Samsung STH-N275 Service Manual
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Samsung STH-N275 Service Manual

Samsung STH-N275 Service Manual

Samsung mobile phone service manual
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1. Trouble Shooting

1. Baseband Section
1-1. Program No Running
Press END Key
Y
ON_SW=H
Y
VBAT>3.2V
Y
VCC=3.0V
V_VCTCXO=3.0V
RST=3.0V
IVCC=2.2V
BOOT=H
Y
VCTCXO_IN=14.4MHz
32K_XIN=32.768 kHZ
Y
Memory (U202)
control signal OK?
Y
Program Running
N
Replace dome S/W
N
Need to check
Q107, Q106
N
Need to check
Q107, Q106
N
Need to check neighbor part
Need to check OSC320,
Y201 & neighbor part
N
Need to replace
Memory(U202)
SAMSUNG Proprietary-Contents may change without notice
VCC, ADD(0:21), DATA(0:15),
FLASH_CS, SRAM_CS, UBE,
MEMOEB, MEMWEB
1-1

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  • Page 1: Trouble Shooting

    32K_XIN=32.768 kHZ Need to check neighbor part Need to check OSC320, Y201 & neighbor part VCC, ADD(0:21), DATA(0:15), FLASH_CS, SRAM_CS, UBE, Memory (U202) MEMOEB, MEMWEB control signal OK? Need to replace Memory(U202) Program Running SAMSUNG Proprietary-Contents may change without notice...
  • Page 2 R216, U205, D202 Vibrator Run Need to check CN202 LCD EL Vibrator OK Send Command Main Audio Receiver Path ON, Send command Audio tone generator ON REC20+,- Signal Need to check SPK101 & neighbor part Good SAMSUNG Proprietary-Contents may change without notice...
  • Page 3 Speaker? Need to check MIC101 & neighbor part Key Display Good Mic Path Good Send Command ALT_LED_ON Send Command SVC_LED_ON Send Command LED_ON LED Operation Need to check D210, D211, Q204, Q206 GOOD SAMSUNG Proprietary-Contents may change without notice...
  • Page 4 Trouble Shooting 1-4. Abnormal Buzzer Operation START Send Command Ringer Path ON Send Command tone generator ON Ringer Signal Need to check U204, D201, CN202 Buzzer Sound Output Replace CN202 Buzzer Operation Good SAMSUNG Proprietary-Contents may change without notice...
  • Page 5 Send Command MIC_BIAS_EN enable Send Command AMP_EN enable HEADSET_SENSE=H Need to check Q102, CN101 & neighbor parts Press Button on the Ear-Jack SEND_END=H Need to check Q102, CN101 & neighbor parts Ear_Mic phone Operation Good SAMSUNG Proprietary-Contents may change without notice...
  • Page 6 2. RF Section 2-1. Call processing and Online Test START Normal SVC? Check RX path Set up Call OK? Check TX path Measure SINAD/BER Good? Check RX path Measure Tx Power Good? Check TX path DONE SAMSUNG Proprietary-Contents may change without notice...
  • Page 7 Need to check F305 U301_8=-53dBm Need to check F306 V_LNA_CELL=H F304 input=-33dBm U107_1=H U105_1=H Need to check U105, U106, U107 Need to check U301 & neighbor parts U304_45=-33dBm Need to check F304 & neighbor parts SAMSUNG Proprietary-Contents may change without notice...
  • Page 8 U105 & neighbor parts Replace U304 U304_34 Lev=-33dBm Freq=130.05MHz Replace F302 Need to check U304_37 Lev=-1dBm U304, L303, C308, L301, C307 Freq=450kHz Replace F301 or U304_25 Lev=-7dBm Need to check R302, R304, C301 Freq=450kHz MODE TDMA AMPS SAMSUNG Proprietary-Contents may change without notice...
  • Page 9 Need to check U304 & R327, R323, C353, C107 U101_40 BBCLK= 6.2208MHz or 4.96NHz or 5.12MHz Replace U203 U101_32RX_CLK= BBCLK/2 or BBCLK/8 Replace U203 U101_31 RX_SYNC= BBCLK/32 or BBCLK/128 Replace U203 U101_31 RX_DATA= serial data Replace U203 DONE SAMSUNG Proprietary-Contents may change without notice...
  • Page 10 IF_ON=H, PON_TX=H PON_VRF3=H U101_40 BBCLK= 6.2208MHz or 4.096MHz or5.12MHz Replace U203 U101_34 TX_CLK= BBCLK/32 or BBCLK/8 Replace U203 U101_33 TX_SYNC= BBCLK/512 or BBCLK/128 Replace U203 U101_33 TX_DATA= serial data Replace U203 TDMA AMPS MODE SAMSUNG Proprietary-Contents may change without notice 1-10...
  • Page 11 U304_59(RF OUT) V_RF2=3.0V or Fc=Local_freq + 175.05 Replace U304 U304_59(RF OUT) Need to check measure Level U304_66 or Send command PA_CNT Replace U304 Level is adjustable? U304_59(RF OUT) Replace F310 Fc=Local_freq + 175.05 SAMSUNG Proprietary-Contents may change without notice 1-11...
