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R
2
Product Specifications
2.1
Package Description
The ICH8 component is available in a 652 ball, 31mm square mBGA package shown in Figure 5 in
Appendix B.
2.2
Package Loading Specifications
Table 1 provides static load specifications for the ICH8 package. This mechanical maximum load
limit should not be exceeded during heatsink assembly, shipping conditions, or typical use
condition. Also, any mechanical system or component testing should not exceed the maximum limit.
The chipset package substrate should not be used as a mechanical reference or load-bearing surface
for the thermal and mechanical solution.
Table 1. Package Loading Specifications
NOTES:
1.
2.
3.
2.3
Thermal Specifications
To ensure proper operation and reliability of the ICH8 component, the case temperature T
at or below the maximum value T
exceeds the maximum temperature listed, system or component level thermal enhancements are
required to dissipate the heat generated. The system designer must design a thermal solution for the
ICH8 such that it maintains T
power (TDP). Please note that the T
equal to TDP, and that the case temperature must be maintained at temperatures less than T
when operating at power levels less than TDP. This temperature compliance is to ensure chipset
reliability over its useful life. Chapter 3 provides the thermal metrology guidelines for case
temperature measurements. Chapter 4 provides information on the reference cooling solution for
ATX systems.
Intel's reference boundary conditions for ICH8 in an ATX system are 60 °C inlet ambient
temperature and 0.25m/s [50 lfm] of airflow. The ICH8 package will not require a heatsink when
power dissipation is at or below 3.0 W. This value is referred to as the Package Thermal Capability,
or PTC. Note that the power level at which a heatsink is required will also change depending on
system local operating ambient conditions and system configuration. For example, the local inlet
Thermal and Mechanical Design Guidelines
Parameter
Maximum
Static
These specifications apply to uniform compressive loading in a direction normal to the chipset package
This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide
the minimum specified load on the ICH package.
These specifications are based on limited testing for design characterization. Loading limits are for the
package only.
C-MAX
below T
C
Notes
15 lbf
1,2,3
specified in Table 2. If the temperature of the component
for sustained power level equal to the Thermal Design
C-MAX
specification is a requirement for a sustained power level
C-MAX
Product Specifications
must be
C
C-MAX
9
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