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molex Pico-Lock Application Specification

2.0mm pitch w/b conn. h-2.6mm r/a type
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Pico-Lock 2.0mm PITCH W/B CONN. H=2.6mm R/A TYPE
【1.APPLICATION】
HARNESS SIDE
BOARD SIDE
Structure
RECEPTACLE HOUSING
205341 series
HEADER ASSEMBLY
205338 series
― Before using ―
・
Be sure to read the following precautions before using connector.
・
Keep this manual handy for later reference.
・
The displays and illustrations shown in this manual are for illustrative purposes only, and may differ
somewhat from the actual items they represent.
・
The contents of this manual are subject to change without notice.
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REVISION
DESCRIPTION
CHANGE NO.
770830
REVISED BY
TOMOMY
REV APPR BY
AIDA
INITIAL RELEASE
INITIAL DRWN
QHE31
INITIAL APPR
KOMURAKAMI
PROCEDURE: 2090580010-ES
PRODUCT APPLICATION SPECIFICATION
APPLICATION SPECIFICATION
This application specification is written in English and Japanese.
本取扱説明書は、英文および和文で記載されております。
Japanese 和文: Page 26~50
RECEPTACLE HOUSING
RECEPTACLE TERMINAL
APPLICABLE WIRE(※)
HEADER ASSEMBLY
※Please refer to Application Tooling Specification (ATS) for further details.
DATE
2023/11/14
DOC TYPE
DATE
2024/01/31
DATE
2020/01/09
DATE
2020/02/19
TEMPLATE: 2090580010-PAS-A4
English 英文: Page 1~25
Product Name
2053425028
2053425128
R/A TYPE
PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT
GOLD PLATING APPLICATION SPECIFICATION
DOC TYPE DESCRIPTION
PS
APPLICATION SPECIFICATION WORD
CUSTOMER
REVISION: A1
Part Number
205341 series
PKG : Poly Bag
205342 series
PKG : Reel
AWG#20～22
AWG#24～26
205338 series
PKG : Embossed Reel
APPLICABLE WIRE
AWG#20-26
RECEPTACLE TERMINAL
205342 series
DOCUMENT NUMBER
2053410000-AS
DOC PART
SERIES
000
205341
REVISION
SHEET
B
1
50
OF

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Summary of Contents for molex Pico-Lock

  • Page 1 ・ The contents of this manual are subject to change without notice. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 2: Table Of Contents

    9-2．Un-mating process method ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-23 9-3．Consideration after mating ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-24～25 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 3: Product Exterior

    ⑥ This product should be inspected for appearance and solder performance when used after expiration date. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 4: Harness Process And Surface Mount Process Instruction

    ⑰ Please do not stack PCB after connector has been soldered to PCB. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 5: About Use In The Machinery

    ⑧ Plastic lances can be damaged after removing crimp terminals. Without fail please use a new crimp housing when repairing a connector. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 6: About Rating / A Performance Standard

    ③ Please avoid using outside the room or under similar environment. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 7: 3．The Name Of Each Part & Explanation

    Fastener part with Rec housing ※ Please refer to sales drawing for product form and its dimensions. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 8: Receptacle Housing

    Movement for releasing lock is needed. ※ Please refer to sales drawing for product form and its dimensions. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 9: Header Assembly

    Solder area ※ Please refer to sales drawing for product form and its dimensions. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 10: 4．The Confirmation Item Of Crimping Wire

    This makes difficult to insert the terminal into the housing and may cause terminal butting, decrease of terminal retention force or contact failure. × No Good THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 11 Good × No Good × No Good THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 12 This makes difficult to insert the terminal into the housing and may cause contact failure. × × No Good No Good THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 13 Fastener tension of the terminal become insufficient and causes the fall of the terminal retention -force. × No Good Transformation (smashed) THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 14: 5．Package For Over Crimping-Wire And Package

    (Prevention for entwined) Air-packing Packing box. Fig. 5-1 Fig. 5-2 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 15: 6．Harness Processing (Crimping Wire Insertion Method In Receptacle Housing)

