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【1.APPLICATION】
HARNESS SIDE
BOARD SIDE
※Please refer to Application Tooling Specification(ATS) for further details.
Structure
RECEPTACLE TERMINAL
503765＊＊98
APPLICABLE WIRE
― Before using ―
・
Be sure to read the following precautions before using connector.
・
Keep this manual handy for later reference.
・
The displays and illustrations shown in this manual are for illustrative purposes only, and may differ
somewhat from the actual items they represent.
・
The contents of this manual are subject to change without notice.
・
In case there are any questions or comments regarding the contents, please feel free to contact us.
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REVISION
REVISED
DESCRIPTION
CHANGE NO.
640538
REVISED BY
QHE31
REV APPR BY
KOMURAKAMI
INITIAL RELEASE
INITIAL DRWN
TYAJIMA01
INITIAL APPR
NUKITA
TEMPLATE: 2090580003-PPS-A4
APPLICATION SPECIFICATION
Pico-Lock 1.0
This application specification is written in English and Japanese.
本取扱説明書は、英文および和文で記載されております。
Japanese 和文: Page 26~50
Product Name
RECEPTACLE HOUSING
RECEPTACLE TERMINAL
APPLICABLE WIRE （※）
HEADER ASS'Y
DATE
2018/03/22
DOC TYPE
DATE
2020/07/07
DATE
2013/09/20
GENERAL MARKET
DATE
2013/09/27
Rev A2
2020 / 04 / 05
PRODUCT SPECIFICATION
English 英文: Page 1~25
503765 series
R/A TYPE
APPLICATION SPECIFICATION FOR
PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING
DOC TYPE DESCRIPTION
PS
ENGINEERING SPECIFICATION WORD
CUSTOMER
Part Number
503764 series
PKG : Plastic Bag
503765 series
PKG : Reel
AWG#28～30
503763 series
PKG : EMBOSS Tape Package
HEADER ASS'Y
503763＊＊＊＊
RECEPTACLE HOUSING
503764＊＊＊＊
DOCUMENT NUMBER
AS-503764-001
DOC PART
SERIES
001
503764
REVISION
SHEET
B
1
51
OF
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Related Manuals for molex Pico-Lock 1.0
Summary of Contents for molex Pico-Lock 1.0
- Page 1 ・ In case there are any questions or comments regarding the contents, please feel free to contact us. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED...
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Page 2: Table Of Contents
P-22 9-2．Un-mating process method ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-23 9-3．Consideration after mating ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-24～25 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO. -
Page 3: Product Exterior
⑤ Keep product in original packaging before using. ⑥ This product should be inspected for appearance and solder performance when used after expiration date. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED... -
Page 4: Harness Process And Surface Mount Process Instruction
⑰ Please do not stack PCB after connector has been soldered to PCB. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION... -
Page 5: About Use In The Machinery
④ In order to avoid short circuits, please do not allow connectors to contact metal objects. ⑤ Current more than the rated amount should not be used. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION... -
Page 6: About For Use
③ Please avoid using outside the room or under similar environment. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION... -
Page 7: 3．The Name Of Each Part & Explanation
Fastener part with Rec. housing ※ Please refer to sales drawing (5037650000-SD PSD 000) for product form and its dimensions. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION... -
Page 8: Receptacle Housing
Movement for releasing lock is needed. ※ Please refer to sales drawing (5037640000-SD PSD 000) for product form and its dimensions. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION... -
Page 9: Header Assembly
Nail Solder area ※ Please refer to sales drawing (5037630000-SD PSD 000) for product form and its dimensions. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED... -
Page 10: 4．The Confirmation Item Of Crimping Wire
This makes difficult to insert the terminal into the housing and may cause terminal butting, decrease of terminal retention force or contact failure. × No Good THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING... - Page 11 Good × No Good × No Good THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 12 This makes difficult to insert the terminal into the housing and may cause contact failure. No Good No Good THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED...
- Page 13 Fastener tension of the terminal become insufficient and causes the fall of the terminal retention - force. × No Good Transformation（smashed） THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING...
