Chapter 1 - Introduction; Specifications - DFI CR100-CRM User Manual

Chapter 1 - Introduction

Specifications

Socket G2 988B for:
Processor •
- 3rd Generation Intel
- 2nd Generation Intel
Chipset • Intel
System Memory • Two 204-pin SODIMM sockets
• Supports DDR3 SODIMM
DDR3 1066/1333/1600MHz
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM
technologies are supported for x8 and x16 devices, unbuf-
fered, non-ECC
Expansion Slots
• 1 PCIe x16 slot
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
- Configurations (supported only via a riser card):
• 2 DFI Proprietary Extension Bus for PCIe/PCI expansion
• 1 Mini PCIe slot (PCIe and USB signals)
- Supports half size Mini PCIe card
Core
®
(22nm process technology)
: Intel Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
®
: Intel Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
®
: Intel Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
®
Core
®
(32nm process technology)
: Intel Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
®
: Intel Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
®
: Intel Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
®
® ®
: Intel Celeron B810 (2M Cache, 1.6 GHz); 35W
QM77 Express chipset
®
3rd Generation Processors
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
processors
TM
processors
TM
2nd Generation Processors
DDR3 1066/1333MHz
(i5/i3/Celeron)
DDR3 1600MHz (i7)
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Introduction
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