
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Spare part Customer self repair Item Description number (on page 5) j) 2TB 6G SAS 7.2k 3.5in SC MDL HDD* 653948-001 Mandatory k) 3TB 6G SAS 7.2k 3.5in SC MDL HDD* 653959-001 Mandatory l) 4TB 6G SAS 7.2k 3.5in DP MDL SC HDD* 695842-001 Mandatory Hot-plug SFF SATA hard drives —...
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Spare part Customer self repair Item Description number (on page 5) a) PCI riser with one 120 GB SSD M.2 797907-001 Mandatory module and SATA cable* b) PCI riser with two 120 GB SSD M.2 797908-001 Mandatory module and SATA cables* Cables —...
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Obligatorio—Componentes cuya reparación por parte del usuario es obligatoria. Si solicita a Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio. Opcional—Componentes cuya reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario.
Removal and replacement procedures Required tools You need the following items for some procedures: • T-10/T-15 Torx screwdriver • Flathead screwdriver • HPE Insight Diagnostics ("Insight Diagnostics" on page 65) Safety considerations Before performing service procedures, review all the safety information. Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you must follow when setting up the system or handling parts.
This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists. WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching. This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.
Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. To power down the server, use one of the following methods: • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
Pull the bezel away from the front chassis. To replace the component, reverse the removal procedure. Air baffle To remove the component: CAUTION: For proper cooling, do not operate the server without the access panel, baffles, expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.
Remove the air baffle. To replace the component, reverse the removal procedure. Drives Hot-plug drive blanks CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. To remove the component: Remove the bezel ("Unlock and remove the...
Hot-plug SFF drive blank To replace the SFF drive blank, while pressing the release latch, slide the component into the bay until it is fully seated. Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
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WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.
Remove the drive backplane. To replace the component, reverse the removal procedure. Eight-bay SFF hot-plug drive backplane assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the drive cage. Remove the drive backplane. To replace the component, reverse the removal procedure. Replacing a drive in the non-hot-plug drive cage To remove the component: Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server.
Remove the drive cage. Remove the drive from the drive cage. To replace the component, reverse the removal procedure. Replacing a drive in the drive enablement option CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
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Remove the access panel ("Removing the access panel" on page 26). Disconnect the cables from the drive. Remove the drive carrier. Removal and replacement procedures 35...
Remove the drive from the drive carrier. To replace the component, reverse the removal procedure. M.2 SSD enablement kit M.2 SSD enablement assembly WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any system installation.
Disconnect the SATA cables from the enablement board. Disconnect the other end of the SATA cables from the system board. Remove the M.2 SSD enablement board. To replace the component, reverse the removal procedure. M.2 SSD module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them.
Power down the server (on page 26). Remove all power: Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove the access panel ("Removing the access panel" on page 26). Remove the M.2 SSD enablement assembly ("M.2 SSD enablement assembly"...
Remove the media bay blank. To replace the component, reverse the removal procedure. Front I/O assembly CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Power down the server (on page 26).
Disconnect the front I/O module cables from the system board. Remove the front I/O module. To replace the component, reverse the removal procedure. Smart Storage Battery WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Disconnect each power cord from the power source. Disconnect each power cord from the server. Remove the bezel ("Unlock and remove the bezel" on page 26). Remove the access panel ("Removing the access panel" on page 26). Remove the air baffle ("Air baffle"...
Access the bottom of the server and push the latches inwards to release the holders. Remove the Smart Storage Battery holders. To replace the component, reverse the removal procedure. System fan CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.
Remove the access panel ("Removing the access panel" on page 26). Remove the air baffle ("Air baffle" on page 28). Remove any existing expansion boards which block access to the rear system fan connector. Remove the system fan: Disconnect the fan power cable. Remove the screws from the rear panel.
Press and hold the fan latch, then remove the fan. To replace the component, reverse the removal procedure. DIMMs WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure.
Remove the DIMM. To replace the component, reverse the removal procedure. Heatsink CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them.
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Remove the heatsink from the processor backplate. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board.
Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install the access panel. Return the server to an upright position. Lock the tower bezel. Connect each power cord to the server. Connect each power cord to the power source. Press the Power On/Standby button.
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Remove the access panel ("Removing the access panel" on page 26). Remove the air baffle ("Air baffle" on page 28). Remove the heatsink ("Heatsink" on page 45). CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.
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Install the processor. Use the notches on both sides of the processor to properly align it into the socket. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement.
CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board. Install the heatsink: Position the heatsink using the guide pin on the processor backplate. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence.