    (with force of around 1.6～2.4N). (Fig.6-1) Terminal insertion direction Fig. 6-1 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...
  • Page 16 Rotated direction（e.g.：90°） Having angle direction Fig.6-3 Inappropriate insertion direction THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 17 In this case, please be sure to change new terminal. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 18: Repair Of Crimp Terminal

    Jig sharp something like needle ① ② Fig.6-6 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 19: 7．Banding Of Harness

    ※Please do not drop the product or hit it against other things. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 20: 8．Harness Packaging

    Fig.8-1 1bunch of harness THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 21 【② Packing situation side】 【① Packing situation upside】 Fig.8-2 Packing situation THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 22: Mating Process Method

    ※ If you cannot insert smoothly, please insert again after confirming transformation of terminal and receptacle housing etc. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 23: Un-Mating Process Method

    ※When releasing lock, please push bar for releasing lock with flat part of finger not only fingertip (nail tip). If nail is long, nail might catch lock protection wall. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...

  • Page 24: Consideration After Mating

    ○ Fig.9-3-1 Condition wires are curved THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 25 Fig.9-3-2 Condition wires are bent excessively or tension is added × Fig.9-3-3 Pulling around wires toward more than 2 direction. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT...
  • Page 26 ・本コネクタを御使用頂く前に必ず御一読頂き十分に理解した上、正しくご使用ください。 ・本書はいつでも参照できるように、お手元に大切に保管してください。 ・本書中の表示及びイラストは印刷の為、実物と異なることが御座います。 ・本書の内容に関しては、予告無しに変更する場合が御座います。 ・本書の内容については、万全を期して作成致しておりますが、万が一御不審な点や誤りなど、お気付き のことが御座いましたら弊社担当まで御連絡ください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 27 9．基板側コネクタとの嵌合時に於ける注意事項 9-1．推奨挿入方法 ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-47 9-2．推奨抜去方法 ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-48 9-3．嵌合後の電線の引き回しについて ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-49～50 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 28: 製品外観について

    在庫品は先入れ・先出しを実施してください。 ⑤ 使用前まで弊社実施の梱包形態を維持してください。 ⑥ 推奨保管条件での保管をお願いします。推奨保管条件を超えた場合は外観、はんだ付け性を確認の上ご 使用ください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 29: ハーネス及び実装作業時に於ける注意事項

    されます。従って全てのソルダーテールにはんだ付けを行ってください。 ⑮ 弊社の推奨基板パターン寸法を変更して設計を行なう際は、致命的な不良の原因にもなりますのであらか じめご相談ください。 ⑯ コネクタ嵌合状態で基板の持ち運び等コネクタに負荷が掛かる作業は行わないようにしてください。コネク タ破損等の原因となる場合が御座います。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 30: 機器内での使用について

    無理な外力が加わらないように、電線に緩みを持たせ、余裕を持たせる処置をしてください。 ⑦ コネクタの嵌合を取り外す際は、必ずロックを解除して行ってください。 電線はまとめて軽く掴み、指全体で確実にロックを解除し、取り出してください。 ⑧ 治具等を使用し、圧着端子を抜いた場合には、ランスが変形し強度が低下し端子を再装着後の端子保持 力が低下します。そのため、圧着端子のリペアの際に新しいハウジングを必ず使用してください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 31: 定格・性能規格について

    計、製造されたものではありません。本製品を医療用、航空宇宙用、原子力等の特殊用途への組込みの 御使用については当社に確認の上、御使用ください。 ② 自動車、船舶等への御使用を検討される場合は、必ず事前に御連絡ください。(仕様条件によって使用可 能であるか検討させて頂きます。) ③ 室外またはそれに相当する環境下での御使用は避けてください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 32: リセプタクルターミナル（圧着端子）各部の名称及び機能

    電気的接続を行う部分 ランス ハウジングから端子が 抜けないようにする部分 ※ 製品形状及び寸法については弊社製品図面を参照願います。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 33 部分 嵌合後、偶発的に抜けないように するためのロック機構。 抜去時にロック解除動作を必要とする ※ 製品形状及び寸法については弊社製品図面を参照願います。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 34 ネール 基板との実装強度を向上させるための部品 テール はんだ付け部 ※ 製品形状及び寸法については弊社製品図面を参照願います。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 35: 圧着前の外観確認項目