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Page 14: 5．Package For Over Crimping-Wire And Package
Packing box. Fig. 5-2 Fig. 5-1 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO. -
Page 15: 6．Harness Processing (Crimping Wire Insertion Method In Receptacle Housing)
(with force of around 1.6～2.4N).（Fig.6-1） Terminal insertion direction Fig. 6-1 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED... - Page 16 × Having angle direction Rotated direction（e.g.：90°） Fig.6-3 Inappropriate insertion direction THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 17 In this case, please be sure to change new terminal. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION...
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Page 18: Repair Of Crimp Terminal
※When repairing, please be careful not to transform or scratch terminal lance. Jig sharp something like needle ① ② THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING... -
Page 19: 7．Banding Of Harness
※Please do not drop the product or hit it against other things. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED... - Page 20 Fig.8-1 1bunch of harness THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING...
- Page 21 1 bunch banded bubble wrap 【② Packing situation side】 【① Packing situation upside】 Fig.8-2 Packing situation THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING...
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Page 22: 9．Instruction When Mating With Hdr Connector
※If you can not insert smoothly, please insert again after confirming transformation of terminal and receptacle housing etc. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED... -
Page 23: Un-Mating Process Method
※When releasing lock, Please push bar for releasing lock with flat part of finger not only fingertip(nail tip). If nail is long, nail might catch lock protection wall. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION... -
Page 24: Consideration After Mating
○ Fig.9-3-1 Condition wires are curved THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO. - Page 25 Condition wires are bent excessively or tension is added × Fig.9-3-3 Pulling around wires toward more than 2 direction. THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED...
- Page 26 ・本コネクタを御使用頂く前に必ず御一読頂き十分に理解した上、正しくご使用ください。 ・本書はいつでも参照できるように、お手元に大切に保管してください。 ・本書中の表示及びイラストは印刷の為、実物と異なることが御座います。 ・本書の内容に関しては、予告無しに変更する場合が御座います。 ・本書の内容については、万全を期して作成致しておりますが、万が一御不審な点や誤りなど、お気付きのことが御 座いましたら弊社担当まで御連絡ください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 27 9．基板側コネクタとの嵌合時に於ける注意事項 9-1．推奨挿入方法 ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-47 9-2．推奨抜去方法 ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-48 9-3．嵌合後の電線の引き回しについて ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ P-49～50 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
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Page 28: Revised By Qhe31 Date 2018/03/22
み、変形等の原因となります。 ④ 在庫品は先入れ・先出しを実施してください。 ⑤ 使用前まで弊社実施の梱包形態を維持してください。 ⑥ 推奨保管条件での保管をお願いします。推奨保管条件を超えた場合は外観、半田付け性を確認の上ご 使用ください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO. - Page 29 ⑮ 弊社の推奨基板パターン寸法を変更して設計を行なう際は、致命的な不良の原因にもなりますのであ らかじめご相談ください。 ⑯ コネクタ嵌合状態で基板の持ち運び等コネクタに負荷が掛かる作業は行わないようにしてください。 コネクタ破損等の原因となる場合が御座います。 ⑰ 基板実装後に基板を直接積み重ねない様に注意してください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 30 ⑦ 電線はまとめて軽く掴み、指全体で確実にロックを解除し、取り出してください。 ⑧ 治具等を使用し、圧着端子を抜いた場合には、ランスが変形し強度が低下し端子を再装着後の端子保 持力が低下します。そのため、圧着端子のリペアの際には新しいハウジングを必ず使用してくださ い。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 31 して設計、製造されたものではありません。