Table of Contents
Advertisement
1.1.1
Processor Terminology Definitions
Commonly used terms are explained here for clarification:
• Quad-Core Intel® Xeon® Processor 3300 Series — Quad core processor in the
FC-LGA6 package with two 6 MB L2 cache or two 3 B L2 cache.
• Processor — For this document, the term processor is the generic form of the
Quad-Core Intel® Xeon® Processor 3300 Series.
• Intel
based desktop, mobile and mainstream server multi-core processors. For additional
information refer to:
• Keep-out zone — The area on or near the processor that system design can not
utilize.
• Processor core — Processor die with integrated L2 cache.
• LGA775 socket — The processor mates with the system board through a surface
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor via a retention
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to
the chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to "free air"(i.e., unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
• Execute Disable (XD) Bit — XD allows memory to be marked as executable or
non-executable, when combined with a supporting operating system. If code
attempts to run in non-executable memory the processor raises an error to the
operating system. This feature can prevent some classes of viruses or worms that
exploit buffer over run vulnerabilities and can thus help improve the overall security
of the system. See the Intel® Architecture Software Developer's Manual for more
detailed information.
• Intel
the processor to execute operating systems and applications written to take
advantage of Intel 64 architecture. Further details on Intel 64 architecture and
programming model can be found in the Software Developer Guide at http://
developer.intel.com/technology/64bitextensions/.
• Enhanced Intel SpeedStep
Technology allows trade-offs to be made between performance and power
consumptions, based on processor utilization. This may lower average power
consumption (in conjunction with OS support).
• Intel
enhancements to Intel server and client platforms that can improve virtualization
solutions. Intel VT will provide a foundation for widely-deployed virtualization
10
®
TM
Core
microarchitecture — A new foundation for Intel
http://www.intel.com/technology/architecture/coremicro/
®
64 Architecture — An enhancement to Intel's IA-32 architecture, allowing
®
Virtualization Technology (Intel
®
Technology — Enhanced Intel SpeedStep
®
VT) — A set of hardware
Introduction
®
architecture-
Datasheet
Advertisement
Table of Contents
