Intel BOXD945GCZL Technical Product Specification page 6

Product specification
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Intel Desktop Board D945GCZ Technical Product Specification
2.1
Introduction .................................................................................................................. 45
2.2
Memory Resources ...................................................................................................... 45
2.2.1
Addressable Memory..................................................................................... 45
2.2.2
Memory Map.................................................................................................. 47
2.3
DMA Channels ............................................................................................................. 47
2.4
Fixed I/O Map............................................................................................................... 48
2.5
PCI Configuration Space Map...................................................................................... 49
2.6
Interrupts ...................................................................................................................... 50
2.7
PCI Conventional Interrupt Routing Map ..................................................................... 51
2.8
Connectors................................................................................................................... 53
2.8.1
Back Panel Connectors ................................................................................. 53
2.8.2
Component-side Connectors......................................................................... 56
2.9
Jumper Block ............................................................................................................... 64
2.10 Mechanical Considerations .......................................................................................... 65
2.10.1
Form Factor ................................................................................................... 65
2.10.2
I/O Shield....................................................................................................... 66
2.11 Electrical Considerations.............................................................................................. 68
2.11.1
DC Loading.................................................................................................... 68
2.11.2
Add-in Board Considerations......................................................................... 68
2.11.3
Fan Connector Current Capability ................................................................. 69
2.11.4
Power Supply Considerations ....................................................................... 69
2.12 Thermal Considerations ............................................................................................... 70
2.13 Reliability...................................................................................................................... 72
2.14 Environmental .............................................................................................................. 73
2.15 Regulatory Compliance................................................................................................ 74
2.15.1
Safety Regulations ........................................................................................ 74
2.15.2
EMC Regulations........................................................................................... 74
2.15.3
European Union Declaration of Conformity Statement.................................. 75
2.15.4
Recycling Considerations .............................................................................. 76
2.15.5
Product Certification Markings (Board Level) ................................................ 77
3.1
Introduction .................................................................................................................. 79
3.2
BIOS Flash Memory Organization ............................................................................... 80
3.3
Resource Configuration ............................................................................................... 80
3.3.1
PCI Autoconfiguration.................................................................................... 80
3.3.2
PCI IDE Support ............................................................................................ 80
3.4
System Management BIOS (SMBIOS) ........................................................................ 81
3.5
Legacy USB Support.................................................................................................... 81
3.6
BIOS Updates .............................................................................................................. 82
3.6.1
Language Support ......................................................................................... 82
3.6.2
Custom Splash Screen.................................................................................. 82
3.7
Boot Options ................................................................................................................ 83
3.7.1
CD-ROM Boot ............................................................................................... 83
3.7.2
Network Boot ................................................................................................. 83
3.7.3
Booting Without Attached Devices ................................................................ 83
3.7.4
Changing the Default Boot Device During POST .......................................... 83
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