Reliability; Thermal Considerations For Components - Intel D815EEA Technical Product Specification

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Intel Desktop Board D815EEA Technical Product Specification
Table 55 provides maximum case temperatures for D815EEA board components that are sensitive
to thermal changes. Case temperatures could be affected by the operating temperature, current
load, or operating frequency. Maximum case temperatures are important when considering proper
airflow to cool the D815EEA board.
Table 55.

Thermal Considerations for Components

Component
Intel Pentium III processor
Intel Celeron processor
Intel 82815E GMCH
Intel 82801BA ICH2
Creative Labs ES1373
For information about
Intel Pentium III processor datasheets and specification updates
Intel Celeron processor datasheets and specification updates

2.13 Reliability

The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 35 ºC.
D815EEA board MTBF: 417538 hours
82
Maximum Case Temperature
For processor case temperature, see processor
datasheets and processor specification updates
o
116 C (under bias)
o
109 C (under bias)
o
70 C
Refer to
Section 1.2, page 16
Section 1.2, page 16