    意願います。 ① ベンドアップ ハウジングへの挿入性及び保持力の低下、また電気的に接触しないなどの接触信頼性低下の原因となります。 × 不可 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 36 ○ 良好 × 不可 × 不可 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 37: Revised By Tomomy Date 2023/11/14

    ⑥ 芯線はみだし ハウジングへの挿入時に於ける作業性の低下、接触信頼性の低下の原因となります。 × × 不可 不可 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 38 ⑨ ターミナルランスの変形（潰れなど） ハウジングの係止が不十分となり保持力の低下の原因となります。 × 不可 変形（潰れ） THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 39 緩衝材（エアパッキン 等） 梱包箱 Fig. 5-1 Fig. 5-2 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 40: 圧着端子装着について

    使用前に御確認ください。 ③ 端子ランス部が、リセプタクル ハウジングの中央に向かうように持ち、端子が突き当たる位置まで （1.6～2.4N 程度の力で）ゆっくりと真っ直ぐ装着してください。（Fig.6-1） Fig. 6-1 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 41 × × 回転方向（例：90°） 斜め方向 Fig.6-3 不適切な装着方向 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 42 ※モールドランスが正規の位置に戻っていない箇所（不完全装着状態：Fig.6-5 参照）では、 モールドランスが最も変形している状態です。そのため、この状態のハーネス品は、端子を 再挿入したとしても、モールドランスが変形し、正規の位置に戻らず、保持力が低下する場合が 御座います。 このような場合は、必ずリセプタクルハウジングを取り替えて頂くよう、お願い致します。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 43: 圧着端子のリペアについて

    ※端子を無理に引き抜くことは、必ず避けてください。 ※リペアの際、端子のランス部の変形や傷を付けないように御注意ください。 ① 針金などの冶具 ② Fig.6-6 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 44 Fig.7-2 不適切なハーネス結束状態 注意事項 ※ハーネス品同士が絡まっている場合、無理に引っ張らないでください。 過度な力が加わり端子が抜ける等の不具合が生じ、コネクタが破損する場合があります。 ※製品を落としたり、他のものにぶつけたりしないでください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 45 る性能不良の原因となります。 コネクタ エアパッキン ビニール紐で中央部を束ねる Fig.8-1 ハーネス加工品一束の状態図 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 46 緩衝材 【① 梱包状態 上面】 【② 梱包状態 側面】 Fig.8-2 梱包状態図 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 47: 推奨挿入方法

    に斜め状態を維持させて、ゆっくり挿入させた場合、弾性力のあるリセプタクルハウジングは変形しながら挿入 されるため、片側しかロックされない状態を作り出す場合が御座います。 （特に多極品の場合） ※スムーズに挿入できない場合は、端子やリセプタクル ハウジングの変形などを確認して、嵌合方向マークを確 認した上でもう一度挿入してください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 48: 推奨抜去方法

    ロックが突き当たるまで押し込む 注意事項 ※特定の数本のみ電線を摘んで抜去しないでください。 限定された端子に過度な負荷が集中し、コネクタの破損及び端子が抜ける可能性が御座います。 ※抜去時は、ロックを完全に解除してください。本製品は、コネクタの抜け防止をポジティブロックに依存している 構造となっております。ロックが完全に解除していない状態で、無理に抜こうとした場合コネクタが破損します。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.

  • Page 49: 嵌合後の電線の引き回しについて

    様に、たわみを持たせ る。 る。 ○ Fig.9-3-1 電線にたわみを持たせた状態 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.
  • Page 50 PRODUCT APPLICATION SPECIFICATION × Fig.9-3-2 電線を極端に曲げる又は、突っ張った状態 × Fig.9-3-3 2 方向以上での電線引き回し状態 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION PICO-LOCK 2.0 W/B SINGLE-ROW R/A SMT DESCRIPTION GOLD PLATING APPLICATION SPECIFICATION CHANGE NO.