本製品を医療用、航空宇宙用、原子力等の特殊用途への 組込みの御使用については当社に確認の上、御使用ください。 ② 自動車、船舶等への御使用を検討される場合は、必ず事前に御連絡ください。(仕様条件によって使 用可能であるか検討させて頂きます。) ③ 室外またはそれに相当する環境下での御使用は避けてください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 32 電気的接続を行う部分 ランス ハウジングから端子が 抜けないようにする部分 ※ 製品形状及び寸法については弊社製品図面 5037650000-SD PSD 000 を参照願います。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 33 モールドランス のロック機構。 ハウジングから端子を抜けないように引っ掛ける部分 抜去時にロック解除動作を必要とする ※ 製品形状及び寸法については弊社製品図面 5037640000-SD PSD 000 を参照願います。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 34 端子 嵌合相手と電気的接続をするための部品 ネール 半田付け部 ※ 製品形状及び寸法については弊社製品図面 5037630000-SD PSD 000 を参照願います。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 35 御注意願います。 ① ベンドアップ ハウジングへの挿入性及び保持力の低下、また電気的に接触しないなどの接触信頼性低下の原因となり ます。 × 不可 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 36 ○ 良好 × 不可 × 不可 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 37 ⑥ 芯線はみだし ハウジングへの挿入時に於ける作業性の低下、接触信頼性の低下の原因となります。 × × 不可 不可 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 38 不可 ⑨ ターミナルランスの変形（潰れなど） ハウジングの係止が不十分となり保持力の低下の原因となります。 × 不可 変形（潰れ） THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 39 保護してください。 梱包 箱 Fig. 5-2 Fig. 5-1 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 40 使用前に御確認ください。 ③ 端子ランス部が、リセプタクル ハウジングの中央に向かうように持ち、端子が突き当たる位置ま で （1.6～2.4N 程度の力で）ゆっくりと真っ直ぐ装着してください。（Fig.6-1） Fig. 6-1 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 41 上下逆方向 × × 回転方向（例：90°） 斜め方向 Fig.6-3 不適切な装着方向 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 42 ※モールドランスが正規の位置に戻っていない箇所（不完全装着状態：Fig.6-5 参照）では、 モールドランスが最も変形している状態です。そのため、この状態のハーネス品は、端子を 再挿入したとしても、モールドランスが変形し、正規の位置に戻らず、保持力が低下する場合が 御座います。 このような場合は、必ずリセプタクル ハウジングを取り替えて頂くよう、お願い致します。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 43 また、拡大鏡等を使うなどして、十分御注意の上、作業を行ってください。 ※端子を無理に引き抜くことは、必ず避けてください。 ※リペアの際、端子のランス部の変形や傷を付けないように御注意ください。 針金などの冶具 ① ② THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 44 電線一本（又は特定の数本）に負荷が掛かる状態 Fig.7-2 不適切なハーネス結束状態 注意事項 ※ハーネス品同士が絡まっている場合、無理に引っ張らないでください。 過度な力が加わり端子が抜ける等の不具合が生じ、コネクタが破損する場合があります。 ※製品を落としたり、他のものにぶつけたりしないでください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 45 にした際、コネクタ同士が接触し、ロック部に負荷が加わる場合があります。 その場合、ロックが 常に下がった状態になることで、ロック部変形等による性能不良の原因となります。 コネクタ ビニール紐で中央部を束ねる エアパッキン Fig.8-1 ハーネス加工品一束の状態図 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 46 緩衝材 エアパッキン 【① 梱包状態 上面】 【② 梱包状態 側面】 Fig.8-2 梱包状態図 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 47 本製品は、嵌合間口を深く設定し、斜め挿入しても間口で矯正され、挿入されるようにしておりま すが、人為的に斜め状態を維持させて、ゆっくり挿入させた場合、弾性力のあるリセプタクルハウ ジングは変形しながら挿入されるため、片側しかロックされない状態を作り出す場合が御座いま す。（特に多極品の場合） ※スムーズに挿入できない場合は、端子やリセプタクル ハウジングの変形などを確認して、嵌合方向 マークを確認した上でもう一度挿入してください。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 48 注意事項 ※特定の数本のみ電線を摘んで抜去しないでください。 限定された端子に過度な負荷が集中し、コネクタの破損及び端子が抜ける可能性が御座います。 ※抜去時は、ロックを完全に解除してください。本製品は、コネクタの抜け防止をポジティブロック に依存している構造となっております。ロックが完全に解除していない状態で、無理に抜こうとし た場合コネクタが破損します。 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 49 端子に負荷が加わらない様 端子に負荷が加わらない様に、た に、たわみを持たせる。 わみを持たせる。 ○ Fig.9-3-1 電線にたわみを持たせた状態 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING 640538 CHANGE NO.
- Page 50 PRODUCT SPECIFICATION × Fig.9-3-2 電線を極端に曲げる又は、突っ張った状態 × Fig.9-3-3 2 方向以上での電線引き回し状態 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
- Page 51 K.ASAKAWA REVISED 2020/07/03 Q.HE S.AKIYAMA 640538 THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION REVISION REVISED APPLICATION SPECIFICATION FOR DESCRIPTION PICO-LOCK1.0 W/B SINGLE-ROW R/A SMT GOLD PLATING CHANGE NO.
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