Signal Descriptions; Connector Pin Signal Definitions; Power Pin Signal Definitions - Intel Solid-State Drive 320 Series Product Specification

4.2

Signal Descriptions

4.2.1

Connector Pin Signal Definitions

Table 9. Serial ATA Connector Pin Signal Definitions —
1.8-inch and 2.5-inch Form Factors
Pin
S1
S2
S3
S4
S5
S6
S7
Note: Key and spacing separate signal and power segments.
4.2.2

Power Pin Signal Definitions

Table 10. Serial ATA Power Pin Definitions — 1.8-inch Form Factor
Pin
2
P1 V
33
2
P2 V
33
3
P3 Ground
3
P4 Ground
4
P5 V
5
4
P6 V
5
5
P7 DAS
Key Key
6
P8 Optional
6
P9 Optional
Notes:
1. All mate sequences assume zero angular offset between connectors.
2. P1 and P2 are internally connected to one another within the device.
3. Ground connectors P3 and P4 may contact before the other 1st mate pins in both the power and signal connectors to
discharge ESD in a suitably configure backplane connector.
4. P5 and P6 are not connected internally to the device. The host may put 5V on these pins.
5. The host may ground P7 if it is not used for Device Activity Signal (DAS).
6. P8 and P9 should not be connected by the host.
®
Intel Solid-State Drive 320 Series
Product Specification
14
Function
Ground 1st mate
A+
Differential signal pair A
A-
Ground 1st mate
B-
Differential signal pair B
B+
Ground 1st mate
Function
3.3 V Power
3.3 V Power, pre-charge
5 V Power. Not connected
5 V Power. Not connected
Device Activity Signal
NC
Manufacturing Test Pin
Manufacturing Test Pin
® ®
Intel Intel Solid-State Drive 320 Series Solid-State Drive 320 Series
Definition
Definition
Order Number: 325152-002US
1
Mating Order
2nd Mate
2nd Mate
1st Mate
1st Mate
1st Mate
2nd Mate
2nd Mate
NC
2nd Mate
2nd Mate
September 2011