Infineon AIROC CYBT-423054-02 Instruction Manual
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Infineon AIROC CYBT-423054-02 Instruction Manual

Bluetooth & bluetooth low energy module
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CYBT-423054-02/CYBT-423060-02
A I R O C ™ B l u etooth ® & B l u etooth ® Low
E n e rg y m o d u l e

General description

The Infineon AIROC™ CYBT-423054-02/CYBT-423060-02 are dual-mode Bluetooth® BR/EDR and low energy
wireless module solutions. CYBT-423054-02 include onboard crystal oscillators, passive components, and
CYW20719 silicon device. CYBT-423060-02 includes onboard crystal oscillators, passive components, and
CYW20721 silicon device.
CYBT-4230xx-02 supports a number of peripheral functions (ADC, PWM), as well as multiple serial communication
protocols (UART, SPI, I
compatible with Bluetooth® 5.0 in a small 11.0 × 11.0 × 1.70 mm module form-factor.
CYBT-4230xx-02 includes an integrated chip antenna, is qualified by Bluetooth® SIG, and includes regulatory
certification approval for FCC, ISED, MIC, and CE.

Features

CYBT-4230xx-02 is fully integrated and certified solution that provides all necessary components required to
operate Bluetooth® communication standards:
• Proven hardware design ready to use
• Ultra-flexible supermux I/O designs allows maximum flexibility for GPIO function assignment
• Large nonvolatile memory for complex application development
• Over-the-Air (OTA) update capable for development or field updates
• Bluetooth® SIG qualified with QDID and declaration ID
• ModusToolbox™ provides an easy-to-use integrated design environment (IDE) to configure, develop, program,
and test your Bluetooth® application
• Module description
- Module size: 11.00 mm × 11.00 mm × 1.70 mm
- Complies with Bluetooth® Core specification version 5.0 and includes support for BR, EDR 2/3 Mbps, eSCO,
Bluetooth® LE, and LE 2 Mbps features.
• QDID:
152533
• Declaration ID:
- Certified to FCC, ISED, MIC, and CE standards
- 1024-KB flash memory, 512-KB SRAM memory
- Industrial temperature range: –30 °C to +85 °C
- Integrated Arm® Cortex®-M4 microprocessor core with floating point unit (FPU)
• RF characteristics
- Maximum TX output power: +4.0 dbm
- RX receive sensitivity: –95.5 dbm
- Received signal strength indicator (RSSI) with 1-dB resolution
• Power consumption
- TX current consumption
• Bluetooth® silicon: 5.6 mA (MCU + radio only, 0 dbm)
- RX current consumption
• Bluetooth® silicon: 5.9 mA (MCU + radio only)
- CYW20719/21 silicon Low-power mode support
• PDS: 6.1 µA with 512 KB SRAM retention
• SDS: 1.6 µA
• HIDOFF (external interrupt): 400 nA
Datasheet
www.infineon.com
Arrow.com.
Downloaded from
2
2
C, I
S/PCM). CYBT-4230xx-02 includes a royalty-free Bluetooth® Low Energy stack
D050854
Please read the Important Notice and Warnings at the end of this document
page 1 of 55
002-30912 Rev. *C
2024-03-12

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Summary of Contents for Infineon AIROC CYBT-423054-02

  • Page 1: General Description

    E n e rg y m o d u l e General description The Infineon AIROC™ CYBT-423054-02/CYBT-423060-02 are dual-mode Bluetooth® BR/EDR and low energy wireless module solutions. CYBT-423054-02 include onboard crystal oscillators, passive components, and CYW20719 silicon device. CYBT-423060-02 includes onboard crystal oscillators, passive components, and CYW20721 silicon device.
  • Page 2 AIROC™ Bluetooth® & Bluetooth® Low Energy module Features • Functional capabilities - 1x ADC with (10-bit ENoB for DC measurement and 12-bit ENoB for Audio measurement) with eleven channels - 1x HCI UART for programming and HCI - 1x peripheral UART (PUART) - 2x SPI (master or slave mode) blocks (SPI, Quad SPI, and MIPI DBI-C) - 1x I C master/slave and 1x I...

