Manufacturing Options - Intel BOXD945GCZL Technical Product Specification

Table 1. Feature Summary (continued)
Hardware Monitor
Subsystem

1.2.2 Manufacturing Options

Table 2 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 2.

Manufacturing Options

Audio Subsystem
IEEE-1394a
Interface
LAN subsystem
SATA RAID
Trusted Platform
Module (TPM),
revision 1.2
For information about
Available configurations for the board
• Hardware monitoring and fan control ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan connectors
• Three fan sense inputs used to monitor fan activity
• Fan speed control
®
Intel High Definition Audio subsystem in one of the following configurations:
• 8-channel (7.1) audio subsystem with five analog audio outputs and one S/PDIF
optical digital audio output using the Sigmatel 9223 audio codec
• 6-channel (5.1) audio subsystem with three analog audio outputs using the
Sigmatel 9220 audio codec
IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector,
two front-panel connectors)
The board provides one of the following:
• Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the
®
Intel 82573E/82573V/82574V Gigabit Ethernet Controller
• 10/100 Mbits/sec LAN subsystem using the Intel
LAN Connect (PLC) device
®
Intel 82801GR I/O Controller Hub (ICH7-R) for RAID support (levels 0,1, 0+1, and 5)
on the SATA interface
A component that enhances platform security
Product Description
®
82562GX/82562GZ Platform
Refer to
Section 1.3, page 15
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