Reference Thermal Solution; Environmental Reliability Requirements; Table 6. Reference Thermal Solution Environmental Reliability Requirements - Intel ICH8 - MECHANICAL Design Manual

R
4

Reference Thermal Solution

The ICH8 reference solution on an ATX platform assumes a component local operating
environment with a maximum local-ambient temperature of 60 °C and airflow of 0.25 m/s [50 lfm].
In these ambient conditions, with the configurations given in Table 3, the ICH8 component requires
an attached heatsink to meet thermal specifications. The local-ambient conditions are based on a
35 °C external-ambient temperature at sea level, where external-ambient refers to the environment
external to the system. Refer to Appendix A for currently enabled suppliers for the reference
thermal solution and Appendix B for reference thermal solution mechanical drawings.
Note: The reference heatsink for the ICH8 is the same reference heatsink for the developed Intel
which was also used for the Intel
Refer to Figure 6 for reference ATX/μATX motherboard keep-out information. The heatsink can be
tape-attached, or attached with a Z-clip. The motherboard keep-out allows for a Z-clip heatsink
attach.
Note: Intel has not completed thermal or mechanical validation with a tape-attached ICH heatsink
solution.
4.1

Environmental Reliability Requirements

If an attached heatsink is implemented due to a severe component local operating environment, the
reliability requirements in Table 4 are recommended. The mechanical loading of the component
may vary depending on the heatsink, and attach method used. The user should define validation
tests based on the anticipated use conditions and resulting reliability requirements.
Table 4. Reference Thermal Solution Environmental Reliability Requirements
Test
Mechanical
Shock
Random
Vibration
Thermal
Cycling
Temperature
Life
Unbiased
Humidity
NOTES:
1.
2.
Thermal and Mechanical Design Guidelines
®
ICH7.
1
• 3 drops for + and - directions in each of 3 perpendicular axes
(i.e., total 18 drops).
• Profile: 50 G trapezoidal waveform, 11 ms duration,
170 inches/sec minimum velocity change.
• Setup: Mount sample board on test fixture.
• Duration: 10 min/axis, 3 axes
• Frequency Range: 5 Hz to 500 Hz
• Power Spectral Density (PSD) Profile: 3.13 g RMS
• -40 °C to +85 °C, 1000 cycles
• 85 °C, 1000 hours total
• 85 % relative humidity / 55 °C, 1000 hours
The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots
of material.
Additional Pass/Fail Criteria may be added at the discretion of the user.
Requirement
§
Reference Thermal Solution
®
ICH6
Pass/Fail Criteria
Visual\Electrical
Check
Visual/Electrical
Check
Visual Check
Visual/Electrical
Check
Visual Check
2
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