Package Mechanical Specifications; Processor Package Assembly Sketch - Intel Quad-Core Xeon 3300 Series Datasheet

Package Mechanical Specifications

3 Package Mechanical
Specifications
3.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that
interfaces with the motherboard via an LGA775 socket. The package consists of a
processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
of the processor package components and how they are assembled together. Refer to
the LGA775 Socket Mechanical Design Guide for complete details on the LGA775
socket.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Figure 3-1.

Processor Package Assembly Sketch

Substrate Substrate
System Board System Board
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
Datasheet
Core (die) Core (die)
IHS IHS
Figure 3-1 include the following:
TIM TIM
Capacitors Capacitors
Figure 3-1 shows a sketch
LGA775 Socket LGA775 Socket
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