SECTION 1
SPECIFICATIONS
SECTION 2
INSIDE VIEWS
SECTION 3
DISASSEMBLY INSTRUCTIONS
SECTION 4
4 - 1
RECEIVER CIRCUITS ................................................................................................... 4 - 1
4 - 2
TRANSMITTER CIRCUITS ............................................................................................ 4 - 2
4 - 3
PLL CIRCUITS ................................................................................................................ 4 - 3
4 - 4
OTHER CIRCUITS ......................................................................................................... 4 - 4
4 - 5
POWER SUPPLY CIRCUITS ......................................................................................... 4 - 4
4 - 6
PORT ALLOCATIONS .................................................................................................... 4 - 4
SECTION 5
5 - 1
PREPARATION ................................................................................................................ 5 - 1
5 - 2
SOFTWARE ADJUSTMENT .......................................................................................... 5 - 4
SECTION 6
SECTION 7
MECHANICAL PARTS AND DISASSEMBLY
SECTION 8
SEMICONDUCTOR INFORMATION
SECTION 9
BOARD LAYOUTS
SECTION 10
BLOCK DIAGRAM
SECTION 11
VOLTAGE DIAGRAM
SECTION 12
BC-166 INFORMATION
TABLE OF CONTENTS