  • Page 12 VBATT(U305_14,15,16)=3.2~1V around 30dB or Replace U305 Need to check F306_1 around same power F313 & neighbor parts with U305 output Need to check F306 insertion loss F313 & neighbor parts under 3dB DONE SAMSUNG Proprietary-Contents may change without notice 1-12...
  • Page 13 RMO-I/F CONNECTOR STH-N275, RUBBER, -, D/GRY(G4358), 50, - GH73-00715A RMO-DUPLEX STH-N275, RUBBER, 15 X 8.5 X T0.5, -, -, - GH74-01274A MPR-CHIP SHORT TAPE STH-N275, TAPE, 4 X 5 X T0.05, -, - GH74-01275A MPR-FPCB SHORT TAPE STH-N275, TAPE, 4.3 X 17 X T0.05, -, - GH74-01276A MPR-BATTERY SHORT TAPE STH-N275, TAPE, 7 X 5 X T0.05, -,...
  • Page 14 SEC CODE Design LOC DESCRIPTIONS GH74-00889A MPR-MIC TAPE STH-N275, TESA TAPE, 8 X 5 X T0.4, -, - GH74-00973A MPR-BUZZER SHEET STH-N275, PC SHEET, 8.6 X 8.6 X T0.3, -, - GH75-01062A MEC-METAR DOME ARRAY STH-N275, -, -, -, IVR, -, -...
  • Page 15 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-000138 R349 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-000138 R354 R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice...
  • Page 16 R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005 2007-000151 R348 R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005 2007-000152 R218 R-CHIP 20 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice...
  • Page 17 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-000172 R142 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-000172 R157 R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice...
  • Page 18 R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-000932 R322 R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-000982 R238 R-CHIP 5.6 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice...
  • Page 19 R-CHIP 18 kohm, 1 %, 1/16 W, DA, TP, 1005 2007-007200 R341 R-CHIP 2.4 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-007529 R159 R-CHIP 91 kohm, 1 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice...
  • Page 20 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 2203-000233 C417 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 2203-000233 C421 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice...
  • Page 21 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 2203-000438 C183 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - 2203-000438 C188 C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, - SAMSUNG Proprietary-Contents may change without notice...
  • Page 22 C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005 2203-001033 C374 C-CERAMIC, CHIP 5.6 nF, 10 %, 25 V, X7R, TP, 1005, - 2203-001072 C304 C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-10...
  • Page 23 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C148 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C168 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-11...
  • Page 24 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C370 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C388 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-12...
  • Page 25 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 2404-001105 C160 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 2404-001105 C163 C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012 SAMSUNG Proprietary-Contents may change without notice 2-13...
  • Page 26 INDUCTOR-SMD 1 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm 2703-002028 L326 INDUCTOR-SMD 12 nH, 5 %, 1.0 x 0.5 x 0.5 mm 2703-002036 L310 INDUCTOR-SMD 330uH, 5 %, 3.2 x 2.5 x 2 mm SAMSUNG Proprietary-Contents may change without notice 2-14...
  • Page 27 TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5 0501-000225 Q202 TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5 0501-002318 Q102 TR-SMALL SIGNAL UMW8N, NPN, 150 mW, UMT6, TP, 27-270 0504-000167 Q204 TR-DIGITAL RN1102, NPN, 100 mW, 10K/10K, SSM, TP SAMSUNG Proprietary-Contents may change without notice 2-15...
  • Page 28 1203-001979 U112 IC-VOLTAGE REGULATOR 5320, SSOP, 8P, 110MIL, PLASTIC, 6.12 V, 300 1203-002095 U114 IC-VOLTAGE REGULATOR 71628, SOT-23-5, 5P, -, PLASTIC, 2.76/2.84 V, 1203-002129 U111 IC-VOLTAGE REGULATOR 71622, SOT-23, 5P, 62MIL, PLASTIC, 2.14/2.26 SAMSUNG Proprietary-Contents may change without notice 2-16...

