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MSP430FR2433 LaunchPad™ Development Kit
The MSP-EXP430FR2433 LaunchPad™ Development Kit is an easy-to-use evaluation module (EVM)
based on the
MSP430FR2433
to start developing on the ultra-low-power MSP430FR2x Value Line Sensing MCU platform, including
onboard debug probe for programming, debugging, and energy measurements. The board includes two
buttons and two LEDs for creating a simple user interface. It also supports using a supercapacitor (must
be purchased and installed by the user) that acts like a rechargeable battery, enabling stand-alone
applications without an external power supply.
Figure 1
shows the MSP-EXP430FR2433 LaunchPad development kit.
SLAU739 – October 2017
Submit Documentation Feedback
Value Line Sensing microcontroller (MCU). It contains everything needed
Figure 1. MSP-EXP430FR2433 LaunchPad Development Kit
MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433)
Copyright © 2017, Texas Instruments Incorporated
User's Guide
SLAU739 – October 2017
(MSP ‑ ‑ EXP430FR2433)
1
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Summary of Contents for Texas Instruments MSP430FR2433
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Page 1: Msp-Exp430Fr2433 Launchpad Development Kit
Figure 1 shows the MSP-EXP430FR2433 LaunchPad development kit. Figure 1. MSP-EXP430FR2433 LaunchPad Development Kit MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 2: Table Of Contents
Using TI Resource Explorer to Browse MSP-EXP430FR2433 in MSPWare ......................Schematics (1 of 2) ......................Schematics (2 of 2) List of Tables ....................EnergyTrace Technology MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 3: Getting Started
Getting Started Introduction The 16-MHz MSP430FR2433 device features 15.5KB of embedded FRAM (ferroelectric random access memory), a nonvolatile memory known for its ultra-low power, high endurance, and high-speed write access. Combined with the 4KB of on-chip SRAM, users have access to 15.5KB of memory to split between their program and data as required. -
Page 4: First Steps: Out-Of-Box Experience
FRAM memory of the MSP430FR2433 MCU. Alternatively, the demo also implements a real-time temperature sensor. Both the logged and the real-time temperature data can be transmitted to the PC and visualized using the... -
Page 5: Hardware
32.768 kHz 20-pin Target device LaunchPad MSP430FR2433 standard headers User interface 2 buttons, 2 LEDs Figure 3. MSP-EXP430FR2433 Block Diagram MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 6: Hardware Features
The MSP430FR2433 is an ultra-low-power MSP430FRx FRAM-based microcontroller (MCU), which offer extended data logging and security capabilities. The MSP430FR2433 offers the small VQFN package (4 mm × 4 mm) in the FRAM microcontroller portfolio, combined with a variety of integrated peripherals and ultra-low power consumption. -
Page 7: Ez-Fet Debug Probe
The software and more information about the debugger can be found on the eZ-FET wiki. More information on the eZ-FET can be found in the MSP Debuggers User's Guide. MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 8: Ez-Fet Isolation Jumper Block Diagram
Debug Probe Connection: Isolation Jumper Block The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the eZ-FET domain into the MSP430FR2433 target domain. This includes eZ-FET Spy-Bi-Wire signals, application UART signals, and 3.3-V and 5-V power. -
Page 9: Application Backchannel Uart In Device Manager
You can then open the port and begin communication to it from the host. On the target MSP430FR2433 side, the backchannel is connected to the eUSCI_A0 module. The eZ-FET has a configurable baud rate; therefore, it is important that the PC application configures the baud rate to be the same as what is configured on the eUSCI_A0. -
Page 10: Power
Header J5 is present on the board to supply external power directly. It is important to comply with the device voltage operation specifications when supplying external power. The MSP430FR2433 has an operating range of 1.8 V to 3.6 V. More information can be found in the... -
Page 11: Msp-Exp430Fr2433 Supercap Power Block Diagram
If the supercapacitor is populated, it can be used to evaluate the ultra-low power feature of the MSP430FR2433 target device. See how long you can run your application on the supercap alone. NOTE: A supercapacitor is not included in the kit and must be supplied by the user. -
Page 12: Measure Current Draw Of The Msp430 Mcu
Measure Current Draw of the MSP430 MCU To measure the current draw of the MSP430FR2433 using a multimeter, use the 3V3 jumper on the J101 jumper isolation block. The current measured includes the target device and any current drawn through the BoosterPack headers. -
