Omron E3X-NA Manual page 10

Note: 1 . Free-cut indicates a unit that can be cut freely. The unit without the
2 . The values of the minimum sensing object for E3X-NA# (V) and E3X-NAG# through-beam models indicate those obtained where the sensing distance and
sensitivity are set to optimum values.
3 . The value of the minimum sensing object for E3X-NA#F through-beam models indicates that obtained at the rated sensing distance with the sensitivity set to
the optimum value.
4 . The size of standard sensing object is the same as the fiber core diameter (lens diameter for models with lens).
5 . The value of the minimum sensing object of the through-beam model assumes that the sensing distance and sensitivity are set to the optimum.
Grooved
Features Shape
Free-cut
Detection of film
sheet, beam
axis adjust-
ment unneces-
sary, easy
installation
Narrow vision field
Features Shape
Free-cut
Ideal for wafer
detection
3-mm dia.
Free-cut
3.5 mm dia.
x 3
Side-view
Ideal for wafer
E3X-NA
Free-cut
Compatible Sensing distance (mm)
Amplifier (Values in parentheses: when
Units (E3X-) using the E39-F1 Lens Unit)
NA#(V)
10
NAG#
10
NA#F
10
Compatible Sensing distance (mm)
Amplifier (Values in parentheses: when
Units (E3X-) using the E39-F1 Lens Unit)
NA#(V)
NA#F
300
NA#(V)
NA#F
210
mark cannot be cut freely.
Standard object (mm)
Minimum sensing object
(Opaque object) Typical
4.0 mm dia.
(0.1 mm dia.)
4.0 mm dia.
(1.0 mm dia.)
Standard object (mm)
Minimum sensing object
(Opaque object) Typical
1,000
1.7 mm dia.
(0.5 mm dia.)
2.0 mm dia.
700
(0.03 mm dia.)
2.0 mm dia.
(0.5 mm dia.)
Permissible
Model bending
radius
E32-G14
25 mm
Permissible
Model bending
radius
E32-T22S
10 mm
E32-T24S
A-73