Intel ICH8 - MECHANICAL Design Manual
  1. Manuals
  2. Brands
  3. Intel Manuals
  4. Switch
  5. ICH8 - MECHANICAL
  6. Design manual

Intel ICH8 - MECHANICAL Design Manual

I/o controller hub 8 family
Hide thumbs Also See for ICH8 - MECHANICAL:
Table of Contents

Advertisement

Quick Links

Download this manual See also: Information Manual
R
®
Intel
I/O Controller Hub 8 (ICH8)
Family
Thermal and Mechanical Design Guidelines
®
— For the Intel
I/O Controller Hub 8 (ICH8) Desktop Family.
June 2006
Document Number:
313058-001

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the ICH8 - MECHANICAL and is the answer not in the manual?

Questions and answers

Related Manuals for Intel ICH8 - MECHANICAL

Summary of Contents for Intel ICH8 - MECHANICAL

  • Page 1 ® Intel I/O Controller Hub 8 (ICH8) Family Thermal and Mechanical Design Guidelines ® — For the Intel I/O Controller Hub 8 (ICH8) Desktop Family. June 2006 Document Number: 313058-001...
  • Page 2 ANY ERRORS CONTAINED IN THIS DOCUMENT AND HAS NO LIABILITIES OR OBLIGATIONS FOR ANY DAMAGES ARISING FROM OR IN CONNECTION WITH THE USE OF THIS DOCUMENT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

  • Page 3: Table Of Contents

    Contents Introduction..........................7 Terminology ......................7 Reference Documents ....................8 Product Specifications......................9 Package Description....................9 Package Loading Specifications................9 Thermal Specifications ...................9 Power Specifications ....................11 Thermal Metrology......................13 Case Temperature Measurements...............13 0° Angle Thermocouple Attach Methodology ............13 Ambient Temperature and Airflow Measurement..........14 Reference Thermal Solution....................17 Environmental Reliability Requirements...............17 Appendix A Enabled Suppliers ......................19 Appendix B...
  • Page 4 ICH8 Component Case Temperature Specifications ........10 ® Table 3. Intel ICH8 Thermal Design Power Guidelines...........11 Table 6. Reference Thermal Solution Environmental Reliability Requirements ....17 ® Table 7. Enabled Suppliers for the Intel ICH6, ICH7, and ICH8 Reference Heatsink ..19 § Thermal and Mechanical Design Guidelines...

  • Page 5: Revision History

    Revision History Rev. No. Description Date • Initial Release. -001 June 2006 § Thermal and Mechanical Design Guidelines...
  • Page 6 Thermal and Mechanical Design Guidelines...

  • Page 7: Introduction

    ® Note: This document only applies to the desktop implementation of the Intel ICH8 component. ® Note: Unless otherwise specified, the term ICH8 refers to the Intel I/O Controller Hub 8 (ICH8) desktop family.

  • Page 8: Reference Documents

    Theta_CA Thermal Resistance described using power dissipated between two points. Here, theta_ca is defined as: (Tc – Tambient)/(Power Reference Documents Document Comments ® Intel I/O Controller Hub 8 (ICH8) Datasheet www.intel.com/design/chips ets/datashts/313056.htm Various System Thermal Design Suggestions http://www.formfactors.org § Thermal and Mechanical Design Guidelines...

  • Page 9: Product Specifications

    Chapter 4 provides information on the reference cooling solution for ATX systems. Intel’s reference boundary conditions for ICH8 in an ATX system are 60 °C inlet ambient temperature and 0.25m/s [50 lfm] of airflow. The ICH8 package will not require a heatsink when power dissipation is at or below 3.0 W.

  • Page 10: Table 2. Intel Ich8 Component Case Temperature Specifications

    Appendix A for the current reference ICH8 heatsink vendor information. The component should be operated above the minimum case temperature specification listed in Table 2. ® Table 2. Intel ICH8 Component Case Temperature Specifications Parameter Value See Table 3 for additional configurations No Heatsink Attached: 105 °C...

  • Page 11: Power Specifications

    Any ports not routed to a connector is assumed to be functionally disabled according to Intel guidelines Refers to the power of each listed configuration. Configuration 4 is the typical configuration for Thermal Design Power. The Intel reference design supports Configuration 3. § Thermal and Mechanical Design Guidelines...
  • Page 12 Product Specifications Thermal and Mechanical Design Guidelines...

  • Page 13: Thermal Metrology

    Thermal Metrology Thermal Metrology The system designer must make temperature measurements in order to accurately determine the thermal performance of the system. Intel has established guidelines for measuring chipset component case temperatures. Case Temperature Measurements To ensure functionality and reliability, the chipset component is specified for proper operation when is maintained at or below the maximum temperature listed in Table 2.

  • Page 14: Ambient Temperature And Airflow Measurement

    Figure 3 describes the recommended location for air temperature measurements measured relative to the component. For a more accurate measurement of the average approach air temperature, Intel recommends averaging temperatures recorded from two thermocouples spaced about 25 mm [1.0 in] apart.

  • Page 15: Figure 3. Recommended Temperature Measurement Placement: Top View

    Thermal Metrology Figure 3. Recommended Temperature Measurement Placement: Top View T/C pair location ICH package 13 mm (0.5in) Single T/C location T/C pair 13 mm location (0.5in) Figure 4. Recommended Airflow and Temperature Placement: Side View ICH Heatsink, if Airflow required §...
  • Page 16 Thermal Metrology Thermal and Mechanical Design Guidelines...

  • Page 17: Reference Thermal Solution

    Refer to Appendix A for currently enabled suppliers for the reference thermal solution and Appendix B for reference thermal solution mechanical drawings. ® Note: The reference heatsink for the ICH8 is the same reference heatsink for the developed Intel ICH6 ®...
  • Page 18 Reference Thermal Solution Thermal and Mechanical Design Guidelines...

  • Page 19: Appendix A Enabled Suppliers

    1896 ext. 6390 edwina@wieson.com Note: These vendors and devices are listed by Intel as a convenience to Intel's general customer base, but Intel does not make any representations or warranties whatsoever regarding quality, reliability, functionality, or compatibility of these devices. This list and/or these devices may be subject to change without notice.
  • Page 20 Currently Enabled Suppliers Thermal and Mechanical Design Guidelines...

  • Page 21: Appendix B Mechanical Drawings

    Mechanical Drawings Appendix B Mechanical Drawings The following table lists the mechanical drawings available in this document: Drawing Name Page Number Intel® ICH8 Component Package Drawing Motherboard Keep-Out Reference Heatsink Extrusion Reference Heatsink Clip Reference Heatsink Assembly Thermal and Mechanical Design Guidelines...
  • Page 22 Mechanical Drawings ® Figure 5. Intel ICH8 Component Package Drawing Thermal and Mechanical Design Guidelines...

  • Page 23: Figure 9. Motherboard Keep-Out For Reference Heatsink

    Mechanical Drawings Figure 6. Motherboard Keep-Out for Reference Heatsink Thermal and Mechanical Design Guidelines...

  • Page 24: Figure 10. Reference Heatsink Extrusion

    Mechanical Drawings Figure 7. Reference Heatsink Extrusion Thermal and Mechanical Design Guidelines...

  • Page 25: Figure 11. Reference Heatsink Clip

    Mechanical Drawings Figure 8. Reference Heatsink Clip Thermal and Mechanical Design Guidelines...

  • Page 26: Figure 12. Reference Heatsink Assembly

    Mechanical Drawings Figure 9. Reference Heatsink Assembly Thermal and Mechanical Design Guidelines...

This manual is also suitable for:

Io controller hub 8 - mechanical

Table of Contents