Electrical Parts List - Samsung STH-N271 Service Manual

7. STH-N271 MAIN Electrical Parts List
Level SEC CODE
0 STH-N271D/COM
2 4201-000151 AN301
1 4302-001081 BATT.
2 4302-001081 BT201
2 2203-005061 C101
2 2203-000330 C102
2 2203-005061 C104
2 2203-005061 C105
2 2203-000679 C106
2 2404-001105 C107
2 2203-005061 C108
2 2203-005061 C109
2 2203-005061 C110
2 2203-000278 C111
2 2203-005061 C112
2 2203-005061 C115
2 2404-001151 C116
2 2203-005061 C117
2 2203-005061 C118
2 2203-005061 C119
2 2203-005061 C120
2 2203-000679 C121
2 2203-005065 C122
2 2203-005061 C124
2 2203-005496 C125
2 2203-000233 C126
2 2203-000885 C127
2 2203-005061 C128
2 2203-000254 C129
2 2203-005061 C130
2 2203-000628 C131
2 2203-001153 C134
2 2203-001153 C136
2 2203-005061 C137
2 2203-000438 C138
2 2203-001101 C139
2 2203-000476 C140
2 2203-005061 C141
Design LOC
ANTENNA-WHIP 824-894MHz, -, 1.8, -,
BATTERY-LI(2ND) -, .25MAH, COIN, 0.03MA, -, -
BATTERY-LI(2ND) -, .25MAH, COIN, 0.03MA, -, -
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 220 nF, +80-20 %, 10 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 6.8 nF, 10 %, 25 V, X7R, TP, 1005, -
C-CERAMIC, CHIP 1000 nF, +80-20 %, 16 V, Y5 V, TP, 2012
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
SAMSUNG Proprietary-Contents may change without notice
DESCRIPTIONS
7-1