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Intel Manuals
Computer Hardware
E7505
Thermal design manual
Intel E7505 Thermal Design Manual
Chipset memory controller hub (mch) thermal and mechanical design guidelines
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Table of Contents
Table of Contents
1 Introduction
Design Flow
Figure 1. Thermal Design Process
Definition of Terms
Reference Documents
2 Packaging Technology
Figure 2. MCH Package Dimensions (Side View)
Figure 3. MCH Package Dimensions (Top View)
3 Thermal Simulation
4 Thermal Specifications
Case Temperature and Thermal Design Power
Die Temperature
Table 1. Intel ® E7500 Chipset MCH Thermal Specifications
Table 2. Intel ® E7505 Chipset MCH Thermal Specifications
5 Thermal Metrology
Die Temperature Measurements
0° Angle Attach Methodology
Figure 4. 0 Angle Attach Methodology (Top View)
Figure 5. 0° Angle Attach Heatsink Modifications
Power Simulation Software
Figure 6. Thermal Solution Decision Flowchart
6 Reference Thermal Solutions
Operating Environment
Mechanical Design Envelope
Figure 7. Reference Heatsink Volumetric Envelope for the MCH
Thermal Solution Assembly
Figure 8. Reference Thermal Solution Assembly
Figure 10. Reference Thermal Solution (Top View)
Figure 9. Reference Thermal Solution Assembly (Side View)
Figure 11. Preferred Heatsink Orientation
Heatsink Orientations
Extruded Heatsink Profiles
Figure 12. Extruded Heatsink Profile
Figure 13. Alternate Tall Heatsink Profile
Figure 14. Heatsink Mechanical Gasket, Optional Two-Piece
Heatsink Clip
Mechanical Interface Material
Thermal Interface Material
Board Level Component Keep-Out Dimensions
Clip Retention Anchors
Figure 15. Heatsink Retention Mechanism Layout
Figure 16. Retention Mechanism Component Keep-Out Zones
Reliability Guidelines
Table 3. Reliability Guidelines
Appendix A: Thermal Solution Component Suppliers
Table 4. Complete Thermal Solution Kits
Table 5. Extruded Heatsinks
Table 6. Interface Materials
Table 7. Attach Hardware
Appendix B: Mechanical Drawings
Figure 17. MCH Heatsink Assembly
Figure 18. MCH Heatsink Clip
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R
®
Intel
E7500/E7505 Chipset
Thermal Design Guide
®
Intel
E7500/E7505 Chipset Memory Controller Hub (MCH) Thermal
and Mechanical Design Guidelines
November 2002
Document Number: 298647-002
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