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Summary of Contents for Phytec i.MX 8M Plus
- Page 1 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) A Product of PHYTEC Technology Holding Company...
- Page 2 PHYTEC Messtechnik GmbH reserves the right to alter the information contained herein without prior notification and accepts no responsibility for any damages that might result.
- Page 3 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) EUROPE NORTH AMERICA FRANCE Address: PHYTEC Messtechnik GmbH PHYTEC America LLC PHYTEC France Barcelona-Allee 1 203 Parfitt Way SW 17, place Saint-Etienne 55129 Mainz Bainbridge Island, WA 98110 F-72140 Sillé-le-Guillaume...
- Page 4 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) Introduction This guide provides information on how to solder the various phyCORE-i.MX 8M Plus modules. • For good soldering results, we recommend using the parameters in this guide as much as possible.
- Page 5 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) Delivery Format The modules are only shipped in reels. For more information, please contact PHYTEC Sales. All dimensions and tolerances are as per EIA 481 standard. 2 i.MX 8M Plus Reel Technical Information...
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Page 6: Production Settings
The modules are rated MSL 3, so it is required that they are stored adequately before soldering (see IPC/JEDEC J- STD-033C). PHYTEC recommends storing the modules shrink-wrapped in the original packing. If the packaging is opened, store them in humidity-reduced storage (rel. humidity < 10%, T < 30°C / 86°F). The shelf life for sealed packaging is 12 months at <... - Page 7 The coplanarity measured on the i.MX 8M Plus is<0.003" bow and twist (98% confidence interval). It is important that the carrier board is also coplanar. If the carrier board is thinner than the i.MX 8M Plus, it is recommended that the assembly be supported during the reflow process, i.e.
- Page 8 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) SMT Pick and Place 4 SMT Pick and Place Dimensions • Placement Nozzle: Largest nozzle that will fit • Nozzle Pick Surface: Center of Shield on i.MX 8M Plus CPU •...
- Page 9 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) Process SMT Process Specification Recommendations SOM weight approx. 8g Placement Nozzle 0>15 mm vacuum Nozzle Pick Surface PnP cap center Speed Slowest speed for the machine Placement Sequence...
- Page 10 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) Profile Feature Pb-Free Assembly Liquidus temperature (TL) 217°C Time (tL) maintained above TL 60-150 seconds Peak Package Body Temperature For users: Tp must not exceed the classification temperature in Table 4-2. ...
- Page 11 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) 5 Classification Profile (J-STD-020E, Figure 5-1, Page 8) 1. Revision December 2014...
- Page 12 Soldering Guide - i.MX 8M Plus Fused Tin Grid Array (FTGA) Information (LAN-112e.A0) Revision History Version Changes Date LAN-112e.A0 Preliminary Edition 12.12.2022...
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