  • Page 29: R-Chip 1 Kohm, 5 %, 1/16 W, Da,

    R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 2007-000148 R126 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 2007-000148 R127 R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-17...

  • Page 30: R-Chip 15 Kohm, 5 %, 1/16 W, Da,

    R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 2007-000162 R214 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 2007-000162 R216 R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-18...

  • Page 31: R-Chip 150 Kohm, 5 %, 1/16 W, Da,

    R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-000242 R323 R-CHIP 1.5 kohm, 5 %, 1/16 W, DA, TP, 1005 2007-000566 R155 R-CHIP 220 kohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-19...

  • Page 32: R-Chip 270 Kohm, 5 %, 1/16 W, Da,

    R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-003112 R318 R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005 2007-003112 R319 R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-20...

  • Page 33: R-Chip 11 Kohm, 5 %, 1/16 W, Da,

    C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 2203-000233 C365 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 2203-000233 C368 C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-21...

  • Page 34: C-Ceramic, Chip 0.01 Nf, 0.5 Pf, 50 V, Np0,

    C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005 2203-000278 C397 C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005 2203-000330 C102 C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-22...

  • Page 35: C-Ceramic, Chip 0.015 Nf, 5 %, 50 V, Np0,

    C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005 2203-000696 C455 C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005 2203-000812 C329 C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-23...
  • Page 36 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C117 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C118 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-24...
  • Page 37 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C322 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 2203-005061 C326 C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005 SAMSUNG Proprietary-Contents may change without notice 2-25...
  • Page 38 C-CERAMIC, CHIP 1000 NF, +80 %, -20 %, 16 V, Y5 V, TP, 2012 X 0.85 2203-005840 C149 C-CERAMIC, CHIP 1000 NF, +80 %, -20 %, 16 V, Y5 V, TP, 2012 X 0.85 SAMSUNG Proprietary-Contents may change without notice 2-26...
  • Page 39 INDUCTOR-SMD 6.8 nH, 5 %, 1 x 0.5 x 0.5 mm 2703-001734 L340 INDUCTOR-SMD 6.8 nH, 5 %, 1 x 0.5 x 0.5 mm 2703-001747 L312 INDUCTOR-SMD 4.7 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm SAMSUNG Proprietary-Contents may change without notice 2-27...
  • Page 40 PMO-REAR COVER STH-N275, -, PC, D/GRY, -, G4358, - GH72-01754A PMO-BATTERY LOCKER STH-N275, -, PC, D/GRY, -, G4358, - GH74-01524A MPR-REAR DRY TAPE STH-N275, TAPE, 5 X 6.5 X T0.1, BLK, - GH97-01777A MEA ETC-SHIELD STH-N275, -, COLM, TRP, -, -, - 6001-000464 SCREW-MACHINE PH, +, M1.4, L4, BLACK, SM10C, -...
  • Page 41 RMO-HINGE RUBBER STH-N275, RUBBER, 6 X 4 X T0.4, GRY, 50, - GH74-00556A MPR-FLIP BOHO SGH-2400, VINYL(3M 336), 46 X 48.5, TRP, - GH74-00890A MPR-KEY DU MMY TAPE STH-N275, TESA TAPE, 30.6 X 44.3 X T0.2, -, - GH74-40107A MCT-WINDOW BOHO SH800, 3M336, -, -, - GH75-00776A...
  • Page 42 SEC CODE Design LOC DESCRIPTIONS GH69-00800A BO X (P)-UNIT MAIN STH-N275, SC300G+E(KOL), -, -, -, -, 188 X 135 X 72, GH69-00815A CUSHION-CASE STH-N275, HIPS(T1), -, -, -, -, -, -, 180 X 130 X 76 GH69-00842A BAG-VINYL BATTERY SGH-A300, LDPE, T0.06, 100, 260, TRP, -...

