About this Manual This manual describes the technical aspects of the XB1 COM Express Module, required for installation and system integration. It is intended for the experienced user only. Edition History Contents/Changes User Manual XB1 COM Express Module, English, initial edition (Text #4162, File: xb1_uge.wpd) Table J-COM modified (PCIe Lane #3) Illustration 'Assembly Drawing'...
Nomenclature Signal names used herein with an attached '#' designate active low lines. Trade Marks Some terms used herein are property of their respective owners, e.g. Intel, Pentium, Celeron, SpeedStep: ® Intel < PCI Express: ® PCI-SIG < <...
PICMG COM Express R1.0 (COM.0), Basic Module form factor (125x95mm Pin-out Type 2 Processor Designed for Intel® Pentium® M Micro FC-BGA 479 processors (90nm Dothan), maximum junction temperature 100°C B1-060: 600MHz ULV Celeron® M (Banias 130nm), 400MHz FSB, 512KB <...
CPU module. Alternatively equipped with the Intel series of (LV) Pentium® M and ULV Celeron® M processors and up to 2GB RAM, the EKF a versatile COM Express basic form factor...
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Benefits of the PICMG COM.0 Compliant Module Type 2 < Pentium® M 2GHz (FSB 533MHz) < < PCI Express Chipset for Embedded Applications 2 x 1GB DDR2 Memory (Dual Channel Mode Capable) < Dual-Screen Graphics Controller < Video I/F SDVO, PEG, LVDS, VGA, TV <...
Strapping Headers J-GP Jumper to reset BIOS CMOS RAM values J-RTC Jumper to reset RTC core of ICH6, not stuffed Connectors & Sockets ISPCON PLD programming connector, not stuffed J-COM A-B COM Express connector rows A and B (VGA, LVDS, TV, PCIe, SATA, Ethernet, USB, AC'97, SMB, LPC) J-COM C-D COM Express connector rows C and D (Dual SDVO / PEG, IDE, PCI)
Windows or Linux tasks. The heat dissipation may increase considerably when e.g. rendering software such as the Acrobat Distiller is executed. The Pentium M processors support Intel's Enhanced SpeedStep® technology. This enables dynamic switching between multiple core voltages and frequencies depending on core temperature and currently required performance.
The NIC (Networking Interface Controller) is connected by a single PCI Express lane to the chipset southbridge (ICH6). Its MAC address (unique hardware number) is stored in a dedicated EEPROM. The Intel Ethernet software and drivers for the 82573 is available from Intel's World Wide Web site for download (link provided on the EKF website).
The graphics subsystem is part of the versatile Intel i915GM Graphics/Memory Controller Hub (GMCH), and is also known as Intel Graphics Media Accelerator (GMA) 900. As an alternative, PCI Express based graphics is supported (requires discrete PEG controller present on the carrier board).
User Guide XB1 COM Express Module Real-Time Clock The XB1 COM Express Module has a time-of-day clock and 100-year calendar, integrated into the ICH6. A battery on the board keeps the clock current when the computer is turned off. The XB1 uses a Vanadium-Pentoxide-Lithium rechargeable battery, giving an autonomy of more than 50 days when fully loaded after 24 hours.
ICH6 this LED changes its function and is then controlled only by the level of the GPO20 pin. Setting this pin to 1 will switch on the LED. The PG LED remains in the programmable state until the next system reset.
Failure links before you open the system or perform or equipment damage. Some parts of the the power switch is in its off state. Caution Electrostatic discharge (ESD) can damage components. Perform the procedures described in this chapter only at an ESD workstation.
Typically you will perform the following steps: Switch off the system, remove the AC power cord Attach your antistatic wrist strap to a metallic part of the system Remove the board packaging, be sure to touch the board only at the heat spreader...
Typically you will perform the following steps: Switch off the system, remove the AC power cord Attach your antistatic wrist strap to a metallic part of the system Identify the board, be sure to touch the board only at the front panel...
EMC Recommendations In order to comply with the CE regulations for EMC, it is mandatory to observe the following rules: The chassis or rack including other boards in use must comply entirely with CE Close all board slots not in use with a blind front panel Front panels must be fastened by built-in screws Cover any unused front panel mounted connector with a shielding cap External communications cable assemblies must be shielded (shield connected only at one end...
User Guide XB1 COM Express Module Installing or Replacing the Memory Modules Note: If you decide to replace the memory, observe the precautions in 'Before You Begin' By default, the XB1 COM Express Module comes fully equipped and tested with two DDR2 SDRAM memory modules.
Local SMB Devices The XB1 COM Express Module contains a few devices that are attached to the System Management Bus (SMBus). These are the clock generation chip, the SPD EEPROMs on the SO-DIMM memory modules, a general purpose serial EEPROM and a supply voltage and CPU temperature controlling device in particular.
Connectors Caution Some of the internal connectors provide operating voltage (3.3V and 5V) to devices inside the system chassis, such as internal peripherals. Not all of these connectors are overcurrent protected. Do not use these internal connectors for powering devices external to the computer chassis. A fault in the load presented by the external devices could cause damage to the board, the interconnecting cable and the external devices themselves.
J-COM J-COM is the pair of connectors which serves as interface between the XB1 COM Express Module and the carrier board. The assembly is composed of two double-row, high speed, 0.5mm pitch plugs. Each row has 110 leads, i.e. J-COM provides 440 contact positions in total. The COM.0 specification assigns each row a letter A, B and C, D.
P-SIO The connector P-SIO is normally not stuffed. The mature PS/2 and UART ports have been overcome by USB in most applications. For low level debugging however, these interfaces can be very useful (e.g. the BIOS can communicate across the serial I/O). Please contact EKF before ordering the XB1 COM Express Module, if the P_SIO connector is required by the user.
Literature Theme Document Title ® COM Express PICMG COM.0 COM Express™ Module Base Specification Revision 1.0 2005-07 Ethernet IEEE Std 802.3, 2000 Edition PCI Express PCI Express Base Specification 1.1 Serial ATA Serial ATA Revision 2.5 Universal Serial Bus Specification EKF Elektronik GmbH Philipp-Reis-Str.
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