  • Page 3: Table Of Contents

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Table of contents Table of contents General description ...........................1 Features ............................1 Table of contents ..........................3 1 Overview ............................5 1.1 Functional block diagram............................5 1.2 Development environments...........................5 2 Module description .........................6 2.1 Module dimensions and drawing...........................6 3 Pad connection interface.........................8 4 Recommended host PCB layout......................10 5 Module connections ........................13...
  • Page 4 AIROC™ Bluetooth® & Bluetooth® Low Energy module Table of contents 15.3 I2C compatible interface timing.........................41 16 Environmental specifications.......................44 16.1 Environmental compliance ..........................44 16.2 RF certification ..............................44 16.3 Safety certification..............................44 16.4 Environmental conditions..........................44 16.5 ESD and EMI protection ............................44 17 Regulatory information .......................45 17.1 FCC..................................45 17.2 ISED..................................46 17.3 European declaration of conformity........................47...

  • Page 5: Overview

    GPIOs available on CYBT-4230xx-02 is 17. Development environments ModusToolbox™ software is a modern, extensible development ecosystem supports a wide range of Infineon microcontroller devices, including PSoC™ Arm® Cortex® microcontrollers, TRAVEO™ T2G Arm® Cortex® microcon- troller, XMC™ industrial microcontrollers, AIROC™ Wi-Fi devices, AIROC™ Bluetooth® devices, and USB-C Power Delivery microcontrollers.

  • Page 6: Module Description

    CYBT-4230xx-02 module is a complete module designed to be soldered to the applications main board. Module dimensions and drawing Infineon reserves the right to select components from various vendors to achieve the Bluetooth® module functionality. Such selections will still guarantee that all mechanical specifications and module certifications are maintained.
  • Page 7 AIROC™ Bluetooth® & Bluetooth® Low Energy module Module description Top view Side view Bottom view (seen from bottom) Figure 2 Module mechanical drawing Note 1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located beneath the antenna area.

  • Page 8: Pad Connection Interface

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Pad connection interface Pad connection interface As shown in the bottom view of Figure 2, CYBT-4230xx-02 has 28 connections to a host board via solder pads (SP). Table 2 Figure 3 detail the solder pad length, width, and pitch dimensions of CYBT-4230xx-02 module. Table 2 Connection description Pad length...
  • Page 9 AIROC™ Bluetooth® & Bluetooth® Low Energy module Pad connection interface Optional host PCB keep out area around chip antenna (seen from bottom) Figure 4 Optional additional host PCB keep out area around CYBT-4230xx-02 chip antenna Datasheet 9 of 55 002-30912 Rev. *C 2024-03-12 Arrow.com.

  • Page 10: Recommended Host Pcb Layout

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Recommended host PCB layout Recommended host PCB layout Figure Figure Figure 7, and Table 3 provide details that can be used for the recommended host PCB layout pattern for CYBT-4230xx-02. Dimensions are in millimeters unless otherwise noted. Pad length of 1.11 mm (0.56 mm from center of the pad on either side) shown in Figure 7 is the minimum recommended host pad length.
  • Page 11 AIROC™ Bluetooth® & Bluetooth® Low Energy module Recommended host PCB layout Table 3 provides the center location for each solder pad on CYBT-4230xx-02. All dimensions are referenced to the center of the solder pad. See Figure 7 for the location of each module solder pad. Table 3 Module solder pad location Solder pad...
  • Page 12 AIROC™ Bluetooth® & Bluetooth® Low Energy module Recommended host PCB layout Top view (Seen on Host PCB) Figure 7 Solder pad reference location Datasheet 12 of 55 002-30912 Rev. *C 2024-03-12 Arrow.com. Downloaded from...

  • Page 13: Module Connections

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Module connections Module connections Table 4 details the solder pad connection definitions and available functions for each connection pad. The GPIO connections available on CYBT-4230xx-02 can be configured to any of the input or output functions listed in Table Table 4 specifies any function that is required to be used on a specific solder pad, and also identifies...
  • Page 14 AIROC™ Bluetooth® & Bluetooth® Low Energy module Module connections Table 5 details the available input and output functions that are configurable to any solder pad in Table 4 which are marked as SuperMux capable. Table 5 GPIO SuperMux input and output functions Function Input/output Function type...

  • Page 15: Connections And Optional External Components

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Module connections Connections and optional external components Power connections (VDD) CYBT-4230xx-02 contains one power supply connection, VDD. VDD accepts a supply input of 1.76 V to 3.63 V. Table 12 provides this specification. The maximum power supply ripple for this power connection is 100 mV, as shown in Table 5.2.1...

