Equipotential Bonding - Siemens SIMATIC S7-400 Installation Manual

Glossary
Diagnostic Buffer
The diagnostic buffer is a retentive area of memory within the S7-400 CPU which
stores the diagnostic events in the order they occurred.
Diagnostic Interrupt
Modules with diagnostics capability signal system errors to the S7-400 CPU by
means of diagnostic interrupts.
DP Master
A master which is compliant with EN 50170, Part 3.
Interconnects the CPU and the distributed I/O system. Exchanges data via
PROFIBUS DP with the distributed I/O and monitors the PROFIBUS DP.
DP Slave
A slave which is operated on PROFIBUS with PROFIBUS DP protocol and
compliant with EN 50170, Part 3.
Prepares the data of encoders and actuators locally for their transfer to the CPU
via PROFIBUS DP.
DPV1
Enhancement of distributed I/O to EN 50170. The results were incorporated into
IEC 61158 / IEC 61784-1:2002 Ed1 CP 3/1. The term DPV1 is used in the SIMATIC
documentation. The new version contains enhanced and simplified functionality, for
example, the extension of acyclic services with new interrupt functions.
The DPV1 functionality is integrated into IEC 61158/EN 50170, Volume 2,
PROFIBUS.
E
Electromagnetic Compatibility (EMC)
Electromagnetic compatibility is understood to mean the capability of electrical
apparatus to operate without faults in a given environment, without affecting that
environment in an unacceptable manner.

Equipotential Bonding

An electrical connection (equipotential bonding conductor) that ties the exposed
conductive parts of an item of electrical equipment and extraneous conductive
parts to the same, or approximately the same, potential in order to prevent
disturbing or dangerous voltages between these parts.
Glossary-4
Automation System S7-400 Hardware and Installation
A5E00850741-01