  • Page 43: Exploded View And Its Parts List

    3. Exploded View and its Parts List 1. STH-N275 Cellular phone Exploded View 1-1-1 1-1-2 1-10 12-1 12-2 12-3 SAMSUNG Proprietary-Contents may change without notice...
  • Page 44 Exploded view and its Part List 2. STH-N275 Cellular phone Parts List SEC CODE Location Description Remark Gray Silver Gold SUA FRONT ASS’Y Colombia GH75-00773A GH75-00773B GH75-00773C Venezuela GH75-01166A GH75-01166B GH75-01166C Mexico FLIP ASS’Y GH75-01167A GH75-01167B GH75-01167C Mexico Colombia GH75-00775A...
  • Page 45 Exploded view and its Part List 3. Test Jig (GH80-00614A) Serial Cable Power Supply Cable 4. TC 5. RF Test Cable (GH44-00145G) 110V (GH39-00092A) Mexico, Colombia, Brazil 6. Cigarette Lighter Adaptor (GH44-00091A) 7. Test Cable (GH39-00090A) SAMSUNG Proprietary-Contents may change without notice...
  • Page 46 4. STH-N275 Block Diagrams 1. STH-N275 Base Band Part SAMSUNG Proprietary-Contents may change without notice...
  • Page 47 Block diagrams 2. STH-N275 Radio Part SAMSUNG Proprietary-Contents may change without notice...
  • Page 48 MEMO SAMSUNG Proprietary-Contents may change without notice...
  • Page 49 5. PCB Diagrams 1. STH-N275 Main PCB Top Diagram SAMSUNG Proprietary-Contents may change without notice...
  • Page 50 PCB diagrams 2. STH-N275 Main PCB Bottom Diagram SAMSUNG Proprietary-Contents may change without notice...

  • Page 51: Baseband Section

    STH-N275 provides the AMPS and the Digital TDMA (cellular band only) of compliance with TIA/EIA-137. The radio operation of the STH-N275 has been implemented with the receiver, the transmitter, and the local oscillator controlled by the PLL. The circuit of the STH-N275 is described as followings.
  • Page 52 Circuit Description Figure2-1.BEC interface and block diagram SAMSUNG Proprietary-Contents may change without notice...
  • Page 53 This part mainly interface with IFC (U101) and RF part. As for interface of IFC, that will be explained detail in next section. As important signals are PREAMP_G for receiver path, PA-GATE, ALC_EN for transmitter path, PLL_DATA, PLL_CLK, PLL_STRB1 for PLL synthesizer, RX_BAT, TX_BAT for power management. SAMSUNG Proprietary-Contents may change without notice...
  • Page 54 Since the auxiliary output is not internally amplified, an external audio amplifier is applied before connection to the two headset and HFK. Figure 2-2.IFC interface and block diagram SAMSUNG Proprietary-Contents may change without notice...
  • Page 55 Since the auxiliary output is not internally amplified, an external audio amplifier (U102) is applied before connection to the headset and HFK. SAMSUNG Proprietary-Contents may change without notice...
  • Page 56 2. RF Section 2-1.Introduction From the starting point of developing the STH-N275, the cellular and the PCS band operations have been intended. Therefore, the STH-N275 contains many dual-band components and rooms for PCS band components, in order to widen the operating band for the next product. For playing essential role in the radio part, The STH-N275 includes many active components.
  • Page 57 The output power of U305 is transmitted to F313 (Cellular band coupler) in order to help the Tx power control by using the power detector diode. In result, the Tx power is transmitted to the air interface via an antenna. SAMSUNG Proprietary-Contents may change without notice...
  • Page 58 Auto Gain Control voltage PA_CNT IFC/RFIC Power Amplifier control voltage DEMOD RFIC/IFC Discriminator output TXDA_REF RFIC/IFC Tx section common mode DC bias PON_TX BEC/Regulator TX up converter power (V_RF2:RFIC) PON_VRF3 BEC/Regulator Local Amp power(V_RF3:RFIC) SAMSUNG Proprietary-Contents may change without notice...
  • Page 59 Circuit diagrams 3. STH-N275 IFIC Circuit Diagram VBAT AVCC STH-N270 RX_AUDIO R112 MIC+ ZD101 680K HEADSET_SENSE C101 R140 C102 100NF Q101 MIC_BIAS_EN 12PF C152 REV5.7 C176 C103 100NF C127 R115 C177 MIC- 4.7NF 560K,1% 100NF AVCC R128 C153 C154 C179...
  • Page 60 2.2K DP_RX_DATA Q202 10NF LED_EN SCAN(4) R247 Q204 R238 D210 DP_TX_DATA 5.6K ZD208 SCAN(5) SCLK SIN_2 NOTE: WAITING FOR REPLAY FROM SAMSUNG ABOUT C_F PIN ALT_LED C221 47PF BATT BT201 AU201 HP_PWR ZD207 Q206 D211 RV205 SOUT_2 ZD206 TP220 CN202...
  • Page 61 Circuit diagrams 5. STH-N275 RF Circuit Diagram F301 STH-N270 R303 R301 R302 27ohm DUMMY PAD C302 C303 C466 R304 C301 REV5.7 100NF 100PF 2.4K 100NF L307: 6.8nH for PCS C471 C472 Transmission Z[OHM] L[mm] L502: 10nH for PCS L301 1.19...

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