  • Page 16: External Reset (Xres)

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Module connections External reset (XRES) CYBT-4230xx-02 has an integrated POR circuit which completely resets all circuits to a known power on state. This action can also be invoked by an external reset signal, forcing it into a POR state. The XRES signal is an active-low signal, which is an input to CYBT-4230xx-02 module (solder pad 11).
  • Page 17 AIROC™ Bluetooth® & Bluetooth® Low Energy module Module connections Figure 9 illustrates CYBT-4230xx-02 schematic. MODULE MODULE CYBT-423028-02 CYW20719B1 TP10 CYBT-423054-02 CYW20719B2 TP28 CYBT-423060-02 CYW20721B2 XRES TP11 UART_CTS_N UART_RTS_N P13/P23/P28 UART_CTS_N P13/P23/P28 UART_CTS_N UART_RTS_N UART_RXD UART_RTS_N UART_TXD UART_TXD UART_RXD UART_TXD UART_RXD P34/P35/P36 P34/P35/P36 BT_VDDC...

  • Page 18: Critical Components List

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Module connections Critical components list Table 6 details the critical components used in CYBT-4230xx-02 module. Table 6 Critical component list Component Reference designator Description Silicon 40-pin QFN Bluetooth® silicon device - CYW20719/21 Chip antenna Antenna, 2.4 GHz Crystal 24 MHz, 8 pF...

  • Page 19: Bluetooth® Baseband Core

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Bluetooth® Baseband Core Bluetooth® Baseband Core The Bluetooth® baseband core (BBC) implements all time-critical functions required for high-performance Bluetooth® operation. The BBC manages the buffering, segmentation, and routing of data for all connections. It prioritizes and schedules all RX/TX activities including adv, paging, scanning, and servicing of connections.

  • Page 20: Power Management Unit (Pmu)

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Power management unit (PMU) Power management unit (PMU) Figure 10 shows the CYW20719/21 PMU block diagram. The CYW20719/21 includes an integrated buck regulator, a bypass LDO, a capless LDO for digital circuits and a separate LDO for RF. The bypass LDO automatically takes over from the buck once V supply falls below 2.1 V.

  • Page 21: Integrated Radio Transceiver

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Integrated radio transceiver Integrated radio transceiver CYBT-4230xx-02 has an integrated radio transceiver that has been designed to provide low power operation in the globally available 2.4 GHz unlicensed ISM band. It is fully compliant with Bluetooth radio specification 3.0 ®...

  • Page 22: Microcontroller Unit

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Microcontroller unit Microcontroller unit CYBT-4230xx-02 includes a Arm® Cortex®-M4 processor with 2 MB of ROM, 448 KB of data RAM, 64 KB of patch RAM, and 1 MB of on-chip flash. The CM4 has a maximum speed of 96 MHz. CYBT-4230xx-02 supports execution from on-chip flash (OCF).

  • Page 23: Peripheral And Communication Interfaces

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Peripheral and communication interfaces Peripheral and communication interfaces 10.1 CYBT-4230xx-02 provides a 2-pin I C compatible master interface to communicate with I C compatible periph- erals. The following transfer clock rates are supported: •...

  • Page 24: 32-Khz Crystal Oscillator

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Peripheral and communication interfaces 10.5 32-kHz crystal oscillator CYBT-4230xx-02 utilizes the built-in local oscillator (LO) on the CYW20719/21 silicon device for 32-kHz timing. The accuracy of the LO is ±500 ppm. The use of an external XTAL oscillator is optional. CYBT-4230xx-02 includes external XTAL oscillator connections for applications requiring higher timing accuracy.

  • Page 25: Adc Port

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Peripheral and communication interfaces 10.6 ADC port The ADC is a - ADC core designed for audio (13 bits) and DC (10 bits) measurement. It operates at 12 MHz and has 11 solder pad connections that can act as input channels. The internal bandgap reference has ±5% accuracy without calibration.

  • Page 26: Pwm

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Peripheral and communication interfaces 10.8 CYBT-4230xx-02 has six internal PWMs, labeled PWM0-5. The PWM module consists of the following: • Each of the six PWM channels contains the following registers: - 16-bit initial value register (read/write) - 16-bit toggle register (read/write) - 16-bit PWM counter value register (read) •...

  • Page 27: I2S Interface

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Peripheral and communication interfaces 10.10 S interface CYBT-4230xx-02 supports a single I S digital audio port. with both master and slave modes. The I S signals are: • I S clock: I S SCK •...