Remove the expansion board. To replace the component, reverse the removal procedure. System battery If the server no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.
Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
Push the power supply towards the front of the chassis, and then remove it. To replace the component, reverse the removal procedure. Redundant power supply assembly To remove the component: Power down the server (on page 26). WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or power supply blank to cool before touching it.
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Disconnect all power supply cables from the system board, drive cages, and devices. Remove the EMI shield. Remove the RPS backplane. Remove the RPS cage. Remove the four screws securing the RPS cage Press and hold the release button on the inside panel of the chassis. Removal and replacement procedures 54...
Push the RPS cage towards the front of the chassis, and then remove it. To replace the component, reverse the removal procedure. System board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives, power input modules, and the internal system components to cool before touching them. CAUTION: To avoid ESD damage, when removing electrostatic-sensitive components from the failed system board, place the components on a static-dissipating work surface or inside separate antistatic bags.
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Remove the heatsink from the processor backplate. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. CAUTION: The pins on the processor socket are very fragile. Any damage to them may require replacing the system board.
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Lift the system board out of the chassis. To replace the system board: Install the new system board. Install the DIMMs. Install the expansion boards. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area.
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Open the processor locking lever, and then open the processor retaining bracket. Remove the processor socket cover. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Do not touch the processor socket contacts. •...
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Install the processor. Use the notches on both sides of the processor to properly align it into the socket. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement.
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CAUTION: Do not overtighten the screws as this might damage the board, connectors, or screws and voids the warranty of the board. Install the heatsink: Position the heatsink using the guide pin on the processor backplate. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence.
Enter the product ID and press the Enter key. To confirm exiting System Utilities, press the F10 key. The server automatically reboots. HP Trusted Platform Module The TPM is not a customer-removable part. CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.
Troubleshooting Troubleshooting resources The HPE ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: •...
Diagnostic tools Product QuickSpecs For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs). HPE iLO iLO is a remote server management processor embedded on the system boards of HPE ProLiant and Synergy servers.
• iLO 4 User Guide — See the Hewlett Packard Enterprise website (http://www.hpe.com/info/ilo/docs). • ProLiant Gen9 Troubleshooting Guide, Volume I: Troubleshooting — See "Troubleshooting Resources (on page 62)." Integrated Management Log The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.
Re-entering the server serial number and product ID After you replace the system board, you must re-enter the server serial number and the product ID: During the server startup sequence, press the F9 key to access UEFI System Utilities. Select System Configuration > BIOS/Platform Configuration (RBSU) > Advanced Options > Advanced System ROM Options >...
HPE Insight Remote Support Hewlett Packard Enterprise strongly recommends that you register your device for remote support to enable enhanced delivery of your Hewlett Packard Enterprise warranty, HPE support services, or Hewlett Packard Enterprise contractual support agreement. Insight Remote Support supplements your monitoring continuously to ensure maximum system availability by providing intelligent event diagnosis, and automatic, secure submission of hardware event notifications to Hewlett Packard Enterprise, which will initiate a fast and accurate resolution, based on your product’s service level.
• USB 3.0 capable devices operate at USB 2.0 speeds when installed in a USB 2.0 port. • Hewlett Packard Enterprise provides legacy USB support in the pre-boot environment prior to the operating system loading for USB 1.0, USB 2.0, and USB 3.0 speeds in both the UEFI Boot Mode and the Legacy Boot Mode.
Component identification Front panel components Item Description Media drive bays USB 3.0 connectors Drive cage bay Front panel LEDs and buttons Component identification 68...
Item Description Status UID button/LED* Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated • 8 flashes per second = iLO manual reboot sequence in progress Off = Deactivated Power On/Standby button Solid green = System on...
Rear panel LEDs and buttons Item Description Status UID LED Solid blue = Activated Flashing blue: • 1 flash per second = Remote management or firmware upgrade in progress • 4 flashes per second = iLO manual reboot sequence initiated •...
Item Description System fan connector 4-pin power connector * For more information on the expansion slot specifications, see "PCIe expansion slot definitions (on page 73)." DIMM slot locations The arrow points toward the front of the server. DIMM slots are numbered 1 through 4. Letters are used for AMP mode DIMM ordering. PCIe expansion slot definitions Slot number Type Length...
Position Default Function • Off = System configuration can be changed. • On = System configuration is locked. Reserved Reserved • Off = Power-on password is enabled. • On = Power-on password is disabled. • Off = No function. • On = ROM reads system configuration as invalid.
