Reference Documents - Intel ICH8 - MECHANICAL Design Manual

Introduction
Term
T
C-MIN
TDP
TIM
LFM
PTC
Theta_CA
1.2

Reference Documents

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Intel I/O Controller Hub 8 (ICH8) Datasheet
Various System Thermal Design Suggestions
8
The minimum case/die temperature.
Thermal Design Power is specified as the highest sustainable power level of most or all of
the real applications expected to be run on the given product, based on extrapolations in
both hardware and software technology over the life of the component. Thermal solutions
should be designed to dissipate this target power level.
Thermal Interface Material: thermally conductive material installed between two surfaces to
improve heat transfer and reduce interface contact resistance.
Linear Feet per Minute. Units of airflow velocity.
Package Thermal Capability. The power level at which at or below its value, the component
does not require a heatsink under the reference boundary condition assumptions.
Thermal Resistance described using power dissipated between two points. Here, theta_ca is
defined as: (Tc – Tambient)/(Power
Document
Description
)
CA
www.intel.com/design/chips
ets/datashts/313056.htm
http://www.formfactors.org
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Thermal and Mechanical Design Guidelines
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