  • Page 28: Security Engine

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Peripheral and communication interfaces 10.11.4 Burst PCM mode In this mode of operation, the PCM bus runs at a significantly higher rate of operation to allow the host to duty cycle its operation and save current. In this mode of operation, the PCM bus can operate at a rate of up to 24 MHz. This mode of operation is initiated with an HCI command from the host.

  • Page 29: Power Modes

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Power modes Power modes CYBT-4230xx-02 support the following HW power modes are supported: • Active mode - Normal operating mode in which all peripherals are available and the CPU is active. • Idle mode - In this mode, the CPU is in “Wait for Interrupt” (WFI) and the HCLK, which is the high frequency clock derived from the main crystal oscillator is running at a lower clock speed.

  • Page 30: Firmware

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Firmware Firmware CYBT-4230xx-02 ROM firmware runs on a real time operating system and handles the programming and configu- ration of all on-chip hardware functions as well as the BT/LE baseband, LM, HCI, GATT, ATT, L2CAP and SDP layers. The ROM also includes drivers for on-chip peripherals as well as handling on-chip power management functions including transitions between different power modes.

  • Page 31: Electrical Characteristics

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Electrical characteristics Electrical characteristics The absolute maximum ratings in the following table indicate levels where permanent damage to the device can occur, even if these limits are exceeded for only a brief duration. The Functional operation is not guaranteed under these conditions.
  • Page 32 AIROC™ Bluetooth® & Bluetooth® Low Energy module Electrical characteristics Table 14 Bluetooth , Bluetooth LE, BR, and EDR Current Consumption ® ® Silicon or Module Parameter Description Parameter Unit 48 MHz with pause Silicon 48 MHz without pause Silicon Continuous RX Silicon Continuous TX - 0 dBm Silicon...

  • Page 33: Core Buck Regulator

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Electrical characteristics 13.1 Core buck regulator Table 15 Silicon core buck regulator Parameter Conditions Unit Input supply voltage DC, V DC voltage range inclusive of distur- 1.90 3.63 bances CBUCK output current LPOM only –...

  • Page 34: Digital Ldo

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Electrical characteristics 13.2 Digital LDO Table 16 Digital LDO Parameter Conditions Min. Typ. Max. Unit Input supply voltage, V Minimum V = Vo + 0.12 V requirement must be met under maximum load. Nominal output voltage, Vo Internal default setting –...

  • Page 35: Adc Electrical Characteristics

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Electrical characteristics 13.4 ADC electrical characteristics Table 18 Electrical characteristics Parameter Symbol Conditions/Comments Unit Current consumption – – Power down current – At room temperature – – µA ADC Core Specification ADC reference voltage From BG with ±3% accuracy –...

  • Page 36: Chipset Rf Specifications

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Chipset RF specifications Chipset RF specifications Table 19 Table 20 apply to single-ended industrial temperatures. Unused inputs are left open. Table 19 Chipset receiver RF specifications Parameter Mode and conditions Unit Frequency range –...
  • Page 37 AIROC™ Bluetooth® & Bluetooth® Low Energy module Chipset RF specifications Table 20 Chipset transmitter RF specifications Parameter Unit Transmitter section Frequency range 2402 – 2480 Class 2: GFSK TX power – – Class 2: EDR TX power – – 20 dB bandwidth –...
  • Page 38 AIROC™ Bluetooth® & Bluetooth® Low Energy module Chipset RF specifications Table 21 Bluetooth® LE RF specifications Parameter Conditions Frequency range 2402 – 2480 [11] [12] RX sensitivity (QFN) LE GFSK, 0.1% BER, 1 Mbps – –95.0 – [11] [12] RX sensitivity (WLCSP) LE GFSK, 0.1% BER, 1 Mbps –...

  • Page 39: Timing And Ac Characteristics

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Timing and AC characteristics Timing and AC characteristics In this section, use the numbers listed in the reference column of each table to interpret the following timing diagrams. 15.1 UART timing Table 23 UART timing specifications Reference Characteristics Unit...
  • Page 40 AIROC™ Bluetooth® & Bluetooth® Low Energy module Timing and AC characteristics Figure 15 SPI timing, Mode 0 and 2 Table 25 Figure 16 show the timing requirements when operating in SPI mode 1 and 3. Table 25 SPI mode 1 and 3 Reference Characteristics Time from master assert SPI_CSN to first clock edge –...

