Siemens IFP V2 UL Operating Manual page 34

Installing and connecting the device
3.5 Connecting the device
• Use equipotential bonding conductors made of copper or galvanized steel. Establish a
large surface contact between the equipotential bonding conductors and the
grounding/protective conductor and protect them from corrosion.
• Clamp the shield of the data cable from the device flush at the equipotential bonding rail
using suitable cable clamps. The equipotential bonding rail should be as close as possible
to the device.
• Route the equipotential bonding conductor and data cables in parallel and with minimum
clearance in between.
Note
Equipotential bonding cable
Cable shields are not suitable for equipotential bonding. Always use the prescribed
equipotential bonding conductors for this. An equipotential-bonding cable between control
cabinets must have a minimum conductor cross-section of 16 mm². The cable between the
ground bar and device must have a minimum conductor cross-section of 4 mm
Wiring diagram
The following figure shows the connection of the functional ground for the equipotential
bonding using IFP1500 V2 as an example and similarly applies to all Flat Panels and the
Transceiver Unit.
Note
Cable routing for PRO devices
As the PRO device is not installed in a control cabinet but on a pedestal or support arm, the
connecting cables must be routed through the support arm or the pedestal. The cable cross-
sections specified for the built-in devices also apply to the PRO devices.
Observe the corresponding connection diagrams in the Quick Install Guide supplied with your
PRO device.
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IFP V2 UL hazardous information
Operating Manual, 11/2023