Reliability; Thermal Considerations For Components - Intel D850GB Technical Product Specification

Table 53 provides maximum case temperatures for D850GB board components that are sensitive
to thermal changes. Case temperatures could be affected by the operating temperature, current
load, or operating frequency. Maximum case temperatures are important when considering proper
airflow to cool the D850GB board.
Table 53.

Thermal Considerations for Components

Component
Intel Pentium 4 processor
Intel 82850 MCH
Intel 82801BA ICH2
For information about
Intel Pentium 4 processor datasheets and specification updates

2.13 Reliability

The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 55 ºC.
D850GB board MTBF: 104769.75 hours
Maximum Case Temperature
For processor case temperature, see processor
datasheets and processor specification updates
o
105 C (under bias)
o
109 C (under bias)
Technical Reference
Refer to
Section 1.2, page 16
77