Summary of Contents for Texas Instruments TPA6211A1
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TPA6211A1 Audio Power Amplifier Evaluation Module User’s Guide July 2003 Mixed-Signal Products SLOU162...
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TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:...
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EVM IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically found in the end product incorporating the goods.
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EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2003, Texas Instruments Incorporated...
SLOU011) provides detailed information on the evaluation platform and its use with TI audio evaluation modules. TPA6211A1 3.1-W Mono Fully Differential Audio Power Amplifier (literature number SLOS367) This is the data sheet for the TPA6211A1 audio amplifier integrated circuit.
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FCC Warning FCC Warning This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference.
..........Tables 2–1 Typical TI Plug-N-Play Platform Jumper and Switch Settings for the TPA6211A1 EVM 2–2 Platform Jumper and Switch Settings for the TPA6211A1 EVM .
Chapter 1 Introduction This chapter provides an overview of the Texas Instruments (TI) TPA6211A1 audio amplifier evaluation module (TPA6211A1EVM). It includes a list of EVM features, a brief illustrated description of the module, and a list of EVM specifications. Topic Page .
Feature Highlights 1.1 Feature Highlights The TI TPA6211A1 audio amplifier evaluation module and the TI plug-n-play audio amplifier evaluation platform include the following features: TPA6211A1 Low-Voltage Audio Power Amplifier Evaluation Module Fully differential amplifier Single channel, bridge-tied load (BTL) 2.5-V to 5.5-V operation 3.1-W output power into 3 Ω...
The platform, which has room for a pair of TPA6211A1 evaluation modules, is a convenient vehicle for demonstrating TI’s audio power amplifier and related evaluation modules.
The platform switch and jumper settings shown in Table 2–1 are typical for the TPA6211A1 EVM. They cause the TPA6211A1 amplifier IC on the EVM to shut down when a plug is inserted into platform headphone jack J10.
Precautions 2.1 Precautions Power Supply Input Polarity and Maximum Voltage Always ensure that the polarity and voltage of the external power connected to V power input connector J1, J2, and/or V power input connector J6 are correct. Overvoltage or reverse-polarity power applied to these terminals can open onboard soldered-in fuses and cause other damage to the platform, installed evaluation modules, and/or the power source.
1) Ensure that all external power sources are set to off and that the platform power switch S1 is set to off. 2) Install a TPA6211A1 module in platform sockets U3 and U4 for stereo operation (or a module in either U3 or U4 for single channel operation), taking care to align the module pins correctly.
Quick Start List for Stand-Alone 2.3 Quick Start List for Stand-Alone Follow these steps to use the TPA6211A1 EVM stand-alone or when connecting it into existing circuits or equipment. Connections to the TPA6211A1 module header pins can be made via individual sockets, wire-wrapping, or soldering to the pins either on the top or the bottom of the module circuit board.
TPA6211A1 EVM PCB Layers 2.4.4 TPA6211A1 EVM PCB Layers The following illustrations depict the TPA6211A1 EVM PCB layers and silkscreen. These drawings are not to scale. Gerber plots can be obtained from any TI sales office. Figure 2–5. TPA6211A1 EVM Top Layer Figure 2–6.
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