Page 13: Boosterpack Pinout
MSP-EXP430FR2433 LaunchPad development kit, compare the schematic of the candidate BoosterPack module with the LaunchPad kit to ensure compatibility. Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR2433 device pin function configuration in software. Figure 10. BoosterPack Checker Tool To check the compatibility of your desired BoosterPack modules for your design, with a LaunchPad kit of your choice, you can use the BoosterPack Checker tool. -
Page 14: Design Files
PCB Revision Description Rev 1.0 Initial release Software Examples Four software examples are included with the MSP430FR2433 LaunchPad development kit (see Table which can be found in the MSP430FR2433 LaunchPad development kit download page and are also available inside the MSPWare software. -
Page 15: Out-Of-Box Software Example
3.1.3 FRAM Data Logging Mode This mode shows the FRAM data logging capabilities of the MSP430FR2433. After starting this mode, the LaunchPad wake up from LPM3.5 approximately every 5 seconds (indicated by short red LED1 blink) to log temperature values. Data are stored into a ring buffer located in the FRAM memory. When the ring buffer fills up to its capacity, the oldest temperature data is discarded and replaced with the newest data. -
Page 16: Blink Led Example
MSPWare without having to download files to your local drive (see Figure 12). Visit TI Resource Explorer Cloud now at dev.ti.com. MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 17: Ti Resource Explorer Cloud
For a full comparison between CCS Cloud and CCS Desktop, visit the TI Cloud Tools page. Visit Code Composer Studio Cloud now at dev.ti.com. Figure 13. CCS Cloud MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 18: Directing The Project>Import Function To The Demo Project
Figure 15, and it has a checkmark to the left of MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 19: Launchpad Websites
Folder: Resources specific to this particular LaunchPad development kit • TI's LaunchPad portal: Information about all LaunchPad development kits from TI MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated... -
Page 20: Mspware And Ti Resource Explorer
To keep data storage constant, the nonvolatile storage library contains functions that store data in a way that is ensures recovery of the last valid entry without data corruption. MSP430FR2433 LaunchPad™ Development Kit (MSP ‑ EXP430FR2433) SLAU739 – October 2017 Submit Documentation Feedback Copyright ©... -
Page 21: Msp430Fr2433 Mcu
MSP430FR2433 MCU 4.5.1 Device Documentation At some point, you will probably want more information about the MSP430FR2433 device. For every MSP device, the documentation is organized as shown in Table Table 8. How MSP Device Documentation is Organized Document... -
Page 22: Schematics
Assembly Variant: [No Variations] Sheet: warrant that this design will meet the specificatio ns, will be suitable for your application or fit for any particular purpose, or will operate in an imp lementation. Texas Instruments and/or its Drawn By: File: LaunchPad_eZFET_1.4.SchDoc... -
Page 23: Schematics (2 Of 2)
Assembly Variant: [No Variations] Sheet: warrant that this design will meet the specificatio ns, will be suitable for your application or fit for any particular purpose, or will operate in an imp lementation. Texas Instruments and/or its Drawn By: File: LaunchPad_TargetDevice.SchDoc... - Page 24 STANDARD TERMS FOR EVALUATION MODULES Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms set forth herein.
- Page 25 FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation.
- Page 26 【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの 措置を取っていただく必要がありますのでご注意ください。 1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用 いただく。 2. 実験局の免許を取得後ご使用いただく。 3. 技術基準適合証明を取得後ご使用いただく。 なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。 上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ ンスツルメンツ株式会社 東京都新宿区西新宿６丁目２４番１号 西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/ /www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page 3.4 European Union 3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive): This is a class A product intended for use in environments other than domestic environments that are connected to a low-voltage power-supply network that supplies buildings used for domestic purposes.
- Page 27 Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief in any United States or foreign court. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2017, Texas Instruments Incorporated...
- Page 28 IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are developing applications that incorporate TI products;...
- Page 29 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments MSP-EXP430FR2433...
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