  • Page 41: I2C Compatible Interface Timing

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Timing and AC characteristics 15.3 C compatible interface timing The specifications in Table 26 references Figure Table 26 compatible interface timing specifications (up to 1 MHz) Reference Characteristics Unit Clock frequency – 1000 START condition setup time –...
  • Page 42 AIROC™ Bluetooth® & Bluetooth® Low Energy module Timing and AC characteristics Table 27 Timing for I S transmitters and receivers Transmitter Receiver Lower limit Upper limit Lower limit Upper limit Parameter Notes [16] Clock Period T – – – – –...
  • Page 43 AIROC™ Bluetooth® & Bluetooth® Low Energy module Timing and AC characteristics Figure 18 S transmitter timing Figure 19 S receiver timing Datasheet 43 of 55 002-30912 Rev. *C 2024-03-12 Arrow.com. Downloaded from...

  • Page 44: Environmental Specifications

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Environmental specifications Environmental specifications 16.1 Environmental compliance This Bluetooth LE module is produced in compliance with the Restriction of Hazardous Substances (RoHS) and ® Halogen-Free (HF) directives. The module and components used to produce this module are RoHS and HF compliant.

  • Page 45: Regulatory Information

    The original equipment manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP3028.

  • Page 46: Ised

    The original equipment manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon IC identifier for this product as well as the ISED Notices above. The IC identifier is 7922A-3028. In any case, the end product must be labeled in its exterior with "Contains IC: 7922A-3028".

  • Page 47: European Declaration Of Conformity

    Le fabricant d'équipement d'origine (OEM) doit s'assurer que les exigences d'étiquetage ISED sont respectées. Cela comprend une étiquette clairement visible à l'extérieur de l'enceinte OEM spécifiant l'identifiant Infineon IC approprié pour ce produit ainsi que l'avis ISED ci-dessus. L'identificateur IC est 7922A-3028. En tout cas, le produit final doit être étiqueté...

  • Page 48: Packaging

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Packaging Packaging Table 29 Solder reflow peak temperature Module part Package Maximum peak Maximum time at peak Maximum no. number temperature temperature of cycles CYBT-423054-02 28-pad SMT 260 °C 30 s CYBT-423060-02 28-pad SMT 260 °C 30 s Table 30...
  • Page 49 AIROC™ Bluetooth® & Bluetooth® Low Energy module Packaging Figure 22 details reel dimensions used for CYBT-4230xx-02. Figure 22 Reel dimensions CYBT-4230xx-02 is designed to be used with pick-and-place equipment in an SMT manufacturing environment. The center-of-mass for CYBT-4230xx-02 is detailed in Figure Top view (seen from top) Figure 23...

  • Page 50: Ordering Information

    Order increment (OI) – – CYBT-4230xx-02 is offered in tape and reel packaging. CYBT-4230xx-02 ships in a reel size of 500 units. For additional information and a complete list of Infineon’s Bluetooth products, contact your local Infineon sales representative. Visit Infineon ®...

  • Page 51: Acronyms

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Acronyms Acronyms Table 33 Acronyms used in this document Acronym Description Bluetooth® LE Bluetooth® Low Energy Bluetooth® SIG Bluetooth Special Interest Group ® European Conformity Canadian Standards Association electromagnetic interference electrostatic discharge Federal Communications Commission GPIO general-purpose input/output ISED...

  • Page 52: Document Conventions

    AIROC™ Bluetooth® & Bluetooth® Low Energy module Document conventions Document conventions 21.1 Units of measure Table 34 Units of measure Symbol Unit of Measure °C degree celsius kilovolt milliamperes millimeters millivolt  A microamperes  m micrometers megahertz gigahertz volt Datasheet 52 of 55 002-30912 Rev.

  • Page 53: References

    - Queries on Bluetooth® LE qualification and declaration processes • Technical support - Visit Infineon community the developer community offers you a place to learn, share, and engage with both Infineon experts and other embedded engineers around the world. Visit our support page and contact a local sales representatives.

  • Page 54: Revision History

    Replaced “Bluetooth Low Energy (BLE)” with “Bluetooth Low Energy” in all instances across the document. Replaced “BLE” with “Bluetooth LE” in all instances across the document. 2022-02-18 Updated to Infineon template. Updated HCI UART connections 2024-03-12 Updated trace antenna to chip antenna.
  • Page 55 All referenced product or service names and trademarks are the property of their respective owners. The Bluetooth® word mark and logos are registered trademarks owned by Bluetooth SIG, Inc., and any use of such marks by Infineon is under license.

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