• Eight-bay SFF hot-plug drive numbering Hot-plug drive LED definitions When a drive is configured as a part of an array and connected to a powered-up controller, the drive LEDs indicate the status of the drive. Item Status Definition Locate Solid blue The drive is being identified by a host application.
Item Status Definition Solid amber The drive has failed. The drive is not configured by a RAID controller. IMPORTANT: The Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode.
Cabling Cabling overview This section provides guidelines to help make informed decisions about cabling the server and hardware options to optimize performance. For information on cabling peripheral components, see the white paper on high-density deployment at the Hewlett Packard Enterprise website. (http://www.hpe.com/products/servers/platforms) CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
• Drive enablement option to redundant power supply Item Description SATA cable Drive power cable Tape drive option cabling • Tape drive option to 350W power supply Item Description USB cable Drive power cable Power extension cable Power supply cable Cabling 79...
• Tape drive option to redundant power supply Item Description USB cable Drive power cable Power supply cable Four-bay LFF non-hot-plug drive cage cabling Item Description Power cable 10-pin to 8-pin power extension cable Mini-SAS cable Cabling 80...
M.2 SSD cabling Item Description M.2 SSD 1 SATA cable M.2 SSD 2 SATA cable Slim optical disk drive cabling • Slim optical disk drive to 350W power supply Item Description Optical disk drive power cable SATA cable 4-pin power cable to 4-pin power supply extension cable Cabling 83...
• Slim optical disk drive to redundant power supply Item Description Optical disk drive power cable SATA cable 4-pin power cable to 4-pin power supply extension cable Front I/O module cabling Item Description Front I/O cable Front USB cable Front USB cable Cabling 84...
Item Description 4-pin power cable 24-pin power cable • Eight-bay SFF hot-plug drive configuration Item Description 8-pin drive power cable 4-pin power cable 24-pin power cable Redundant power supply cabling • Four-bay LFF non-hot-plug drive configuration Cabling 88...
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Item Description 24-pin power supply cable 4-pin power supply cable RPS sideband signal cable 10-pin to 8-pin power supply cable • Four-bay LFF hot-plug drive configuration Item Description 24-pin power supply cable 4-pin power supply cable RPS sideband signal cable 10-pin to 8-pin power supply cable •...
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Item Description 24-pin power supply cable 4-pin power supply cable RPS sideband signal cable 10-pin to 8-pin power supply cable Cabling 90...
Specifications Environmental specifications Specification Value Temperature range* 10° C to 35° C (50° F to 95° F) Operating -30° C to 65° C (-22° F to 149° F) Nonoperating Relative humidity (noncondensing) 10% to 90% Operating, maximum wet bulb temperature of 28°C (82.4°F) 0% to 95% Nonoperating, maximum wet bulb temperature of 38.7°C...
HPE 350 W Power Supply (E-star 1.0) Specification Value — Input requirements 100 V AC to 240 V AC Rated input voltage 47 Hz to 63 Hz Rated input frequency 6 A to 3 A Rated input current 427 W at 115 V AC input Rated input power 427 W at 240 V AC input No less than 82% at 100% load...
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— Power supply output 460 W at 100 V to 120 V AC input Rated steady-state power 460 W at 200 V to 240 V AC input 460 W at 100 V to 120 V AC input Maximum peak power 460 W at 200 V to 240 V AC input 460 W Rated output power...
Automatic Server Recovery BSMI Bureau of Standards, Metrology and Inspection Conformité Européenne (European Conformity) Canadian Standards Association Customer Self Repair electromagnetic interference electrostatic discharge FBWC flash-backed write cache Federal Communications Commission HP SUM HP Smart Update Manager Acronyms and abbreviations 94...
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HPE SIM HPE Systems Insight Manager International Electrotechnical Commission Integrated Lights-Out Integrated Management Log International Organization for Standardization large form factor LRDIMM load reduced dual in-line memory module nonmaskable interrupt NVRAM nonvolatile memory PCIe Peripheral Component Interconnect Express power distribution unit POST Power-On Self-Test RBSU...
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radio frequency redundant power supply serial attached SCSI SATA serial ATA Secure Digital small form factor Systems Insight Manager Service Pack for ProLiant TMRA recommended ambient operating temperature Trusted Platform Module UDIMM unregistered dual in-line memory module UEFI Unified Extensible Firmware Interface unit identification universal serial bus Version Control Agent...
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VCRM Version Control Repository Manager xHCI Extensible Host Controller Interface Acronyms and abbreviations 97...
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